JPH0446960A - Antistatic polyamide resin composition - Google Patents

Abstract

PURPOSE:To impart excellent antistatic properties by incorporating a specified metal and/or its salt and a glycidylated polyhydric alcohol compound into a polyamide resin. CONSTITUTION:100pts.wt. polyamide resin is mixed with 0.01-15pts.wt. of one or more of the group I and/or group II metal and/or a salt thereof and 0.5-20pts. wt. glycidylated polyhydric alcohol compound. Examples of the alcohol compound include polyethylene glycol diglycidyl ether and polypropylene glycol diglycidyl ether.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a polyamide resin composition that has a polyamide resin as a base material and has excellent antistatic properties.

[Conventional technology]

Conventionally, conductive resins with excellent antistatic effects are used for IC and L
It is used in carrier cases to protect SI, etc., and packaging materials for electronic components.

The antistatic (conductive) resin used in this case is mostly a mixture of carbon black and thermoplastic resin due to issues such as price, electrical properties, mechanical properties, and moldability. be.

However, although a thermoplastic resin containing carbon black has good conductivity (antistatic properties), the resulting molded product has a black tone, making it unsuitable as a conductive resin when color separation is required. Currently, it cannot be used in applications where dirt from carbon blanks is a concern.

There are also methods using antistatic agents, such as kneading them into the resin or coating them on the surface of the molded product, but both have the disadvantage that the effect (conductivity) disappears in a short period of time. .

For this reason, in recent years, various antistatic resins in which wood-philic resins are blended with thermoplastic resins have been developed and studied.

However, the common disadvantages of products containing hydrophilic resins are that the physical properties of the molded product (e.g., elongation, tensile strength) are significantly reduced, the surface of the molded product tends to become sticky, and particles are easily absorbed. There are drawbacks such as being easy to use.

Therefore, the present inventors previously discovered (Japanese Patent Application No. 1-97532) that it is possible to color carrier cases and packaging materials for protecting ICs, LSIs, etc., and that molding is easy and that the resulting molded products can be colored. The present invention provides a conductive polyamide resin composition with excellent mechanical properties.

[Problem that the invention seeks to solve]

However, in the above case, molded products containing a large amount of glycerin compounds to improve conductivity (antistatic properties) may become sticky on the surface if left in an environment with high humidity or temperature. It has drawbacks such as easy adsorption of dust.

[Means to be solved by the invention]

Therefore, the present inventors conducted extensive research to solve the drawbacks of various antistatic resin compositions as described above, and as a result, the amino groups in the polyamide resin were heated and kneaded with the +81 component (glycidyl in the Bl component). A polyamide resin that easily reacts with the group and has a polyhydric alcohol at the end can be obtained.

Then, a resin composition containing a binder component is a conventionally known composite of polyethylene oxides and alkali metal salts (e.g., Japan Rubber Association Journal, Vol. 61, No. 9, 86).
The present invention was completed based on the finding that an antistatic resin composition can be obtained by exhibiting excellent ionic conductivity similar to that of the antistatic resin composition (pages 1 to 93).

In other words, the present invention contains 0.01 to 100 parts by weight of one or more metals and/or salts of Group 1 and/or Group Ⅰ of the periodic table of metals and/or salts thereof, per 100 parts by weight of the polyamide resin. This is an antistatic polyamide resin composition characterized by containing two components: 15 parts by weight, 0.5 to 20 parts by weight or more of a polyhydric alcohol compound having a glycidyl group (Bl), and fBl.

The polyamide resin used in the present invention may be one obtained by repeating amide bonds and condensation polymerization, such as nylon 12, nylon 11, nylon 6, nylon 6/6',
Examples include nylon elastomer.

Examples of the metals of Groups 1 and 2 of the periodic table of the prison component include lithium, potassium, sodium, beryllium, calcium, magnesium, aluminum, etc., and metal salts of Groups 1 and 2 of the periodic table include halides. , perchlorate, perbromate, chlorate, bromate, thiocyanate, nitrate, sulfate, phosphate, fatty acid salt, etc. Specific compounds include potassium thiocyanate, Sodium thiocyanate, lithium thiocyanate, lithium sulfate,
These include lithium stearate, lithium chloride, and lithium perchlorate.

In particular, the metal salts of the above-mentioned inorganic compounds are white in color, so even after being blended into the polyamide resin, they can be colored into various desired colors, and the mechanical properties of the resulting molded products are improved. Conductivity etc. do not decrease at all.

Examples of polyhydric alcohol compounds having a 81 grindyl group used in the present invention include polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexane diol diglycidyl Examples include ether, glycerin diglycidyl ether, trimethylol propane triglycidyl ether, and the like.

In the present invention, (by blending the Bl component, the dispersion of the captive component into the polyamide resin becomes extremely good, which not only significantly improves the conductivity but also makes it possible to produce films and filaments that were previously difficult to use. In some cases, products exhibiting extremely excellent mechanical properties can be obtained.

In the present invention, for 100 parts of polyamide resin (hereinafter, parts by weight are abbreviated as parts),
0.01 to 15 parts of one or more metals of group 1 and group 1 and/or salts thereof are blended. At this time, if the amount of the captive component used is less than 0.01 part, a sufficient conductive effect cannot be obtained, which is undesirable.
Even if more than 5 parts is added, the conductive effect is not particularly improved.
Rather, the mechanical properties of the resin composition deteriorate, which is undesirable.

In addition, it is particularly preferable that the amount of the active ingredient is 1 to 10 parts because the balance between electrical properties and moldability is particularly good.

The (supporting) component is blended in an amount of 0.5 to 20 parts. At this time, if the amount of the (Bl) component used is less than 0.5 parts, the dispersibility of the supporting component in the polyamide resin will not improve. , excellent conductivity cannot be obtained, which is not preferable.

However, even if more than 20 parts of component fB) is added, the dispersibility and conductivity of the prisoner component are not particularly improved, but rather the mechanical properties of the composition are deteriorated, which is not preferable.

There are no particular restrictions on the method for producing the antistatic polyamide resin composition of the present invention, and it may be produced by blending various additives with a polyamide resin.

The dye and pigment used for coloring the composition of the present invention may be any dye that has been conventionally used for coloring polyamide resins.

For the purpose of easily dispersing the dye and pigment, fatty acids, fatty acid metal salts, low molecular weight polymers, fatty acid waxes, etc. may be added.

Furthermore, if desired, other additives such as antioxidants, photodegradation inhibitors, plasticizers (bararoctylbenzene, N-butylbenzene, sulfonamide, etc.) can be added at an appropriate time. .

Examples and comparative examples will be described below.

Example 1 100 parts of powdered 6-nylon resin, 5 parts of potassium thiocyanate, and 1 part of polyethylene glycol diglycidyl ether having a molecular weight of 300 were blended using a Henschel mixer, and then mixed using a single screw extruder. Cross line extrusion,
An antistatic polyamide resin composition of the present invention was obtained.

Next, a test sample of 1100 x 150 x 2 was made using an injection molding machine using the pellet obtained above.

Examples 2 to 11 and Comparative Examples 1 to 7 Examples 2 to 11 and Comparative Examples 1 to 7 were prepared using the same manufacturing method as in Example 1, and the blending ratios (parts) are shown in Table 1.

Next, the following B) and (B) were measured for each sample obtained in Examples 1 to 11 and Comparative Examples 1 to 7, and the results are shown in Table 1.

B) Volume resistivity 50 x 50 strips of conductive adhesive divided aluminum foil tape were pasted as electrodes on the front and back of a molded plate with a thickness of 2fi, and the temperature was 23°C.
, and a relative humidity of 55% (b).

Appearance of the molded product The appearance of the sample piece is visually judged, and at the same time, the degree of stickiness of the surface condition is judged using the tentacles.

The symbols in the table mean the following conditions.

0---Appearance surface condition is good.

× - Poor appearance or rough surface is likely to occur.

The substances used as the Bl component and their average molecular weights are as follows.

PEG-DGE・・・Polyethylene glycol diglycidyl netel PPG-DGE・・・Polypropylene glycol diglycidyl netel PEG・・・・・・・・・・・・・・・Polyethylene glycol PPG・・・・・・・・・・・・・・・Polypropylene glycol PBG・・・・・・・・・・・・・・・Polybutylene glycol Also, the average molecular weight was 300 in Examples 1 to 5, and 300 in Examples 6 to 5. 11 is 500. Comparative Examples 1 to 4 use 600, and Comparative Examples 5 to 6 use 500.

〔Effect of the invention〕

When producing the antistatic polyamide resin composition of the present invention, the polyamide resin, the active component, and the component are melt-kneaded in an extruder, and the (Bl component) undergoes an addition reaction with the polyamide resin.

Therefore, phenomena such as surging that are observed when melting and kneading conventional antistatic agents are completely eliminated, and the resulting composition is homogeneous, allowing stable processing operations.

Therefore, the antistatic properties (electroconductivity) are improved, the surface of the molded product is not sticky, no lumps are adsorbed, and the volume resistivity value is stable in the range of 10 4 to 10 10 Ω/as.

Moreover, these properties are not lost even at high temperatures or high humidity, and it has excellent processability and thermal stability, making it possible to use it in films and filaments, and eliminating variations in color tone and transparency of the resulting molded products. Does not occur.

In addition, when a metal salt is used as a prisoner component, it is white and light in color, so by adding any coloring agent, it can be colored to a desired color, and colorful molded products can be easily produced. Therefore, it is possible to color-code products that require dustproofing, such as IC magazines, antistatic parts such as IC trays, packaging and storage containers for semiconductor-related products, automobile interior parts, and clean rooms, depending on the purpose.

Claims (1)

[Scope of Claims] Based on 100 parts by weight of polyamide resin, (A) a metal of Group I and/or Group II of the periodic table and/or
or 0.01 to 1 of one or more of its salts
5 parts by weight, (B) 0.5 to 20 parts by weight or more of a polyhydric alcohol compound having a glycidyl group, and an antistatic polyamide resin composition comprising two components (A) and (B).