JPH044762U - - Google Patents
Info
- Publication number
- JPH044762U JPH044762U JP4489990U JP4489990U JPH044762U JP H044762 U JPH044762 U JP H044762U JP 4489990 U JP4489990 U JP 4489990U JP 4489990 U JP4489990 U JP 4489990U JP H044762 U JPH044762 U JP H044762U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- slug
- glass sleeve
- lead
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 241000237858 Gastropoda Species 0.000 claims 1
- 239000002893 slag Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案装置の実施例を示す要部縦断面
図である。第２図はＤＨＤ型ダイオードの縦断面
図、第３図乃至第５図は従来の封着装置を示した
もので、第３図は下リードを支承した下治具の要
部縦断面図、第４図は上スラグ部を上方に保持し
て上リードを支承した上治具の要部縦断面図、第
５図は下治具上のガラススリーブに上治具で支承
された上リードを落下させる要領を示す要部縦断
面図である。
２……上リード、３……下リード、６，７……
スラグ部、８……ガラススリーブ、８ａ……上端
開口縁、９……半導体ペレツト、１０……下治具
、１１……上治具、１５……下面、１８……シヤ
ツタ、２１……凹部、２１ａ……開口縁。
FIG. 1 is a longitudinal cross-sectional view of a main part showing an embodiment of the device of the present invention. Fig. 2 is a longitudinal sectional view of a DHD type diode, Figs. 3 to 5 show a conventional sealing device, and Fig. 3 is a longitudinal sectional view of the main part of the lower jig supporting the lower lead. Figure 4 is a vertical sectional view of the main part of the upper jig that holds the upper slug part upward and supports the upper lead, and Figure 5 shows the upper lead supported by the upper jig on the glass sleeve on the lower jig. FIG. 3 is a vertical cross-sectional view of a main part showing how to drop it. 2...Top lead, 3...Bottom lead, 6,7...
Slag part, 8...Glass sleeve, 8a...Top opening edge, 9...Semiconductor pellet, 10...Lower jig, 11...Upper jig, 15...Lower surface, 18...Shutter, 21...Recessed portion , 21a...opening edge.
Claims (1)
に設けたスラグ部間に半導体ペレツトを挾持し、
スラグ部の外周面とガラススリーブの内周面とを
封着してなる半導体装置の封着治具であつて、下
リードを、そのスラグ部を上向きにして支承し、
かつ、下スラグ部に外嵌されたガラススリーブが
載置されるカーボン製の下治具と、上リードを、
そのスラグ部を下向きにして下リードの上方同軸
位置に支承し、かつ、下面に上リードのスラグ部
が収容される凹部を上記ガラススリーブと同芯状
に対向させて形成したカーボン製の上治具と、下
治具と上治具との間に開閉可能に配設され、かつ
、上治具の底板を兼ねるシヤツタとを具備するも
のにおいて、 上記上治具の下面に、上リードのスラグ部が収
容される凹部を、その開口縁を下治具上のガラス
スリーブの上端開口縁より外方に位置するように
開口形成したことを特徴とする半導体装置の封着
治具。[Scope of Claim for Utility Model Registration] A semiconductor pellet is sandwiched between slugs provided at opposite ends of upper and lower leads within a glass sleeve,
A sealing jig for a semiconductor device formed by sealing the outer peripheral surface of a slug portion and the inner peripheral surface of a glass sleeve, the lower lead being supported with the slug portion facing upward,
In addition, a carbon lower jig on which the glass sleeve externally fitted on the lower slug part is placed, and an upper lead,
The upper sleeve made of carbon is supported coaxially above the lower lead with its slug facing downward, and has a concave portion on the lower surface in which the slug portion of the upper lead is accommodated, facing coaxially with the glass sleeve. and a shutter which is arranged so as to be openable and closable between the lower jig and the upper jig and which also serves as the bottom plate of the upper jig, wherein the slug of the upper lead is attached to the lower surface of the upper jig. 1. A sealing jig for a semiconductor device, characterized in that a recess in which a glass sleeve is housed is formed such that its opening edge is positioned outward from the upper opening edge of a glass sleeve on a lower jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4489990U JPH044762U (en) | 1990-04-25 | 1990-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4489990U JPH044762U (en) | 1990-04-25 | 1990-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044762U true JPH044762U (en) | 1992-01-16 |
Family
ID=31558609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4489990U Pending JPH044762U (en) | 1990-04-25 | 1990-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044762U (en) |
-
1990
- 1990-04-25 JP JP4489990U patent/JPH044762U/ja active Pending
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