JPH0447970Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field] The present invention relates to a hybrid circuit formed by connecting a substrate on which an arbitrary circuit is configured in addition to an integrated circuit.
The present invention relates to a structure suitable for reducing its thickness.

[Prior art and its problems]

In the current situation where most electronic circuits are integrated circuits, there are some circuits that include inductance, such as delay line circuits made up of a combination of coils and capacitors, which are difficult to integrate. If such a circuit is included, it must be connected to the outside of the integrated circuit. Such an example also corresponds to the case where a buffered delay line is constructed by combining a delay line with a saturation type logic circuit using TTL elements.

Then, configure a delay line circuit by arranging coils and capacitors on the board, stacking it on the integrated circuit's flat package, connecting both circuits via the flat package's terminals, and connecting the external terminals to the dual in-line package. A hybrid circuit exposed to the outside (hereinafter referred to as DIP) is known from Japanese Utility Model Application Laid-Open No. 58-89953.

However, in the conventional hybrid circuit, as shown in the explanatory diagram of FIG. 5, the coil 1 and the capacitor 2 are both located on the substrate, on the opposite side from the flat package 4. Further, the widths of the flat package 4 and the board are approximately the same, and connection between both circuits is made by terminals 5 bent upwards of the flat package 4 on the sides of the board 3. Also, the external terminal 7 is connected to the board 3.
This is done by means of terminals 6 protruding from the sides of the flat package 4 or from the sides of the flat package 4. Therefore, the substrate 3
In the vicinity of the sides, it is necessary to connect the external terminals 7 and the terminals 6, the board 3 and the external terminals 7, and the board 3 and the terminals 5, respectively, and the connection structure is complicated and short-circuit accidents are likely to occur. Furthermore, since it is difficult to place circuit elements on the side of the flat package 4 where the connection structure is complicated, the circuit elements constituting the flat package 4, the board 3, and the delay line are stacked one after another in the same direction. , it is difficult to reduce the thickness T of the DIP, which is indicated by the dashed line. When the hybrid circuit is attached to another circuit board together with other circuit components, the thickness T becomes thicker than the other circuit components.
This is undesirable in terms of reducing the overall thickness of the circuit board.

〔the purpose〕

The object of this invention is to provide a hybrid circuit which enables a thinner design by simplifying the connection structure between the terminals by connecting the external terminals and the terminals of the flat package on the outer surface of the flat package opposite the substrate.

[Technical means to solve problems]

In the present invention, a board on which a circuit including a coil is configured and a flat package of an integrated circuit having a smaller plane area than the board are superimposed, and both circuits are connected through terminals of the flat package.
It is a hybrid circuit that is entirely sealed in resin with at least one of the external terminals connected to the integrated circuit exposed, and the tip of the external terminal connected to the integrated circuit is placed along the outer surface of the flat package. The terminal of the flat package is bent and extends to the outer surface opposite to the substrate, and is connected to the terminal of the flat package on the outer surface opposite to the substrate.

〔Example〕

Taking the circuit diagram of a buffered delay line shown in FIG. 4 as an example, an explanation will be given below with reference to FIGS. 1 to 3 showing embodiments of the hybrid circuit of the present invention.

FIG. 1 is an explanatory view of assembly, FIG. 2 is an exploded perspective view, and FIGS. 3a and 3b are plan views of the connection portion between the external terminal and the terminal of the flat package.

In Figure 4, 10 is a TTL element, 11 is an input terminal, 12 is a ground terminal, 13 to 17 are output terminals, 18 is a power supply terminal, 19 is a coil, 20
is a capacitor, and 21 is a resistor. and six
The TTL element 10 is constructed in a flat package 30 of the integrated circuit shown in FIGS.

The substrate 31 has holes 32 and 34 penetrating its surface.
are provided, and grooves 33 are provided on the sides. Insert the flat package 30 into the hole 34 and groove 33 from below.
By fitting the terminals 35 bent upward, the board 31 and the flat package 30 are overlapped. The substrate 31 is made wider than the plane area of the flat package 30 mainly by making its width wider than the width W of the flat package 30. The hole 32 is for fitting the coil 19, and the coil 19 is wound around the drum core.
In consideration of the case where the drum core is installed upright, it is made into a circular shape that is approximately the same size as the tsuba of the drum core. The hole 32 is located at a position where the substrate 31 and the flat package 30 do not overlap, and the coil 19 fitted into the hole 32 from below is inserted into the flat package 30 as shown in FIG.
located next to. The coil 19 is fixed from the upper side of the substrate 31 to the adhesive surface of an adhesive tape 41 that closes the bottom of the hole 32.

Note that the board 31 in FIG. 2 is illustrated with circuit elements corresponding to the dotted lines in FIG. For this reason, the conductor patterns formed around the holes 34 and grooves 33 are not shown.

The flat package 30 is of a 14-pin type with seven terminals exposed on each side of the opposite side, except for the terminal 35 which is bent upward for connection to the circuit on the board 31. 36
is bent along its outer surface and extends to the outer surface 42 on the opposite side from the substrate 31. Terminal 36 then connects to external terminal 37 on outer surface 42 . External terminal 3
There are two types of tip 7: one that is split into two as shown in Figure 2, and one that is elongated. , the elongated tip 3 as shown in Figure 3b.
9 is soldered along with the terminal 36 to widen its surface to obtain soldering reliability. The elongated shape of the tip 39 allows the terminals 36 of the flat package 30 to be bent downward continuously, rather than being bent up and down every other terminal as shown in FIG. In this case, the external terminal 37 serves to prevent a short-circuit accident at the tip that occurs when the external terminal 37 is close to each other.

The upwardly bent terminal 35 is soldered to the conductor pattern around the hole 34 and groove 33. The six terminals 35 are numbered 5 from 13 to 17 in FIG.
The input side terminal of TTL element 10 connected to the output terminal of , and the TTL element 1 connected to input terminal 11
They correspond to the output side terminals of 0, respectively. Also, the eight terminals 36 bent downward are 13 to 17.
Output terminal up to, input terminal 11, power terminal 18,
They correspond to the ground terminals 12, respectively. The whole is then sealed with resin as shown by the dashed line in Figure 1, and DIP
The internal circuit is drawn out to the outside by an external terminal 37.

The external terminal 37 is bent along the outer surface of the DIP and extends to the bottom surface 40, so that when it is attached to another circuit board together with other circuit components, it can be connected directly to the conductor pattern of the other circuit board.

In the embodiment, all of the external terminals 37 are connected to the terminals 36 of the flat package 30, but it is also possible to pull out some of the external terminals from the sides of the board 31 by changing the design. In this case, grooves 33 may be provided on opposite sides of the substrate 31. Moreover, the external terminal 37 can be pulled out from one side and used for purposes other than DIP. The vertical relationship between the flat package 30 and the substrate 31 may be reversed.

〔effect〕

As mentioned above, the hybrid circuit of the present invention is constructed by overlapping a flat package and a board, but the connection between the external terminal and the terminal of the flat package is made on the outer surface of the flat package on the opposite side from the board. It is separated from the connection position of other terminals. Therefore, the overall connection structure between the terminals becomes simple, and short-circuit accidents near the sides of the board can be prevented. In addition, the connection structure is simplified, and when the external terminal is pulled out horizontally from the connection position, a gap equal to the thickness of the flat package is created between the external terminal and the board with a wide planar area, and the circuit board's circuit is The circuit elements constituting the can be arranged.
By arranging circuit elements on the same side as the flat package and reducing the number of circuit elements on the opposite side, the thickness of the hybrid circuit can be reduced.

[Brief explanation of the drawing]

Fig. 1 is an explanatory assembly diagram showing an embodiment of the hybrid circuit of the present invention, Fig. 2 is an exploded perspective view, and Figs. 3a and 3b are plan views showing the connection portion between the external terminal and the terminal of the flat package. 4 are circuit diagrams of a buffered delay line, and FIG. 5 is an explanatory diagram of a conventional hybrid circuit. 30... Flat package, 31... Board,
32, 34... hole, 33... groove, 35, 36...
Terminal, 37...External terminal, 38, 39...Tip,
40...Bottom surface.

Claims (1)

[Scope of utility model registration request] A board on which a circuit including a coil is configured and a flat package of an integrated circuit having a narrower surface area than the board are stacked on top of each other, and connections between both circuits are made through terminals of the flat package, and at least one It is a hybrid circuit in which the entire circuit is sealed in resin with the external terminals connected to the circuit exposed, and the connections between the two circuits are made by connecting the sides of the board and the board surface at positions that do not overlap. This is done through the terminals of a flat package fitted into holes provided through the board, and the circuit elements constituting the circuit of the board are fixed to the side of the flat package. The tip of the external terminal to be connected is
A hybrid circuit characterized in that the hybrid circuit is connected to a terminal of the flat package which is bent along the outer surface of the flat package and extends to the outer surface opposite to the substrate, at the outer surface opposite to the substrate.