JPH0446571U - - Google Patents
Info
- Publication number
- JPH0446571U JPH0446571U JP8907890U JP8907890U JPH0446571U JP H0446571 U JPH0446571 U JP H0446571U JP 8907890 U JP8907890 U JP 8907890U JP 8907890 U JP8907890 U JP 8907890U JP H0446571 U JPH0446571 U JP H0446571U
- Authority
- JP
- Japan
- Prior art keywords
- flat portion
- land electrodes
- protruding flat
- top surface
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は本考案におけるセラミツク基板説明図
、第２図は本考案におけるランド電極形成説明図
、第３図は本考案における厚膜形成説明図、第４
図は本考案における厚膜回路装置断面図、第５図
ａ，ｂは従来例における厚膜回路装置断面図およ
び斜視図、第６図は従来例における厚膜回路形成
説明図、第７図は従来例における厚膜回路形成説
明図である。
１……セラミツク基板、２……突状平坦部、４
，４′……ランド電極、５……厚膜回路、６，６
′……配線パターンの一部、７，７′……段差部
。
Figure 1 is an explanatory diagram of the ceramic substrate according to the present invention, Figure 2 is an explanatory diagram of land electrode formation in the present invention, Figure 3 is an explanatory diagram of thick film formation in the present invention, and Figure 4 is an explanatory diagram of the formation of a thick film in the present invention.
The figure is a sectional view of the thick film circuit device in the present invention, FIGS. 5a and 5b are sectional views and perspective views of the thick film circuit device in the conventional example, FIG. It is an explanatory diagram of thick film circuit formation in a conventional example. 1...Ceramic substrate, 2...Protruding flat part, 4
, 4'... Land electrode, 5... Thick film circuit, 6, 6
'... Part of the wiring pattern, 7, 7'... Step portion.
Claims (1)
突状平坦部２と、 当該突状平坦部２の両端に接して設けられ、前
記突状平坦部２の頂面と略同一面を有するランド
電極４，４′と、 当該ランド電極４，４′と共に形成され、電子
部品を接続するように配置されている配線パター
ン６，６′と、 前記ランド電極４，４′および突状平坦部２の
上面に形成された厚膜回路５と、 を備えたことを特徴とする厚膜回路装置。[Claims for Utility Model Registration] A protruding flat portion 2 having a flat top surface formed in advance on an insulating substrate 1; and a protruding flat portion 2 provided in contact with both ends of the protruding flat portion 2; land electrodes 4, 4' having substantially the same surface as the top surface of the land electrodes 4, 4'; wiring patterns 6, 6' formed together with the land electrodes 4, 4' and arranged to connect electronic components; and the land electrodes 4, 4'. 4, 4' and a thick film circuit 5 formed on the upper surface of the protruding flat portion 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8907890U JPH0446571U (en) | 1990-08-24 | 1990-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8907890U JPH0446571U (en) | 1990-08-24 | 1990-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446571U true JPH0446571U (en) | 1992-04-21 |
Family
ID=31822805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8907890U Pending JPH0446571U (en) | 1990-08-24 | 1990-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446571U (en) |
-
1990
- 1990-08-24 JP JP8907890U patent/JPH0446571U/ja active Pending