JPH044772U - - Google Patents
Info
- Publication number
- JPH044772U JPH044772U JP4421490U JP4421490U JPH044772U JP H044772 U JPH044772 U JP H044772U JP 4421490 U JP4421490 U JP 4421490U JP 4421490 U JP4421490 U JP 4421490U JP H044772 U JPH044772 U JP H044772U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor laser
- earth
- earth lead
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
Description
第１図は本考案半導体レーザ装置の第１の実施
例を示す斜視図、第２図Ａ乃至Ｃは第１図に示し
た半導体レーザ装置の製造方法を工程順に示す斜
視図、第３図Ａ，Ｂは本考案半導体レーザ装置の
第２の実施例を互いに異なる角度から視た斜視図
、第４図Ａ，Ｂは第３図に示した半導体レーザ装
置の製造方法を工程順に示す斜視図、第５図及び
第６図Ａ，Ｂは本考案半導体レーザ装置の第３の
実施例を説明するためのもので、第５図はアース
リードの斜視図、第６図Ａはリード保持体の斜視
図、同図Ｂはリード保持体の正面図、第７図はア
ースリードの変形例の斜視図、第８図乃至第１０
図は各別の従来例を示す斜視図である。
符号の説明、１……アースリード、２ａ……折
り曲げ部、３……アースリードの一部、４……リ
ード保持体、５……リード、６……係合部、７…
…素子位置決め部、９……半導体レーザ素子、１
１……アースリードの一部、１２……係合部、１
３……折り曲げ部、１８……アースリードの一部
、１９……係合部。
FIG. 1 is a perspective view showing a first embodiment of the semiconductor laser device of the present invention, FIGS. 2A to C are perspective views showing the manufacturing method of the semiconductor laser device shown in FIG. 1 in order of steps, and FIG. 3A , B are perspective views of a second embodiment of the semiconductor laser device of the present invention viewed from different angles; FIGS. 4A and 4B are perspective views showing the manufacturing method of the semiconductor laser device shown in FIG. 3 in order of steps; 5 and 6A and 6B are for explaining the third embodiment of the semiconductor laser device of the present invention, FIG. 5 is a perspective view of the ground lead, and FIG. 6A is a perspective view of the lead holder. Figure B is a front view of the lead holder, Figure 7 is a perspective view of a modified example of the earth lead, and Figures 8 to 10.
The figures are perspective views showing different conventional examples. Explanation of symbols: 1...Earth lead, 2a...Bending portion, 3...Part of earth lead, 4...Lead holder, 5...Lead, 6...Engaging portion, 7...
...Element positioning section, 9...Semiconductor laser element, 1
1...Part of earth lead, 12...Engagement part, 1
3...Bending portion, 18...Part of the earth lead, 19...Engaging portion.
Claims (1)
半導体レーザ素子を位置決めする素子位置決め部
を有し、リードが貫設された絶縁体からなり、上
記アースリードの上記一部との係合部にての係合
により位置決めされて上記アースリードに固定さ
れたリード保持体と、 上記素子位置決め部により位置決めされてアー
スリードにボンデイングされ、電極が上記リード
と接続された半導体レーザ素子と、 からなり、 上記半導体レーザ素子がアースリード又はリー
ド保持体の折曲げ部によつてガードされた ことを特徴とする半導体レーザ装置。[Scope of Claim for Utility Model Registration] An insulator comprising an earth lead, an engaging part that engages with a part of the earth lead, and an element positioning part that positions a semiconductor laser element, and through which the lead is inserted; A lead holder is positioned by engagement with the part of the earth lead and fixed to the earth lead, and a lead holder is positioned by the element positioning part and bonded to the earth lead, and the electrode is positioned by the element positioning part and bonded to the earth lead. 1. A semiconductor laser device comprising: a semiconductor laser element connected to a lead, wherein the semiconductor laser element is guarded by a ground lead or a bent portion of a lead holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4421490U JP2510162Y2 (en) | 1990-04-25 | 1990-04-25 | Semiconductor laser equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4421490U JP2510162Y2 (en) | 1990-04-25 | 1990-04-25 | Semiconductor laser equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH044772U true JPH044772U (en) | 1992-01-16 |
| JP2510162Y2 JP2510162Y2 (en) | 1996-09-11 |
Family
ID=31557313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4421490U Expired - Fee Related JP2510162Y2 (en) | 1990-04-25 | 1990-04-25 | Semiconductor laser equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510162Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170741A (en) * | 2008-01-18 | 2009-07-30 | Rohm Co Ltd | Semiconductor laser device and its production process |
| JP2011091105A (en) * | 2009-10-20 | 2011-05-06 | Shinko Electric Ind Co Ltd | Package for semiconductor laser, semiconductor laser device, and method of manufacturing the same |
-
1990
- 1990-04-25 JP JP4421490U patent/JP2510162Y2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170741A (en) * | 2008-01-18 | 2009-07-30 | Rohm Co Ltd | Semiconductor laser device and its production process |
| JP2011091105A (en) * | 2009-10-20 | 2011-05-06 | Shinko Electric Ind Co Ltd | Package for semiconductor laser, semiconductor laser device, and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2510162Y2 (en) | 1996-09-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |