JPH044780U - - Google Patents
Info
- Publication number
- JPH044780U JPH044780U JP4413690U JP4413690U JPH044780U JP H044780 U JPH044780 U JP H044780U JP 4413690 U JP4413690 U JP 4413690U JP 4413690 U JP4413690 U JP 4413690U JP H044780 U JPH044780 U JP H044780U
- Authority
- JP
- Japan
- Prior art keywords
- mounting pad
- component mounting
- wiring board
- printed wiring
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例を示す図で、印刷
配線板に形成された部品取付けパツドを示す図、
第２図、第３図は従来の部品取付パツドを示す図
、第４図〜第７図は実施例の変形図である。
１……チツプ部品、２……チツプ部品の電極、
３……部品取付パツド、４……チツプ部品用パタ
ーン。なお、図中、同一符号は同一、又は相当品
を示す。
FIG. 1 is a diagram showing an embodiment of this invention, showing a component mounting pad formed on a printed wiring board;
FIGS. 2 and 3 are views showing conventional component mounting pads, and FIGS. 4 to 7 are modified views of the embodiment. 1... Chip parts, 2... Electrodes of chip parts,
3...Parts mounting pad, 4...Chip parts pattern. In addition, in the figures, the same reference numerals indicate the same or equivalent products.
Claims (1)
部品取付パツドの周囲形状に凹部または凸部を設
け直線部分を少なく形成したことを特徴とする印
刷配線板の部品取付パツド。 1. A component mounting pad for a printed wiring board, characterized in that a concave or convex portion is provided in the peripheral shape of the component mounting pad to which a chip component is soldered, and a few linear portions are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4413690U JPH044780U (en) | 1990-04-25 | 1990-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4413690U JPH044780U (en) | 1990-04-25 | 1990-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044780U true JPH044780U (en) | 1992-01-16 |
Family
ID=31557168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4413690U Pending JPH044780U (en) | 1990-04-25 | 1990-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044780U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031937A (en) * | 2001-07-18 | 2003-01-31 | Sony Corp | Land structure for soldering surface mount components |
-
1990
- 1990-04-25 JP JP4413690U patent/JPH044780U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031937A (en) * | 2001-07-18 | 2003-01-31 | Sony Corp | Land structure for soldering surface mount components |