JPH0448664U - - Google Patents
Info
- Publication number
- JPH0448664U JPH0448664U JP9009190U JP9009190U JPH0448664U JP H0448664 U JPH0448664 U JP H0448664U JP 9009190 U JP9009190 U JP 9009190U JP 9009190 U JP9009190 U JP 9009190U JP H0448664 U JPH0448664 U JP H0448664U
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- circuit board
- plate portion
- plate part
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案によるチツプ部品の実装構造の
第１の実施例を示す断面図、第２図は本実施例で
使用する接続用部材の斜視図、第３図は従来例を
示す図、第４図は従来における回路変更時の断面
図である。
１……チツプ部品、２……電極、７……半田、
１０……接続用部材、１０ａ……台板部、１０ｂ
……リード端子部、１１……回路基板、１２……
パツド、１３……接着剤。
FIG. 1 is a sectional view showing a first embodiment of a chip component mounting structure according to the present invention, FIG. 2 is a perspective view of a connecting member used in this embodiment, and FIG. 3 is a diagram showing a conventional example. FIG. 4 is a cross-sectional view when changing the conventional circuit. 1... Chip parts, 2... Electrodes, 7... Solder,
10... Connection member, 10a... Base plate part, 10b
... Lead terminal section, 11 ... Circuit board, 12 ...
Padded, 13...Adhesive.
Claims (1)
基板に実装する回路基板の部品実装構造において
、 導電性の金属板で形成され、台板部と該台板部
の一端から起立するリード端子とより成る接続用
部材の前記台板部を、回路基板に形成されたパツ
ドと電気部品の電極との間に挟み込み、前記台板
部と電極、及び台板部とパツドをそれぞれ接続固
定したことを特徴とする回路基板の部品実装構造
。[Scope of Claim for Utility Model Registration] In a component mounting structure of a circuit board in which an electrical component having electrodes along the surface at both ends is mounted on the circuit board, the base plate part is formed of a conductive metal plate and includes a base plate part and the base plate part. The base plate portion of the connection member consisting of a lead terminal standing up from one end is sandwiched between a pad formed on a circuit board and an electrode of an electrical component, and the base plate portion and the electrode and the base plate portion and A circuit board component mounting structure characterized by each pad being connected and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9009190U JPH0448664U (en) | 1990-08-30 | 1990-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9009190U JPH0448664U (en) | 1990-08-30 | 1990-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448664U true JPH0448664U (en) | 1992-04-24 |
Family
ID=31824539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9009190U Pending JPH0448664U (en) | 1990-08-30 | 1990-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448664U (en) |
-
1990
- 1990-08-30 JP JP9009190U patent/JPH0448664U/ja active Pending
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