JPH0442799U - - Google Patents
Info
- Publication number
- JPH0442799U JPH0442799U JP8509790U JP8509790U JPH0442799U JP H0442799 U JPH0442799 U JP H0442799U JP 8509790 U JP8509790 U JP 8509790U JP 8509790 U JP8509790 U JP 8509790U JP H0442799 U JPH0442799 U JP H0442799U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave filter
- electrical wiring
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000010897 surface acoustic wave method Methods 0.000 claims 7
- 238000009429 electrical wiring Methods 0.000 claims 5
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す上面図、第２
図はそのＡ−Ａ′線断面図、第３図はその本考案
の一実施例であるＳＡＷフイルタ取付構造へのＳ
ＡＷフイルタの取付状態を示す断面図である。第
４図は従来例へのＳＡＷフイルタの取付工程を概
略的に示す工程図である。第５図は従来例の上面
図である。
１……ＰＷＢ、２……半田ペースト、３……チ
ツプ部品、４……カンケース、５……ステム、６
……リード線、７……手半田付け部、８……アー
スパターン、９……挿入穴、１０……ＰＷＢ、２
０……アースパターン、３０……ソルダーレジス
ト、４０……半田付けパターン、５０……挿入穴
、７０……ステム、８０……カンケース、９０…
…絶縁部、１００……リード線、２００……ＳＡ
Ｗフイルタ。
Fig. 1 is a top view showing one embodiment of the present invention;
The figure is a cross-sectional view taken along the line A-A', and Figure 3 is an example of the SAW filter mounting structure of the present invention.
FIG. 3 is a cross-sectional view showing how the AW filter is attached. FIG. 4 is a process diagram schematically showing the process of attaching a SAW filter to a conventional example. FIG. 5 is a top view of a conventional example. 1... PWB, 2... Solder paste, 3... Chip parts, 4... Can case, 5... Stem, 6
... Lead wire, 7 ... Hand soldering part, 8 ... Earth pattern, 9 ... Insertion hole, 10 ... PWB, 2
0...Earth pattern, 30...Solder resist, 40...Soldering pattern, 50...Insertion hole, 70...Stem, 80...Can case, 90...
...Insulation part, 100...Lead wire, 200...SA
W filter.
Claims (1)
を取り付けるためのリード線挿入用の穴と、 を有するプリント配線基板から成る表面弾性波フ
イルタ取付構造において、 前記表面弾性波フイルタと前記電気的配線パタ
ーンとの間にソルダーレジストと該ソルダーレジ
ストの周囲を取り巻く半田付けパターンとを設け
たことを特徴とする表面弾性波フイルタ取付構造
。 (2) 前記半田付けパターンが前記表面弾性波フ
イルタと前記電気的配線パターンとのそれぞれと
接触するように設けられていることを特徴とする
第１請求項に記載の表面弾性波フイルタ取付構造
。 (3) 前記電気的配線パターンがアースパターン
であることを特徴とする第１請求項又は第２請求
項に記載の表面弾性波フイルタの取付構造。[Claims for Utility Model Registration] (1) A surface acoustic wave consisting of a printed wiring board having an electrical wiring pattern and a hole for inserting a lead wire to attach a surface acoustic wave filter on the electrical wiring pattern. A surface acoustic wave filter mounting structure, characterized in that a solder resist and a soldering pattern surrounding the solder resist are provided between the surface acoustic wave filter and the electrical wiring pattern. (2) The surface acoustic wave filter mounting structure according to claim 1, wherein the soldering pattern is provided so as to be in contact with each of the surface acoustic wave filter and the electrical wiring pattern. (3) The surface acoustic wave filter mounting structure according to claim 1 or 2, wherein the electrical wiring pattern is a ground pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8509790U JPH0442799U (en) | 1990-08-10 | 1990-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8509790U JPH0442799U (en) | 1990-08-10 | 1990-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442799U true JPH0442799U (en) | 1992-04-10 |
Family
ID=31634026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8509790U Pending JPH0442799U (en) | 1990-08-10 | 1990-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442799U (en) |
-
1990
- 1990-08-10 JP JP8509790U patent/JPH0442799U/ja active Pending