JPH0448625U - - Google Patents
Info
- Publication number
- JPH0448625U JPH0448625U JP9131490U JP9131490U JPH0448625U JP H0448625 U JPH0448625 U JP H0448625U JP 9131490 U JP9131490 U JP 9131490U JP 9131490 U JP9131490 U JP 9131490U JP H0448625 U JPH0448625 U JP H0448625U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- resin molding
- cavity
- island
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図および第２図は本考案の具体例を示す樹
脂モールド装置要部の拡大縦断面図、第３図は樹
脂モールド型半導体装置とサブランナ部分の拡大
縦断面図、第４図はランナ、サブランナおよびゲ
ートの形状を説明する樹脂モールド型半導体装置
の平面図、第５図は従来装置の部分拡大縦断面図
である。
２……リードフレーム、３……枠部、４……リ
ード、５……アイランド、６……金型、７……金
型、９……サブランナ、１０……ゲート、１１…
…キヤビテイ、１６……突出部。
1 and 2 are enlarged longitudinal sectional views of the main parts of a resin molding device showing a specific example of the present invention, FIG. 3 is an enlarged longitudinal sectional view of a resin molded semiconductor device and a sub-runner portion, and FIG. 4 is an enlarged longitudinal sectional view of a runner, FIG. 5 is a plan view of a resin molded semiconductor device illustrating the shapes of a sub-runner and a gate, and FIG. 5 is a partially enlarged vertical cross-sectional view of a conventional device. 2...Lead frame, 3...Frame, 4...Lead, 5...Island, 6...Mold, 7...Mold, 9...Subrunner, 10...Gate, 11...
...Cavity, 16...Protrusion.
Claims (1)
枠部よりアイランドに向かつて多数本のリードを
延長形成したリードフレームを挾持する上下一対
の金型衝合面に、枠部とアイランドの中間部分を
収容するキヤビテイを設け、かつ、一方の金型に
枠部を横切つてキヤビテイに樹脂をガイドするサ
ブランナを設けた樹脂モールド装置において、上
記キヤビテイと枠体の内壁間のサブランナと対向
する部分をリードフレームの厚さに略等しい高さ
突出させたことを特徴とする樹脂モールド装置。 An island is placed in the center of the frame, and the intermediate portion between the frame and the island is accommodated in the abutting surfaces of a pair of upper and lower molds that sandwich the lead frame, which has a large number of leads extending from the frame towards the island. In a resin molding machine, a resin molding apparatus is provided with a cavity for guiding the resin into the cavity, and a sub-runner for guiding the resin into the cavity across the frame on one of the molds, the part facing the sub-runner between the cavity and the inner wall of the frame is a lead frame. A resin molding device characterized in that the resin molding device has a protruding height approximately equal to the thickness of the resin molding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9131490U JPH0448625U (en) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9131490U JPH0448625U (en) | 1990-08-30 | 1990-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448625U true JPH0448625U (en) | 1992-04-24 |
Family
ID=31826816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9131490U Pending JPH0448625U (en) | 1990-08-30 | 1990-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448625U (en) |
-
1990
- 1990-08-30 JP JP9131490U patent/JPH0448625U/ja active Pending