JPH044749U - - Google Patents
Info
- Publication number
- JPH044749U JPH044749U JP1990044895U JP4489590U JPH044749U JP H044749 U JPH044749 U JP H044749U JP 1990044895 U JP1990044895 U JP 1990044895U JP 4489590 U JP4489590 U JP 4489590U JP H044749 U JPH044749 U JP H044749U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- adjusting means
- tension adjusting
- rotating drum
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一具体例の略示正面図、第２
図は、その要部の拡大正面図である。第３図はワ
イヤボンダの従来例を示す概略正面図である。 １……スプール、２……ワイヤ、３……キヤピ
ラリ、１１……負圧吸引装置、１２……負圧吸引
孔、１３……吸込み防止部材。
図は、その要部の拡大正面図である。第３図はワ
イヤボンダの従来例を示す概略正面図である。 １……スプール、２……ワイヤ、３……キヤピ
ラリ、１１……負圧吸引装置、１２……負圧吸引
孔、１３……吸込み防止部材。
Claims (1)
- 【実用新案登録請求の範囲】 ワイヤの巻回スプールとボンデイング用キヤピ
ラリとの間にワイヤの張力を調節する手段を設け
たワイヤボンダにおいて、 上記ワイヤの張力調節手段を、外周面の周方向
に多数の吸引孔を開口させ、かつ吸引孔開口面を
多孔質部材にて被覆した回転ドラムにて構成しワ
イヤを回転ドラムの周面に沿つて配設したことを
特徴とするワイヤボンダ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044895U JPH044749U (ja) | 1990-04-25 | 1990-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990044895U JPH044749U (ja) | 1990-04-25 | 1990-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044749U true JPH044749U (ja) | 1992-01-16 |
Family
ID=31558601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990044895U Pending JPH044749U (ja) | 1990-04-25 | 1990-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044749U (ja) |
-
1990
- 1990-04-25 JP JP1990044895U patent/JPH044749U/ja active Pending