JPH0446551U - - Google Patents
Info
- Publication number
- JPH0446551U JPH0446551U JP1990087801U JP8780190U JPH0446551U JP H0446551 U JPH0446551 U JP H0446551U JP 1990087801 U JP1990087801 U JP 1990087801U JP 8780190 U JP8780190 U JP 8780190U JP H0446551 U JPH0446551 U JP H0446551U
- Authority
- JP
- Japan
- Prior art keywords
- case
- semiconductor element
- resin
- wiring pattern
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990087801U JPH0446551U (mo) | 1990-08-21 | 1990-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990087801U JPH0446551U (mo) | 1990-08-21 | 1990-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446551U true JPH0446551U (mo) | 1992-04-21 |
Family
ID=31820485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990087801U Pending JPH0446551U (mo) | 1990-08-21 | 1990-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446551U (mo) |
-
1990
- 1990-08-21 JP JP1990087801U patent/JPH0446551U/ja active Pending