JPH044757U - - Google Patents
Info
- Publication number
- JPH044757U JPH044757U JP4539090U JP4539090U JPH044757U JP H044757 U JPH044757 U JP H044757U JP 4539090 U JP4539090 U JP 4539090U JP 4539090 U JP4539090 U JP 4539090U JP H044757 U JPH044757 U JP H044757U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer
- holding ring
- pasting
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案の一具体例を示す半導体ウエー
ハ貼付装置の概略側面図、第２図はその粘着テー
プ供給部分の概略正面図である。第３図は従来の
半導体ウエーハ貼付装置の概略正面図である。
１……貼付ステージ、２……半導体ウエーハ、
３……粘着テープ、４……ウエーハ保持リング、
１４，１５……ハンドリングアーム、１８，１９
……吸着パツド。
FIG. 1 is a schematic side view of a semiconductor wafer bonding apparatus showing a specific example of the present invention, and FIG. 2 is a schematic front view of the adhesive tape supply section thereof. FIG. 3 is a schematic front view of a conventional semiconductor wafer bonding apparatus. 1... Pasting stage, 2... Semiconductor wafer,
3... Adhesive tape, 4... Wafer holding ring,
14, 15...Handling arm, 18, 19
...Adsorption pad.
Claims (1)
粘着テープを貼付ける装置において、 貼付ステージの側方に、ウエーハ保持リングの
吸着パツドを具えたウエーハ保持リングのハンド
リングアームと、半導体ウエーハの吸着パツドを
具えた半導体ウエーハのハンドリングアームを、
それぞれ回動可能に配置し、前記貼付けステージ
の上面に載置された粘着テープの上に、前記両ハ
ンドリングアームの回動を介して半導体ウエーハ
とウエーハ保持リングを、圧着可能に位置決め固
定し得るように構成したことを特徴とする半導体
ウエーハ貼付装置。[Scope of Utility Model Registration Claim] In an apparatus for pasting adhesive tape on the back side of a semiconductor wafer prior to dicing, a handling arm of a wafer holding ring equipped with a suction pad for a wafer holding ring on the side of a pasting stage, and a semiconductor wafer. A semiconductor wafer handling arm equipped with a wafer suction pad,
The semiconductor wafer and the wafer holding ring are arranged so as to be rotatable, and the semiconductor wafer and the wafer holding ring can be positioned and fixed in a press-bondable manner on the adhesive tape placed on the upper surface of the pasting stage through the rotation of both the handling arms. A semiconductor wafer bonding device characterized by having the following configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4539090U JPH044757U (en) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4539090U JPH044757U (en) | 1990-04-26 | 1990-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044757U true JPH044757U (en) | 1992-01-16 |
Family
ID=31559524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4539090U Pending JPH044757U (en) | 1990-04-26 | 1990-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044757U (en) |
-
1990
- 1990-04-26 JP JP4539090U patent/JPH044757U/ja active Pending
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