JPH0448680U - - Google Patents
Info
- Publication number
- JPH0448680U JPH0448680U JP9129290U JP9129290U JPH0448680U JP H0448680 U JPH0448680 U JP H0448680U JP 9129290 U JP9129290 U JP 9129290U JP 9129290 U JP9129290 U JP 9129290U JP H0448680 U JPH0448680 U JP H0448680U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- base body
- semiconductor package
- ceramic
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案実施例の半導体パツケージを構
成する基体のみの平面図、第２図は第１図中のＡ
−Ａ線拡大断面図である。第３図〜第５図は、第
１図に示す基体の凹凸部の他の実施例を示してお
り、第３図ａ、第４図ａ、第５図ａはそれぞれ平
面図、第３図ｂは同図ａ中のＢ−Ｂ線断面図、第
４図ｂは同図ａ中のＣ−Ｃ線断面図、第５図ｂは
同図ａ中のＤ−Ｄ線断面図である。第６図は従来
の半導体パツケージを構成する基体の斜視図、第
７図は従来の半導体パツケージを示す断面図であ
る。
１……基体、２……キヤビテイ部、３……凹凸
部、４……平坦部。
FIG. 1 is a plan view of only the base body constituting the semiconductor package of the embodiment of the present invention, and FIG.
- It is an A line enlarged sectional view. 3 to 5 show other embodiments of the uneven portion of the base body shown in FIG. 1, and FIG. 3a, FIG. 4a, and FIG. 5a are plan views, respectively. 4b is a sectional view taken along the line C--C in FIG. 4a, and FIG. 5b is a sectional view taken along the line D-D in FIG. 5a. FIG. 6 is a perspective view of a base constituting a conventional semiconductor package, and FIG. 7 is a sectional view showing the conventional semiconductor package. 1... Base body, 2... Cavity part, 3... Uneven part, 4... Flat part.
Claims (1)
有するセラミツクス製の基体と、セラミツクス製
の蓋体とからなる半導体パツケージにおいて、上
記キヤビテイ部下面にプレス成形法により形成し
た凹凸部を具備したことを特徴とする半導体パツ
ケージ。 A semiconductor package comprising a ceramic base body having a cavity portion for attaching a semiconductor chip and a ceramic lid body, characterized in that the lower surface of the cavity is provided with an uneven portion formed by a press molding method. Packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091292U JP2532943Y2 (en) | 1990-08-30 | 1990-08-30 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091292U JP2532943Y2 (en) | 1990-08-30 | 1990-08-30 | Semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0448680U true JPH0448680U (en) | 1992-04-24 |
| JP2532943Y2 JP2532943Y2 (en) | 1997-04-16 |
Family
ID=31826779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990091292U Expired - Lifetime JP2532943Y2 (en) | 1990-08-30 | 1990-08-30 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2532943Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005045825A (en) * | 1998-12-22 | 2005-02-17 | Sony Corp | Electronic device and electronic device mounting method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6355943A (en) * | 1986-08-26 | 1988-03-10 | Matsushita Electric Works Ltd | Chip carrier |
-
1990
- 1990-08-30 JP JP1990091292U patent/JP2532943Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6355943A (en) * | 1986-08-26 | 1988-03-10 | Matsushita Electric Works Ltd | Chip carrier |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005045825A (en) * | 1998-12-22 | 2005-02-17 | Sony Corp | Electronic device and electronic device mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2532943Y2 (en) | 1997-04-16 |