JPH0445024U - - Google Patents
Info
- Publication number
- JPH0445024U JPH0445024U JP8476090U JP8476090U JPH0445024U JP H0445024 U JPH0445024 U JP H0445024U JP 8476090 U JP8476090 U JP 8476090U JP 8476090 U JP8476090 U JP 8476090U JP H0445024 U JPH0445024 U JP H0445024U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cooling
- temperature
- piping
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 239000002826 coolant Substances 0.000 claims 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は本実施の金型及び真空吸引温度調節装
置の要部の説明図、第２図は成形工程と温度装置
及び金型温度の説明図である。
２……金型キヤビテイ中子、３……昇温用配管
、４……冷却用配管、５，６……昇温用及び冷却
用真空吸引式温度調節装置。
FIG. 1 is an explanatory diagram of the main parts of the mold and vacuum suction temperature control device of this embodiment, and FIG. 2 is an explanatory diagram of the molding process, temperature device, and mold temperature. 2...Mold cavity core, 3...Temperature raising piping, 4...Cooling piping, 5, 6...Vacuum suction type temperature control device for heating and cooling.
Claims (1)
ヤビテイ中子に昇温用配管と冷却用配管を設け、
前記昇温用配管及び冷却用配管にそれぞれ昇温用
及び冷却用の真空吸引式温度調節装置を配置し、
型締め、射出の各工程には昇温度用の媒体を送り
金型全体を昇温後、前記昇温度用の温度調節装置
にて速やかに金型より媒体を吸引し、保圧、冷却
及び型開き工程には冷却用媒体を送り金型全体を
冷却後前記冷却用温度調節装置にて速やかに冷却
用媒体を金型より吸引する金型用真空吸引式温度
調節装置。 When adjusting the temperature of the mold of an injection molding machine, temperature raising piping and cooling piping are installed in the mold cavity core.
Vacuum suction type temperature control devices for heating and cooling are arranged in the heating piping and cooling piping, respectively,
For each process of mold clamping and injection, a temperature raising medium is sent to raise the temperature of the entire mold, and then the temperature adjusting device for temperature raising quickly sucks the medium out of the mold, holding pressure, cooling and molding. A vacuum suction type temperature control device for a mold, in which a cooling medium is sent to the opening process, and after the entire mold is cooled, the cooling medium is quickly sucked from the mold by the cooling temperature control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8476090U JPH0445024U (en) | 1990-08-10 | 1990-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8476090U JPH0445024U (en) | 1990-08-10 | 1990-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0445024U true JPH0445024U (en) | 1992-04-16 |
Family
ID=31815911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8476090U Pending JPH0445024U (en) | 1990-08-10 | 1990-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445024U (en) |
-
1990
- 1990-08-10 JP JP8476090U patent/JPH0445024U/ja active Pending
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