JPH0447036B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field to Which the Invention Pertains] The present invention relates to an electroplating device, and in particular, is capable of plating only a portion of an article to be plated (hereinafter referred to as the object to be plated). Related to electroplating equipment.

[Prior art and its problems]

When plating only a portion of an object to be plated, such as an electrical component, the unnecessary parts are often masked off using tape or putty, and Figures 3 and 4 show this type of conventional plating. The device is shown.

The example shown in Fig. 3 shows an example in which plating is applied only to the end face 1a of a cylindrical plated object 1, and areas that do not require plating are covered with masking material 2 such as tape, putty, or paint. covered. The object 1 to be plated is immersed in a plating liquid 3 and connected to the negative electrode side of a DC power source. In addition,
A plating metal 4 connected to the anode side of a DC power source is suspended in the plating liquid 3.

However, this conventional plating apparatus has problems in that the masking process takes a long time, resulting in poor work efficiency, and the plating speed is also within the conventional speed range.

In order to increase the plating speed, a jet plating device has been proposed. This is as shown in Fig. 4, and the cylindrical covered object 1 is
It is held in a masking cell 6 with only the end face 1a exposed in the plating chamber 5. Then, the plating liquid is supplied to the plating chamber 5 from below through the plating liquid supply pipe 7.
It is sprayed towards the object 1 inside. Although such a plating apparatus has the advantage of being able to perform plating at high speed, it has the problem that the masking cells 6 must be precisely manufactured to prevent the plating liquid from scattering around. Especially covered items 1
Since the plating liquid tends to seep out from the gap between the masking cell 6 and the masking cell 6, there is a problem in that sealing in that area must be taken into consideration.

[Purpose of the invention]

The present invention solves the problems of the conventional apparatus described above, and is capable of plating a part of a plated object at high speed without masking the plated object. The purpose of this invention is to provide a lighting device.

[Key points of the invention]

The present invention provides a rod-shaped electrode made of a plating metal whose cross-sectional shape is the same as the shape of the plating surface of the object to be plated, and has a plating liquid supply passage passing through the center in the axial direction. The plating surface of the object to be plated is opposed to the upper end surface of the rod-shaped electrode with a small distance therebetween, and the plating liquid is supplied from the lower end side of the rod-shaped electrode to the plating liquid supply path to coat the upper end surface of the rod-shaped electrode. A plating liquid film is formed, the plating surface of the object to be plated is placed in the plating liquid film, and a plating voltage is applied between the rod-shaped electrode and the object to be plated. .

[Embodiments of the invention]

An embodiment of an electroplating apparatus according to the present invention will be described below with reference to FIGS. 1 and 2.

In FIG. 1, the reference numeral 10 indicates a saucer, and on the saucer 10 is placed a rod-shaped electrode 11 made of plated metal and having a circular cross section. Of course, the rod-shaped electrode 11 is determined by the type of metal to be plated on the object, and this rod-shaped electrode 11 is connected to the anode side of a DC power source 13 via a lead wire 12. has been done. The cathode side of this DC power supply 13 is connected to a covered object 15 via a lead wire 14. In this embodiment, the plated object 15 has a cylindrical shape, and the portion to be plated has a circular lower end surface 16.
Of course, there are various shapes of the object 15 to be plated, and the shape of the extreme face, that is, the cross section of the rod-shaped electrode 11 is determined in accordance with the contour shape of the surface to be plated. In other words, the contour shape of the extreme surface 17 of the rod-shaped electrode 11 is the same as that of the plating surface 1 of the object 15 to be plated.
It is desirable that the rod-shaped electrode 11 has the same outline shape as the electrode 6, but is slightly larger in size.

In the center of the rod-shaped electrode 11, a plating liquid supply passage 18 is provided passing through in the axial direction, and a supply pipe 19 is connected to the inlet side of the supply passage 18. The supply pipe 19 is connected to the discharge side of a supply pump 21 with a flow rate control valve 20 interposed therebetween. Therefore, when the supply pump 21 is driven, the plating liquid 22 passes through the supply pipe 19 to the supply path 18 of the rod-shaped electrode 11 made of plating metal.
The liquid is guided inward, overflows onto the upper extreme surface 17, and flows downward along the outer peripheral surface of the electrode 11. At this time, what is important is to form a coating 23 with the plating liquid 22 on the extreme surface 17 of the rod-shaped electrode 11. The thickness of this liquid film 23 can be adjusted by the opening degree of the flow control valve 20.
Note that the plating liquid 22 flows down the outside of the rod-shaped electrode 11.
The plating liquid is stored in the plating liquid tank 10 and returned to the plating liquid tank 25 through the discharge pipe 24.

Since the present invention is configured in this manner, when plating work is performed, the supply pump 21 is driven to supply the plating liquid 22 through the supply pipe 19 and the supply path 18 to the end surface of the rod-shaped electrode 11 made of plating metal. 17 to form a liquid film 23 of a predetermined thickness by the plating liquid 22. Next, the covered object 15
is lowered toward this liquid film 23, and as shown in FIG. The two electrodes are brought close to each other with a distance of , and are opposed to the rod-shaped electrode 11. The liquid film 2 is applied to the plating surface 16 for a predetermined period of time.
After the plated object 15 is brought into contact with the object 3 and plated, the object 15 to be plated is pulled upward. This covering item 15
Of course, the time period for which the plating surface 16 is placed in the liquid film 23 is determined by the desired plating thickness.

In addition, in the above embodiment, the covered object 15
Since the plating surface was circular, the cross-sectional shape of the rod-shaped electrode was made circular, but the present invention is not limited to these shapes.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the plating liquid overflows onto the upper extreme surface of the rod-shaped electrode through the plating liquid supply channel bored in the center of the rod-shaped electrode made of plated metal. The surface of the object to be plated is placed in this liquid film, so that the plating liquid contacts only the areas that need plating, and removes unnecessary parts. In the part,
Since there is no contact with the plating liquid, it is possible to reliably apply plating to only a part of the surface of the object to be plated without performing a masking process. In addition, the plating liquid film formed on the extreme surface of the rod-shaped electrode becomes a thin liquid film in a fluid state due to the continuously supplied plating liquid, and the plating liquid film forms on the extreme surface of the rod-shaped electrode made of plating metal. Since the plating surfaces of the plating object face each other with a small interval, the plating metal ion depletion layer near the plating surface of the object to be plated becomes smaller, and the plating speed is 10 times faster than that of the general immersion plating method. ~100 times faster plating speed can be obtained.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing an embodiment of an electroplating apparatus according to the present invention, FIG. 2 is an explanatory view showing the proximity of an object to be plated and a rod-shaped electrode made of a metal to be plated during plating, and FIG. FIG. 3 is an explanatory diagram showing an example of a conventional electroplating apparatus, and FIG. 4 is an explanatory diagram showing another example of the conventional electroplating apparatus. DESCRIPTION OF SYMBOLS 10... saucer, 11... rod-shaped electrode made of plating metal, 15... plating object, 18... supply path, 20... flow rate control valve, 21... supply pump, 22... plating liquid,
23...Liquid film.

Claims (1)

[Claims] 1. A rod-shaped electrode made of plating metal is provided, the cross-sectional shape of which is the same as the shape of the plating surface of the object to be plated, and which has a supply passage for plating liquid passing through the object in the axial direction in the center. The surface to be plated of the object is opposed to the upper end surface of the rod-shaped electrode at a small distance, and the plating liquid is supplied from the lower end side of the rod-shaped electrode to the plating liquid supply path to plate the object on the upper end surface of the rod-shaped electrode. An electrical device characterized in that a liquid film is formed, the plating surface of the object to be plated is placed in the plating liquid film, and a plating voltage is applied between the rod-shaped electrode and the object to be plated. Plating device.