JPH0446951A - Phenol resin molding material - Google Patents
Phenol resin molding materialInfo
- Publication number
- JPH0446951A JPH0446951A JP15608290A JP15608290A JPH0446951A JP H0446951 A JPH0446951 A JP H0446951A JP 15608290 A JP15608290 A JP 15608290A JP 15608290 A JP15608290 A JP 15608290A JP H0446951 A JPH0446951 A JP H0446951A
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- epoxy resin
- resin molding
- resin
- phenol resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 12
- 239000012778 molding material Substances 0.000 title claims description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 10
- 229920001568 phenolic resin Polymers 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 4
- 229920003986 novolac Polymers 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000004094 surface-active agent Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000314 lubricant Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000004843 novolac epoxy resin Substances 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 8
- 239000010680 novolac-type phenolic resin Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は自動車部品用、電気機械部品用、ＯＡ事務機部
品用、電子部品用、音響機器部品用、熱器具部品用、食
器用等に用いられるフェノール樹脂成形材料に関するも
のである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applicable to automobile parts, electromechanical parts, OA office machine parts, electronic parts, audio equipment parts, heating appliance parts, tableware, etc. This invention relates to the phenolic resin molding material used.
従来、フェノール樹脂成形材料から得られるフェノール
樹脂成形品を塗料によって塗装し、煮沸処理を施すと塗
膜と成形品素地との界面にフクレ、剥離を発生すること
がある。Conventionally, when a phenolic resin molded article obtained from a phenolic resin molding material is painted with a paint and subjected to a boiling treatment, blistering and peeling may occur at the interface between the paint film and the molded article base.
従来の技術で述べたようにフェノール樹脂成形品の塗料
密着性はあまりよ（ない。本発明は従来の技術における
上述の問題点に鑑みてなされたもので、その目的とする
ところは塗料密着性のよい成形品が得られるフェノール
樹脂成形材料を提供することにある。As described in the prior art, the paint adhesion of phenolic resin molded products is not very good.The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to improve paint adhesion. An object of the present invention is to provide a phenolic resin molding material from which molded products with good quality can be obtained.
本発明は樹脂全量中２０〜１００重量％（以下単に％と
記す）のエポキシ樹脂を含有したことを特徴とするフェ
ノール樹脂成形材料のため、エポキシ樹脂のエポキシ基
によって塗料密着性を向上させることができたもので、
以下本発明の詳細な説明する。The present invention is a phenolic resin molding material characterized by containing epoxy resin in an amount of 20 to 100% by weight (hereinafter simply referred to as %) based on the total amount of resin, and the epoxy groups of the epoxy resin can improve paint adhesion. It was made,
The present invention will be explained in detail below.
本発明に用いるエポキシ樹脂は、ノボラック型エポキシ
樹脂、ハロゲン化エポキシ樹脂、グリンジルエステル型
エポキシ樹脂等のようにエポキシ樹脂全般を用いること
ができるが、好ましくは、ノボランク型エポキシ樹脂を
用いることが塗料との反応性の点でよく望ましいことで
あり、又エポキシ樹脂はイミド変性、ンリコン変性等の
変性物であってもよく、成形材料中の樹脂全量中２０〜
１００％であることが必要である。即ち２０％未満では
塗料密着性が向上しないからである。エポキシ樹脂以外
の樹脂としてはノボラック型フェノール樹脂、アミノ樹
脂等を用いることができるが、ノボラック型フェノール
樹脂を用いることが好ましいが、ノボラック型フェノー
ル樹脂についてもエポキシ変性、メラミン変性、ユリア
変性、キシレン変性等の変性物を用いることもできる。As the epoxy resin used in the present invention, any epoxy resin can be used such as a novolac type epoxy resin, a halogenated epoxy resin, a grindyl ester type epoxy resin, etc., but it is preferable to use a novolak type epoxy resin. In addition, the epoxy resin may be a modified product such as imide modification or rincon modification, and the epoxy resin may contain 20 to 20% of the total amount of resin in the molding material.
It needs to be 100%. That is, if it is less than 20%, paint adhesion will not improve. As resins other than epoxy resins, novolac type phenolic resins, amino resins, etc. can be used, but it is preferable to use novolac type phenolic resins, but novolac type phenolic resins can also be epoxy-modified, melamine-modified, urea-modified, xylene-modified. It is also possible to use modified products such as.
充填剤又は補強材としては木粉、布チップ、綿粉、ガラ
ス繊維、炭酸カルシウム、水酸化アルミニウム、クレー
、タルク、シリカ等のような有機、無機物の繊維、チッ
プ、粉末を用いることができる、必要に応じて添加され
る硬化剤、着色剤、離型剤、界面活性剤等については特
に限定するものではなく、フェノール樹脂成形材料に用
い得るものをそのまま用いることができる。これら配合
材料を混合、混焼、粉砕し、必要に応じて造粒し成形材
料とするものである。As fillers or reinforcing materials, organic and inorganic fibers, chips, and powders such as wood flour, cloth chips, cotton flour, glass fibers, calcium carbonate, aluminum hydroxide, clay, talc, silica, etc. can be used. There are no particular limitations on the curing agent, coloring agent, mold release agent, surfactant, etc. that may be added as needed, and those that can be used in the phenolic resin molding material can be used as they are. These blended materials are mixed, co-fired, pulverized, and, if necessary, granulated to form a molding material.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１乃至３と比較例１及び２ 第１表の配合表にもとづいて配合、 してフェノール樹脂成形材料を得た。Examples 1 to 3 and Comparative Examples 1 and 2 Mixed based on the combination table in Table 1, A phenolic resin molding material was obtained.
第 １ 表
混焼、
粉砕
重量部
実施例１乃至３と比較例１及び２の成形材料を成形圧力
２２５ ｋｇ／ｃｊ、金型温度１６０°Ｃで２分間圧縮
成形して皿型成形品を得、次に該成形品表面をシンナー
で表面洗浄後、市販ウレタン塗料を吹付塗装し、１２０
℃で３０分間焼付乾燥後、３日間２５°Ｃの室内に放置
してからゴバン目七ロテープ試験として３０分間煮沸後
、１時間２５°Ｃの室内に放置してからゴバン目セロテ
ープ試験を行なった。又、別に３日間２５°Ｃの室内に
放置後、２０時間煮沸して外観試験を行なった。その結
果は第２表のようである。Table 1 Mixed firing, crushing weight part The molding materials of Examples 1 to 3 and Comparative Examples 1 and 2 were compression molded at a molding pressure of 225 kg/cj and a mold temperature of 160°C for 2 minutes to obtain a dish-shaped molded product. Next, after cleaning the surface of the molded product with thinner, a commercially available urethane paint was spray-painted, and 120%
After baking and drying at ℃ for 30 minutes, it was left in a room at 25°C for 3 days, and then a cellophane tape test was conducted after boiling it for 30 minutes and left in a room at 25°C for 1 hour. . Separately, after being left in a room at 25°C for 3 days, it was boiled for 20 hours and an appearance test was conducted. The results are shown in Table 2.
第 ２ 表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有するフェノール樹脂成形材料におい
てはその成形品の塗料密着性が向上する効果がある。Table 2 [Effects of the Invention] The present invention is constructed as described above. The phenolic resin molding material having the structure described in the claims has the effect of improving the paint adhesion of the molded product.
Claims (1)
含有したことを特徴とするフェノール樹脂成形材料。(1) A phenolic resin molding material containing 20 to 100% by weight of epoxy resin based on the total amount of resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15608290A JPH0446951A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15608290A JPH0446951A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446951A true JPH0446951A (en) | 1992-02-17 |
Family
ID=15619907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15608290A Pending JPH0446951A (en) | 1990-06-14 | 1990-06-14 | Phenol resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446951A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01121269A (en) * | 1987-10-31 | 1989-05-12 | Mochida Pharmaceut Co Ltd | 1-acyl-2,3-dihydro-4(1h)-quinoline-4-oxime derivative, production thereof and diuretic, antihypertensive, antiedemic and abdominal dropsy removing medicine composition containing said derivative as main ingredient |
-
1990
- 1990-06-14 JP JP15608290A patent/JPH0446951A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01121269A (en) * | 1987-10-31 | 1989-05-12 | Mochida Pharmaceut Co Ltd | 1-acyl-2,3-dihydro-4(1h)-quinoline-4-oxime derivative, production thereof and diuretic, antihypertensive, antiedemic and abdominal dropsy removing medicine composition containing said derivative as main ingredient |
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