JPH0443457U - - Google Patents
Info
- Publication number
- JPH0443457U JPH0443457U JP8469090U JP8469090U JPH0443457U JP H0443457 U JPH0443457 U JP H0443457U JP 8469090 U JP8469090 U JP 8469090U JP 8469090 U JP8469090 U JP 8469090U JP H0443457 U JPH0443457 U JP H0443457U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tank
- arm
- liquid level
- pumping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000005086 pumping Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 5
- 238000007790 scraping Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 9
- 230000001105 regulatory effect Effects 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例の要部を示す平面図
、第２図は第１図の一部を破断した正面図、第３
図は、一実施例の全体構成を示す概略平面図、第
４図は一実施例の要部を示す斜視図である。第５
図は、一実施例の動作を説明するためのフローチ
ヤート、第６図は一実施例の要部の動作を説明す
るための概略図、第７図は、一実施例の要部の他
の動作を説明するための概略図、第８図は、一実
施例の要部の他の動作を説明するための概略図で
ある。第９図は、本考案の他の実施例を説明する
ための概略平面図、第１０図は、本考案の他の実
施例の要部を示す斜視図である。第１１図は、従
来装置を示す平面図、第１２図は、従来装置の動
作を説明するための概略断面図である。
１５……搬入コンベア、１６……装填装置、１
７……部品保持具、２０……半田付け装置、２２
……ターンテーブル、２３……アーム、２５……
フラツクス槽、２６……昇降装置、２７……汲上
げ槽、３０……半田槽、３１……汲上げ槽、３３
……昇降装置、３４……位置検出板、３５……第
１のセンサ、３６……第２のセンサ、４０……垂
下がり規制板、４３……押えバネ、４５……かき
板、５０……かき板駆動装置、６０……ブロア、
６１……取出しセンサ、Ｗ……電子部品、ｐ……
端子。
Fig. 1 is a plan view showing the main parts of an embodiment of the present invention, Fig. 2 is a partially cutaway front view of Fig. 1, and Fig. 3 is a partially cutaway front view of Fig.
The figure is a schematic plan view showing the overall configuration of one embodiment, and FIG. 4 is a perspective view showing main parts of one embodiment. Fifth
The figure is a flowchart for explaining the operation of one embodiment, FIG. 6 is a schematic diagram for explaining the operation of the main part of one embodiment, and FIG. 7 is a flowchart for explaining the operation of the main part of one embodiment. A schematic diagram for explaining the operation. FIG. 8 is a schematic diagram for explaining the other operation of the main part of one embodiment. FIG. 9 is a schematic plan view for explaining another embodiment of the present invention, and FIG. 10 is a perspective view showing essential parts of another embodiment of the present invention. FIG. 11 is a plan view showing a conventional device, and FIG. 12 is a schematic sectional view for explaining the operation of the conventional device. 15... Loading conveyor, 16... Loading device, 1
7... Component holder, 20... Soldering device, 22
...Turntable, 23...Arm, 25...
Flux tank, 26... Lifting device, 27... Pumping tank, 30... Solder tank, 31... Pumping tank, 33
... Lifting device, 34 ... Position detection plate, 35 ... First sensor, 36 ... Second sensor, 40 ... Drooping regulation plate, 43 ... Presser spring, 45 ... Scraping plate, 50 ... ...Scraper drive device, 60...Blower,
61...Takeout sensor, W...Electronic component, p...
terminal.
Claims (1)
昇降自在な汲上げ槽と、 回転装置と、 前記回転装置に一端側を固定され、部品端子を
下面側に露出させた状態で電子部品の装填が可能
なアームとを有し、 前記回転装置により前記半田槽の上方まで回転
移動して停止している前記アームに向かつて前記
汲上げ槽を上昇させ、前記アームに装填された電
子部品の部品端子を、前記汲上げ槽の半田液中に
所定長浸けることにより、前記部品端子に対する
予備半田を行なう半田付け装置において、 前記半田槽の上方に回転移動してくる前記アー
ムの他端側の垂下がりを規制する垂下がり規制部
材と、 前記垂下がり規制部材によつて他端側下面を支
持されながら前記半田槽の上方に移動してくる前
記アームに装填されている電子部品を、上方から
押圧する押え部材とを備えたことを特徴とする半
田付け装置。 (2) 半田槽と、 前記半田槽の半田液面下より半田液を汲上げる
昇降自在な汲上げ槽と、 前記汲上げ槽の上縁部が前記半田槽の液面より
高い所定位置まで上昇して、停止しているとき、
該汲上げ槽の液面に下端を接触させながら該液面
と平行に移動するかき板とを備え、 前記かき板の下端部によつて半田表面がかき取
られた汲上げ槽を、上方に支持された電子部品に
向かつてさらに上昇させ、下方に突出した電子部
品の部品端子を半田液に浸けるようにしたことを
特徴とする半田付け装置。[Scope of Claim for Utility Model Registration] (1) A solder tank, a pumping tank that can be raised and lowered to pump up solder liquid from below the solder liquid level of the solder tank, a rotating device, and one end of which is fixed to the rotating device. and an arm in which electronic components can be loaded with the component terminals exposed on the lower surface side, and the arm is rotated by the rotation device to the top of the solder tank and is stopped, and the pump is moved toward the arm, which is stopped. In the soldering apparatus, the component terminals of the electronic components loaded on the arm are immersed for a predetermined length in the solder liquid of the pumping tank by raising the pumping tank to pre-solder the component terminals. a drooping regulating member that restricts drooping of the other end of the arm that rotates upward; and a drooping regulating member that moves above the solder tank while the lower surface of the other end is supported by the drooping regulating member. A soldering device comprising: a holding member that presses an electronic component loaded on the arm from above. (2) a solder tank, a pumping tank that can be raised and lowered to pump up solder liquid from below the solder liquid level in the solder tank, and an upper edge of the pumping tank raised to a predetermined position higher than the liquid level in the solder tank; and when stopped,
a scraping plate that moves parallel to the liquid level while keeping its lower end in contact with the liquid level of the pumping tank, and the pumping tank whose solder surface has been scraped by the lower end of the scraping plate is moved upward. A soldering device characterized in that the soldering device is further raised toward the supported electronic component so that component terminals of the electronic component protruding downward can be immersed in solder liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8469090U JPH0443457U (en) | 1990-08-10 | 1990-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8469090U JPH0443457U (en) | 1990-08-10 | 1990-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0443457U true JPH0443457U (en) | 1992-04-13 |
Family
ID=31633330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8469090U Pending JPH0443457U (en) | 1990-08-10 | 1990-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0443457U (en) |
-
1990
- 1990-08-10 JP JP8469090U patent/JPH0443457U/ja active Pending
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