JPH0448565A - Connecting method between circuit units - Google Patents

Connecting method between circuit units

Info

Publication number
JPH0448565A
JPH0448565A JP2157047A JP15704790A JPH0448565A JP H0448565 A JPH0448565 A JP H0448565A JP 2157047 A JP2157047 A JP 2157047A JP 15704790 A JP15704790 A JP 15704790A JP H0448565 A JPH0448565 A JP H0448565A
Authority
JP
Japan
Prior art keywords
circuit board
board unit
metal piece
ground
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2157047A
Other languages
Japanese (ja)
Inventor
Kenichi Habazaki
巾崎 憲一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2157047A priority Critical patent/JPH0448565A/en
Publication of JPH0448565A publication Critical patent/JPH0448565A/en
Pending legal-status Critical Current

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は周辺機器装置の動作時において回路基板ユニ2
トからのノイズ発生の防止改良に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a circuit board unit 2 during operation of a peripheral equipment device.
This relates to improvements in preventing noise generation from sources.

〔従来の技術〕[Conventional technology]

〔発明が解決しようとする課題〕 しかし、かかる従来方法における回路基板ユニット間の
グランド(GND)ラインをワイヤーハーネス等で接続
する方法は回路基板間の取り外し及び取り付は時におい
て操作性が悪く、またコネクタ接続方法は複数のコネク
タ端子をグランド(GND)ラインにする方法としであ
るが、限られた寸法内(製品スペース、コネクタ端子数
)で信号ラインが多い場合は、グランド(GND)ライ
ンを複数のコネクタ端子として使うことができなくなり
KM工(電磁妨害)対策が不可能であった又ノイズ防止
部品(コア、フェライトビーズ)等を基板に実装しても
、EM工(電磁妨害)改善効果が表われない場合が多(
、最終対策として基板変更(基板アートワーク変更)を
しなければならない問題点を有していた。
[Problems to be Solved by the Invention] However, the conventional method of connecting the ground (GND) lines between circuit board units with a wire harness etc. sometimes has poor operability when removing and attaching the circuit boards. In addition, the connector connection method is to connect multiple connector terminals to a ground (GND) line, but if there are many signal lines within a limited size (product space, number of connector terminals), use the ground (GND) line. Since it could not be used as multiple connector terminals, countermeasures against KM (electromagnetic interference) were impossible, and even if noise prevention parts (cores, ferrite beads), etc. were mounted on the board, there was no improvement in EM (electromagnetic interference). is often not expressed (
However, as a final measure, the board had to be changed (changed the board artwork).

そこで、本発明は従来のこのような問題点を解決するた
め、回路基板ユニットの操作性を良(して、基板変更(
基板アートワーク変更)なくICMニー、(、電磁妨害
)対策できることを目的とする。
Therefore, in order to solve these conventional problems, the present invention improves the operability of the circuit board unit and makes it easier to change the circuit board.
The purpose is to provide countermeasures against ICM problems (electromagnetic interference) without changing board artwork.

また、従来のノイズ防止部品(コア、フェライトビーズ
)等の対策方法は、回路内容に共通性がな(、ノイズ防
止部品(コア、フェライトビーズ)等の数によって回路
基板ユニットの面積が大きくなって最終的には製品のデ
ザインの構成まで変更しなければならない問題点があっ
た。
In addition, conventional countermeasures for noise prevention components (cores, ferrite beads), etc. have no commonality in circuit content (and the area of the circuit board unit increases depending on the number of noise prevention components (cores, ferrite beads), etc.). In the end, there was a problem that even the structure of the product design had to be changed.

本発明はこのような点をWR拳な処理でEM工(電磁妨
害)対策をする点にある。
The purpose of the present invention is to take measures against EM (electromagnetic interference) using WR-based processing.

〔課題を解決するための手段〕[Means to solve the problem]

上記の課題を解決するため、本発明のバネ性を有する金
属片と、それに接触する金属ポストを回路基板上に取り
付けたことを特徴とする。
In order to solve the above problems, the present invention is characterized in that a metal piece having spring properties and a metal post in contact with the metal piece are mounted on a circuit board.

〔作用〕[Effect]

上記のように回路基板ユニット間の接続部分にバネ性を
有する金属片と、それに接触する金属ポストを取り付け
ると、回路基板ユニット間のグランド(GND)レベル
が同一電位レベルとなるため、回路基板ユニット周辺か
らのノイズ発生を防ぐことができる。
When a metal piece with spring properties and a metal post that contacts it are attached to the connecting part between the circuit board units as described above, the ground (GND) level between the circuit board units becomes the same potential level, so the circuit board units Noise generation from the surrounding area can be prevented.

また、ノイズ発生防止部品としてのコア、フェライトビ
ーズ等を減らすことができ回路基板ユニットの小型化が
可能となる。
In addition, the number of cores, ferrite beads, etc. as noise prevention components can be reduced, making it possible to downsize the circuit board unit.

〔実施例〕〔Example〕

以下に本発明の実施例を図面にもとづいて説明する。第
1図において回路基板ユニット1のグランドパターン上
にバネ性を有する金属片5を取り付け、回路基板ユニッ
ト2のグランドパターン上に前記金属片と接触する金属
ポスト4を取り付は回路基板ユニット2を回路基板ユニ
ット1のコネクタ5ヘセツトすることによりバネ性を有
する金属片3と、それに接触する金属ポスト4が接触し
回路基板ユニット1.2のグランド(GNI))レベル
が同一電位レベルとなる。
Embodiments of the present invention will be described below based on the drawings. In FIG. 1, a metal piece 5 having spring properties is attached on the ground pattern of the circuit board unit 1, and a metal post 4 in contact with the metal piece is attached on the ground pattern of the circuit board unit 2. When the connector 5 of the circuit board unit 1 is set, the metal piece 3 having a spring property and the metal post 4 contacting it come into contact, and the ground (GNI) level of the circuit board unit 1.2 becomes the same potential level.

この部品を詳しく説明すると、第2.第5図に示す。第
1図は、回路基板ユニット1と回路基板ユニット2がセ
ットされる前の状態である。
To explain this part in detail, see the second section. It is shown in FIG. FIG. 1 shows the state before circuit board unit 1 and circuit board unit 2 are set.

回路基板ユニット1と、回路基板ユニット2をセットす
ると第2図のようにバネ性を有する金属片「と、それに
接触する金属ポスト4が接触して回路基板ユニット1,
2のグランド(GND)レベルが同一となる。
When the circuit board unit 1 and the circuit board unit 2 are set, as shown in FIG.
The two ground (GND) levels are the same.

以上のような実施例において、回路基板ユニット1.2
のグランド(GND)レベルは同電位レベルどなる。こ
のため回路基板ユニット上からのノイズ発生を防ぐこと
ができ、KM工(電磁妨害)対策に効果がある。
In the embodiments described above, the circuit board unit 1.2
The ground (GND) level of is at the same potential level. Therefore, it is possible to prevent noise generation from above the circuit board unit, which is effective as a countermeasure against KM (electromagnetic interference).

〔発明の効果〕〔Effect of the invention〕

本発明のバネ性を有する金属片を用いた回路基板ユニッ
ト間の接続方法は、上記で説明したように、ノイズ発生
防止用部品としてのコア、フェライトビーズ等にたよら
ず簡単な処理方法でgM工(電磁妨害)対策に大きな効
果を表わす。
As explained above, the method of connecting circuit board units using metal pieces having spring properties according to the present invention does not rely on cores, ferrite beads, etc. as parts for preventing noise generation, and uses a simple processing method. It is highly effective in countering electromagnetic interference (electromagnetic interference).

また、ノイズ防止用部品としてのコア、フェライトビー
ズ等を減少することにより回路基板ユニットの面積を小
さ(することも製品全体からみた場合成果として表わす
In addition, reducing the area of the circuit board unit by reducing the number of cores, ferrite beads, etc. used as noise prevention components also represents an achievement from the perspective of the overall product.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は回路基板ユニット1と2のセット時における外
観図。 第2図は回路基板ユニット1と2がセットされる前にお
けるバネ性を有する金属片3と、それに接触する金属ボ
スト4の取り付は部の説明図。 第3図は回路基板ユニット1と2がセットされた状態で
のバネ性を有する金属片3と、それに接触する金属ボス
ト4の取り付は部の説明図。 以 上
FIG. 1 is an external view of circuit board units 1 and 2 when they are set. FIG. 2 is an explanatory diagram of the attachment of the metal piece 3 having spring properties and the metal post 4 that contacts it before the circuit board units 1 and 2 are set. FIG. 3 is an explanatory diagram of the attachment of the metal piece 3 having spring properties and the metal post 4 that contacts it when the circuit board units 1 and 2 are set. that's all

Claims (1)

【特許請求の範囲】[Claims]  回路基板ユニット同志をコネクタを介して電気的接続
を行なう電子機器において、コネクタの挿入方向にバネ
性を有する金属片と、コネクタを挿入する事で前記金属
片と接触する金属ポストを用いたことを特徴とする回路
ユニット間の接続方法。
In an electronic device that electrically connects circuit board units to each other via a connector, a metal piece having spring properties in the insertion direction of the connector and a metal post that comes into contact with the metal piece when the connector is inserted are used. Features: Connection method between circuit units.
JP2157047A 1990-06-15 1990-06-15 Connecting method between circuit units Pending JPH0448565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2157047A JPH0448565A (en) 1990-06-15 1990-06-15 Connecting method between circuit units

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2157047A JPH0448565A (en) 1990-06-15 1990-06-15 Connecting method between circuit units

Publications (1)

Publication Number Publication Date
JPH0448565A true JPH0448565A (en) 1992-02-18

Family

ID=15641036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2157047A Pending JPH0448565A (en) 1990-06-15 1990-06-15 Connecting method between circuit units

Country Status (1)

Country Link
JP (1) JPH0448565A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016047038A1 (en) * 2014-09-26 2016-03-31 株式会社デンソー Connector-equipped substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016047038A1 (en) * 2014-09-26 2016-03-31 株式会社デンソー Connector-equipped substrate
JP2016071938A (en) * 2014-09-26 2016-05-09 株式会社デンソー substrate

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