JPH0448091A - Etching device - Google Patents

Abstract

PURPOSE:To uniformly etch the whole surface of a material to be etched by separately setting a group of nozzles orthogonal to the traveling direction of the material at the center and both ends and selectively supplying a liq. etchant just regenerated to the nozzle group. CONSTITUTION:Plural spray nozzles 3 are arranged to the traveling direction of a substrate 2 above and below the substrate 2 traveling in a chamber 1. The nozzles 3 orthogonal to the traveling direction of the substrate 2 are separated into the nozzle 3a at the center and the nozzle 3b on both ends. Under such a constitution, the etchant 6 just regenerated in a regeneration tank 7 is supplied by a spraying pump P2 to the nozzle 3 at the center on the upper surface side of the substrate 2 and to the nozzle 3b on both ends on the lower surface side of the substrate 2. The etchant 6 in the chamber 1 is agitated and mixed by a circulating pump P2. Consequently, the whole surface of the substrate 2 is uniformly etched.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to an apparatus for etching printed wiring boards and the like by spraying an etching liquid, and particularly for etching large-sized objects (hereinafter referred to as substrates) uniformly over the entire surface. This invention relates to a method for obtaining industrially fine and highly accurate wiring boards by performing highly accurate etching.

[Prior Art 1] A conventional etching apparatus has spray nozzles arranged above and below a chamber, and the etching liquid in the chamber is supplied to the spray nozzles by a spray pump. A plurality of spray nozzles are arranged in a direction perpendicular to the direction in which the substrate is transported, and a plurality of spray nozzles are arranged in a direction in which the substrate is transported. When the substrate is supplied into the chamber, an etching liquid is sprayed from a spray nozzle above and below the substrate, thereby etching the substrate. Further, the etching liquid in the chamber is led to a regeneration tank, and a necessary amount of regenerating agent is added depending on the degree of fatigue of the etching liquid, and the regenerating liquid is returned to the chamber.

[Problem to be Solved by the Invention 1] However, in the conventional etching apparatus, since the same etching solution in the chamber is sprayed over the entire surface of the substrate, there is a problem that uniform etching cannot be performed over the entire surface of the substrate.

That is, when a large-sized substrate is turned on, the seven spray nozzles are oscillated in a direction perpendicular to the conveyance direction, so that etching is performed so that the entire surface of the substrate is uniformly exposed to the etching solution. However, even if spraying can be done uniformly over the entire surface of the substrate in this manner, etching is delayed in the center of the upper surface of the substrate and in the edges of 1IiI on the lower surface, resulting in a thick line. This tendency was particularly strong on the upper surface of the substrate.

The reason for this is that on the top surface, the etching solution that hits the substrate travels along the top surface of the substrate and falls from the edges, so it tends to accumulate in the center, while on the bottom surface, it does not necessarily fall from the edges of the substrate, so it etches on both ends. This is because there is a tendency for liquid to accumulate easily. Therefore, it is difficult for fresh etching liquid to come into contact with the substrate surface in the pooled area of the etching liquid, and this is considered to be a drawback in that etching in this area is delayed and lines become thicker.

The present invention has been made in view of the above points, and the purpose of the present invention is to perform uniform etching on the entire surface even of large-sized substrates, and to manufacture fine, high-precision circuit boards through etching processing. The purpose of the present invention is to provide an etching device capable of etching.

[Means for Solving the Problems] In order to achieve the above object, the etching apparatus of the present invention is an apparatus that transports the object to be etched in a chamber equipped with a large number of spray nozzles, and performs etching while continuously regenerating the etching solution. In this process, the spray nozzle group is divided into the center and both ends of the object to be etched in a direction perpendicular to the transport direction of the object to be etched, and the etching solution in the chamber and the etching solution immediately after regeneration are transferred to the spray nozzles in the center. The spray nozzle at both ends is supplied through separate systems.

In addition, the etching solution immediately after being regenerated from the regeneration tank is supplied to the spray nozzle at the center of the upper surface of the object to be etched, and the etching solution having a uniformly mixed etching solution composition is sprayed onto the remaining part of the object to be etched. It is also preferable that the liquid is supplied to a nozzle. The etching solution is supplied to the spray nozzles at both the center part of the upper surface of the object to be etched and the lower surface of the object to be etched, and the etching liquid in the chamber is also supplied to the spray nozzles corresponding to the remaining part of the object to be etched. It is also preferable to be characterized by: Furthermore, it is preferable that the apparatus is provided with means for sensing the capacity of the etching liquid in the chamber and determining the degree of regeneration of the etching liquid in the regeneration tank in accordance with this etching capacity.

[Function] Uniform etching can be achieved over the entire surface of the object to be etched (substrate) by spraying the etching solution immediately after regeneration onto areas where etching delays are likely to occur.

[Embodiment] FIGS. 1 and 2 show a front sectional view and a side sectional view of an embodiment of the etching apparatus of the present invention. A large number of spray nozzles 3 are arranged above and below the portion of the chamber 1 where the substrate 2 is transported. This number of sprays @ arrangement and substrate 2
Multiple pieces are arranged in the conveyance direction. Also spray nozzle 3
The spray 7 is divided into a nozzle 3a located at the center in a direction perpendicular to the conveying direction of the substrate 2 and a spray nozzle 3b located at both ends. The chamber 1 has a fatigue measuring section 4.
It measures the etching ability of the etching liquid 6 in the chamber 1 and directs it to the regeneration tank 7 by arrow A.
The amount of regenerant to be added is determined as shown in . Further, the etching liquid 6 in the chamber 1 is led to a regeneration tank 7, and a regenerating agent is introduced to regenerate the etching liquid 6. The paths for supplying etching liquid to the spray nozzle 3 include a first supply path 8 and a second supply path 9. The first supply path 8 is for supplying the etching liquid 6 in the chamber 1 using a spray pump P1, and includes spray nozzles 3b on both sides of the upper surface of the substrate 2 and spray nozzles 3b in the center of the lower surface of the substrate 2. The water is supplied to the spray nozzle 3a. The second supply path 9 is for supplying the etching liquid 6 immediately after regeneration from the regeneration tank 7 using a spray pump P2. It is designed to be supplied to spray 7 nozzles 3b at both ends. Further, in the chamber 1, there is a circulation pump P for stirring and mixing the etching liquid 6 in the chamber 1. It is arranged.

When the substrate 2 is supplied as shown by arrow B in FIG. 1, etching [6] is sprayed on the top and bottom of the substrate 2 in the chamber 1, and the substrate 2 is etched.

At this time, an etching solution 3 having a high etching ability is sprayed on the center of the top surface of the substrate 2 where the etching solution 6 tends to accumulate and on both ends of the bottom surface of the substrate 2 immediately after regeneration. Etching at both ends of the lower surface can be promoted, resulting in uniform etching over the entire surface of the substrate 6.

Further, FIG. 3 shows another embodiment. In the case of this embodiment, only the spray nozzle 3 on the upper surface side of the substrate 2 is divided into a spray nozzle 3a at the center and a spray nozzle 3b at both ends. It can be supplied to the spray nozzle 3a in the center.

Therefore, by spraying the etching agent 7, 6, which has a high etching ability, on the central part of the upper surface of the substrate 2 where the etching solution 6 is most likely to accumulate, uniform etching can be performed over the entire surface of the substrate 2.

[Effects of the Invention 1] As described above, the present invention divides the spray nozzle group into the central part and both ends of the object to be etched in the direction perpendicular to the conveyance direction of the object to be etched, and also separates the etching liquid in the chamber and the etching liquid immediately after regeneration. Is the etching solution separated into spray nozzles in the center and spray nozzles at both ends? This makes it possible to accelerate etching by spraying the regenerated etching solution, which has a high etching ability, on areas where etching slows down due to accumulation of etching solution. Etching (
Even substrates can be etched uniformly, and fine, high-precision printed boards for industrial use can be manufactured by etching.

In addition, in the invention according to claim 2 of the present invention, the etching solution immediately after being regenerated from the regeneration tank is supplied to the spray nozzle at the center of the upper surface of the object to be etched, and the composition of the etching solution is uniformly mixed in the chamber. Since the etching liquid is supplied to the spray nozzle corresponding to the remaining part of the object to be etched, the etching liquid with high etching ability is sprayed onto the top surface of the object to be etched, where the etching liquid tends to accumulate, thereby promoting etching. Etching can be performed uniformly over the entire surface of the etched object.

Furthermore, in the invention according to claim 3 of the present invention, the etching solution immediately after regeneration from the regeneration tank is supplied to the spray nozzles at the center of the upper surface of the object to be etched and at both ends of the lower surface of the object to be etched, and Since the etching liquid inside is supplied to the spray nozzle corresponding to the remaining part of the object to be etched, the etching liquid with high etching ability is applied to the center of the top surface and both ends of the bottom surface of the object to be etched, where etching liquid tends to accumulate. By spraying the etching material, uniform etching can be achieved over the entire surface of the object to be etched. ! -Furthermore, in the invention described in M'FC item 4 of the present invention, there is a means for sensing the capacity of the etching liquid in the chamber and determining the degree of regeneration of the etching liquid in the regeneration tank according to this etching capacity. Since the etching solution is equipped with the above, it is possible to regenerate the etching solution according to its capacity, and to keep the capacity of the etching solution constant at all times to perform uniform etching.

[Brief explanation of the drawing]

FIG. 1 is a schematic front sectional view of one embodiment of the present invention, FIG. 2 is a schematic side sectional view of the same, and FIG. 3 is a schematic side sectional view of another embodiment of the same. is a substrate, 3 is a spray nozzle, and 7 is a regeneration tank. Agent Patent Attorney Ishi 1) 议 7゛te7', Δ℃ Snore engraving Toze + Kitozo Figure 3 procedure amendment written spontaneously) August 11, 1990 1990 Patent Application No. 158007 Name of the invention etched Device 3, Relationship with the case of the person making the amendment Patent applicant address 1048 Kadoma, Kadoma City, Osaka Prefecture Name (58
3) Toshio Miyoshi, Representative of Matsushita Electric Works Co., Ltd.

Claims (1)

[Claims] [1] In an apparatus that transports an object to be etched in a chamber equipped with a large number of spray nozzles and performs etching while continuously regenerating an etching solution, the object is perpendicular to the direction of transport of the object to be etched. The spray nozzle group is divided into the center and both ends of the object to be etched, and the etching solution in the chamber and the etching solution immediately after regeneration are supplied to the center spray nozzle and the spray nozzles at both ends using separate systems. An etching device characterized by: [2] The etching solution immediately after being regenerated from the regeneration tank is supplied to the spray nozzle at the center of the top surface of the object to be etched, and the etching solution with a uniform composition mixed inside the chamber is applied to the remaining part of the object to be etched. 2. The etching apparatus according to claim 1, wherein the etching apparatus is adapted to supply the etching apparatus to a spray nozzle for spraying. [3] The etching solution immediately after regeneration from the regeneration tank is supplied to the spray nozzles at the center of the top surface of the object to be etched and at both ends of the bottom surface of the object to be etched, and the etching solution in the chamber is also applied to the remaining portion of the object to be etched. 2. The etching apparatus according to claim 1, wherein the etching apparatus is adapted to supply the spray nozzle corresponding to the etching apparatus. [4] Claim 1, Claim 2, or Claims characterized in that it comprises means for sensing the capacity of the etching liquid in the chamber and determining the degree of regeneration of the etching liquid in the regeneration tank in accordance with this etching capacity. Item 3. Etching apparatus according to item 3.