JPH0445253Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to an improvement in the external shape of a hybrid integrated circuit consisting of two substrates that can be directly inserted into a socket.

(b) Prior Art Conventionally, ceramic substrates or metal substrates have been used for hybrid integrated circuits, but metal substrates with excellent heat dissipation and mechanical strength are mainly used. A hybrid integrated circuit using a metal substrate is shown in Figure 4 (Utility Model Publication No. 52-3645)
(Refer to Japanese Patent Publication No. 2003-110000), an aluminum substrate is used as the metal substrate 21, the surface thereof is anodized to form an aluminum oxide film 22, and an insulating layer 23 is formed on the aluminum oxide film 22 using a resin such as epoxy resin. . Further, a copper foil is pasted onto the insulating layer 23 and etched into a desired pattern to form a conductive path 24. A plurality of circuit elements 25 are formed on the conductive path 24, and external leads 26 are fixed at regular intervals on the pad at the tip where the conductive path 24 extends. In addition, a hybrid integrated circuit consisting of two metal substrates is shown in Figure 5 (Special Publications Publication No. 46
-Refer to Publication No. 35817), the circuit elements 27, 2
The metal substrates 28, 28' provided with the metal substrates 7' are fixed apart from each other by a frame 29, and external leads 30, 30' fixed to the peripheral ends of the respective substrates 28, 28 are formed to protrude in the same direction. Ru.

When connecting such a hybrid integrated circuit to a printed circuit board, as shown in FIG. 6, the external leads 32 of the hybrid integrated circuit 31 are inserted into the holes 34 of the printed circuit board 33 and soldered together, or as shown in FIG. Tokukai Akira
59-92595 and Japanese Patent Application Laid-open No. 59-149082), a hybrid integrated circuit 44 made of a ceramic substrate 43 is inserted into a slit 42 provided in a printed circuit board 41, and the circuit board 43 and the printed circuit board 4 are connected to each other.
1 is known to be directly soldered.

Furthermore, FIG. 8 shows a hybrid integrated circuit inserted into a printed circuit board. A first substrate 53 on which a conductive path 51 of a desired shape is formed on a metal substrate with good thermal conductivity, and a circuit element 52 such as a power transistor, a resistor, a diode, etc. is provided on the conductive path 51, and an insulating substrate, e.g. , a conductive path 55 having a desired shape is formed on the printed circuit board in the same manner as the first substrate 53, and the conductive path 5 is
5, and a second board 54 on which large capacitors, resistors, etc., conventionally used as external components, are provided. The pads provided at the end of the surface are connected by soldering using metal leads 56, and the lid 57 is fixed to the area surrounded by the dotted line.
and the second substrates 53 and 54 are integrated. As shown in FIG. 9, the edge cover 57 secures the peripheries and three locations of the first and second substrates 53 and 54.

Such a technique is described in Japanese Patent Publication No. 57-47078.

(c) Problems to be solved by the invention However, conventional hybrid integrated circuits have the following various problems. First, when inserting the metal board shown in Figure 6 into the printed circuit board, approximately 2
There was a problem that because many mm-wide external leads were led out, they deformed during transportation and could not be automatically inserted into the printed circuit board using an automatic machine.

Next, in the structure shown in FIG. 7, the board itself is used as a lead and external leads are omitted, so even if the board inserted into the printed circuit board is an insulator, the above-mentioned problem can be solved. However, when a metal substrate is used as a printed circuit board with slits, a gap is created between the metal substrate and the slit, making it difficult to solder when connecting each electrode, and the insulating film of the metal substrate may be torn. There was a problem that it could not be used for high voltage and large current applications because there was a risk of it colliding with the electrodes of the printed circuit board.

Next, in the integral type of metal substrate and printed circuit board shown in FIG. 8, the above-mentioned problem can be solved because the part where the printed circuit board is joined is the printed circuit board (insulator). However, such a hybrid integrated circuit formed by integrally forming a metal substrate and a printed circuit board has a problem in that the mechanical strength is extremely weak because the circuit is integrated only by the lid. Furthermore, since the respective boards are connected using leads, there are problems in workability and reliability of the connection parts.

Furthermore, since the thermal expansion coefficients of the metal substrate and the integrated printed circuit board are significantly different, there is a problem in that the printed circuit board may peel off at the bonded portion of the strain lead.

(d) Means for solving the problem The present invention was made in view of the above-mentioned problem, and is a sealing method that surrounds the circuit element 7 of the case material 2 that separates the two metal substrates 1 and 1'. External leads 3, 3 are alternately connected to the connector portion 6 extending from the middle portion of the portion 8 and protruding from the terminal end of each metal substrate 1, 1'.
3' extends into contact with the opposite surface to solve the conventional problems.

(e) Effect According to the present invention, external leads are alternately brought into contact with and extended to the opposite surfaces of the connector parts protruding from the end of two metal boards from the middle part of the case material, so that each connector part The external leads are supported, and the connection area of the external leads is increased, allowing a large current to flow.

(F) Embodiments The present invention will be described in detail below based on embodiments shown in the drawings.

1 and 2 are a sectional view and a plan view showing an embodiment of the hybrid integrated circuit of the present invention, which includes two metal substrates 1 and 1', a case material 2, an external lead 3,
3'.

Aluminum substrates are used as the two metal substrates 1 and 1', and an aluminum oxide film is formed on each surface by anodic oxidation. Insulating films 4, 4' are formed on the aluminum oxide film using a resin such as epoxy resin or polyimide resin. Further, a copper foil is pasted on the insulating films 4, 4', and the copper foil is etched into a desired pattern to form conductive paths 5, 5'. The conductive paths 5, 5' extend in the direction of one side of the substrates 1, 1', and have external leads 3, 3' at their tips.
A plurality of conductive pads are formed to which the conductive pads are affixed. Such conductive pads are formed so as to avoid the entire peripheral edges of the substrates 1, 1' or the corners of the respective substrates 1, 1'. On each conductive path 5, 5', a semiconductor integrated circuit,
A plurality of circuit elements 7, 7' such as transistors and chip parts are fixed.

The case material 2 is composed of a sealing part 8 that separates the metal substrates 1, 1' and surrounds the circuit elements 7, 7', and a connector part 6 that supports the external leads 3, 3'.
Injection molded with insulating resin, such as FRPET (trade name). The sealing portion 8 is formed in a frame shape to surround the circuit elements 7, 7' and to separate the metal substrates 1, 1'. A connector portion 6 is formed approximately in the middle of one side surface of the frame-shaped sealing portion 8 and protrudes from the terminal ends of the metal substrates 1, 1'. As described above, the connector portion 6 is formed to protrude from the end of the metal substrates 1, 1', and the external leads 3, 3' led out from the metal substrates 1, 1' are disposed in contact with both surfaces thereof.
Further, the width of the connector portion 6 is formed to be the same as the width of the sealing portion 8 or narrower than the width of the sealing portion 8 as shown in FIG. The width of the connector portion 6 at this time can be changed depending on the application. Furthermore, the thickness of the connector portion 6 is formed to be the same as the thickness of the printed circuit board to be inserted, or to be thinner by the thickness of the external leads 3, 3'.

One end of the external leads 3, 3' is connected by solder to the conductive pads formed alternately on the metal substrates 1, 1', and when the metal substrates 1, 1' and the case material 2 are fixed, the case material 2 to approximately the tip of the connector portion 6 protruding from the terminal end of the substrates 1, 1', and is bent so as to contact the opposite surface at the terminal end of the connector portion 6. At this time, since the external leads 3 and 3' are formed with alternating conductive pads, there is no problem even if they are bent to the opposite side of the connector portion 6. Also,
Any adhesive can be used to bond the metal substrates 1, 1' and the case material 2, and a J sheet is used in this embodiment.

FIG. 3 is a cross-sectional view when the hybrid integrated circuit of the present invention is inserted into a printed circuit board, and the connector portion 6 of the case material 2 is inserted into the insertion hole of the printed circuit board 9.
The electrodes 10, 10' of the printed circuit board 9 and the external leads 3, 3' are connected by solder 11.

By bringing the external leads 3, 3' led out from the metal substrates 1, 1' into contact with the connector portion 6 protruding from the case material 2 in this way, the external leads 3,
3' is supported by the connector portion 6 and is not deformed by external force, allowing automatic insertion into the printed circuit board using an automatic machine. Furthermore, both the connector portion and the printed circuit board are insulators, and the connection area between the external leads and electrodes is large, allowing the use of ICs with high current and high withstand voltage.

(g) Effects of the invention As detailed above, according to the invention, the hybrid integrated circuit is not inserted into the printed circuit board as in the past, but the connector part is formed on the hybrid integrated circuit, so the hybrid integrated circuit This has the advantage that the printed circuit board and the printed circuit board are equalized, and insertion can be easily performed.

Further, since the external leads are supported by the connector portion, bending of the leads can be prevented, and automatic insertion into the printed circuit board can be performed using an automatic machine.

Further, in the present invention, since the metal substrate and the case material are integrated and the connector portion of the case material is inserted into the printed circuit board, the influence of distortion due to thermal expansion can be completely ignored.

Furthermore, in this invention, the metal board is not directly inserted into the socket, but the connector part of the case material is inserted, resulting in excellent insulation and a larger connection area for external leads, making it suitable for use in high voltage and large current ICs. can.

Furthermore, in the case of the two-piece substrate of the present invention, since both sides can be covered with metal, the shielding effect is increased and the heat dissipation effect is also improved. Furthermore, since circuit elements can be mounted on two boards, high-density mounting is possible.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing the hybrid integrated circuit of the present invention;
FIG. 2 is a plan view thereof, FIG. 3 is a sectional view when the hybrid integrated circuit is inserted into a printed circuit board, and FIGS. 4 to 9 are views showing conventional examples. 1 and 1' are metal substrates, 2 is a case material, 6 is a connector part, and 3 and 3' are external leads.

Claims (1)

[Scope of utility model registration request] two metal substrates, an insulating film provided on the two metal substrates, a conductive path of a desired shape formed on each of the insulating films, and a plurality of circuit elements fixed on the conductive path. , comprising a plurality of conductive pads formed on the peripheral edge of one side of each of the metal substrates on which the conductive path extends, and an insulating resin, abutting on the peripheral edges of the two substrates; The two metal substrates are separated with their circuit element mounting surfaces facing each other, and a frame-shaped sealing portion surrounding the circuit element and a substantially intermediate portion of the sealing portion protrude from the ends of the two metal substrates. a case material having a connector portion; and external leads having one end fixed to each of the conductive pads and extending alternately into contact with a surface opposite to the connector portion of the case material. circuit.