JPH0449838U - - Google Patents
Info
- Publication number
- JPH0449838U JPH0449838U JP9261690U JP9261690U JPH0449838U JP H0449838 U JPH0449838 U JP H0449838U JP 9261690 U JP9261690 U JP 9261690U JP 9261690 U JP9261690 U JP 9261690U JP H0449838 U JPH0449838 U JP H0449838U
- Authority
- JP
- Japan
- Prior art keywords
- fixing ring
- ceramic substrate
- pressure sensor
- substrate
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は本考案の一実施例を示す要部断面図、
第２図は第１図の斜視図、第３図は本考案の他の
実施例を示す要部断面図、第４図は樹脂製固定リ
ングにセラミツク基板を装着した状態を示す底面
図、第５図は樹脂製固定リングに基板を装着した
状態を示す底面図、第６図は第５図の側面図、第
７図は樹脂製固定リングを用いたときの他の実施
例を示す底面図、第８図は従来例の一部断面を含
む構成図である。
１０，５２……固定リング、１１，１３……基
板装着溝、１２，５３……セラミツク基板、１２
Ａ……角、１４，１６……突起、１５……間隙、
５０……ケース、５１……段部。
FIG. 1 is a cross-sectional view of essential parts showing an embodiment of the present invention;
Fig. 2 is a perspective view of Fig. 1, Fig. 3 is a sectional view of main parts showing another embodiment of the present invention, Fig. 4 is a bottom view showing a state in which a ceramic substrate is attached to a resin fixing ring, and Fig. Fig. 5 is a bottom view showing a state in which a board is attached to a resin fixing ring, Fig. 6 is a side view of Fig. 5, and Fig. 7 is a bottom view showing another embodiment when a resin fixing ring is used. , FIG. 8 is a block diagram including a partial cross section of a conventional example. 10, 52... Fixed ring, 11, 13... Board mounting groove, 12, 53... Ceramic board, 12
A... Corner, 14, 16... Protrusion, 15... Gap,
50...Case, 51...Step part.
補正 平２．１２．１７
実用新案登録請求の範囲を次のように補正する
。Amendment 2.12.17 1992 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
(1) 増幅回路用のセラミツク基板１２が筒状の
ケース内に固定リング１０を介して固定されてい
る圧力センサにおいて、前記固定リング１０を弾
性体で構成し、この固定リング１０の端部に基板
装着溝１１，１３を形成し、この基板装着溝１１
，１３内に前記セラミツク基板１２を装着したこ
とを特徴とする圧力センサ。
(2) 増幅回路用のセラミツク基板１２が筒状の
ケース内に固定リング１０を介して固定されてい
る圧力センサにおいて、前記固定リング１０の端
面に複数の突起１４，１６を形成し、各突起１４
，１６の略中心を結ぶ円内に前記セラミツク基板
１２を装着したことを特徴とする圧力センサ。[Claims for Utility Model Registration] (1) In a pressure sensor in which a ceramic substrate 12 for an amplifier circuit is fixed in a cylindrical case via a fixing ring 10, the fixing ring 10 is made of an elastic body, Board mounting grooves 11 and 13 are formed at the end of this fixing ring 10, and this board mounting groove 11
, 13, and the ceramic substrate 12 is mounted inside the pressure sensor. (2) In a pressure sensor in which a ceramic substrate 12 for an amplifier circuit is fixed in a cylindrical case via a fixing ring 10, a plurality of protrusions 14 and 16 are formed on the end face of the fixing ring 10, and each protrusion 14
.
Claims (1)
筒状のケース内に固定リング１０を介して固定さ
れている圧力センサにおいて、前記固定リング１
０を弾性体で構成し、この固定リング１０の端部
に基板装着溝１１，１３を形成し、この基板装着
溝１１，１３内に前記セラミツク基板１２を装着
したことを特徴とする圧力センサ。 (2) 検出素子の装着用のセラミツク基板１２が
筒状のケース内に固定リング１０を介して固定さ
れている圧力センサにおいて、前記固定リング１
０の端面に複数の突起１４，１６を形成し、各突
起１４，１６の略中心を結ぶ円内に前記セラミツ
ク基板１２を装着したことを特徴とする圧力セン
サ。[Claims for Utility Model Registration] (1) In a pressure sensor in which a ceramic substrate 12 for mounting a detection element is fixed in a cylindrical case via a fixing ring 10, the fixing ring 1
A pressure sensor characterized in that the fixing ring 10 is made of an elastic body, substrate mounting grooves 11 and 13 are formed at the ends of the fixing ring 10, and the ceramic substrate 12 is mounted in the substrate mounting grooves 11 and 13. (2) In a pressure sensor in which a ceramic substrate 12 for mounting a detection element is fixed in a cylindrical case via a fixing ring 10, the fixing ring 1
1. A pressure sensor characterized in that a plurality of projections 14, 16 are formed on the end face of the ceramic substrate 12, and the ceramic substrate 12 is mounted within a circle connecting approximately the centers of the projections 14, 16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9261690U JPH0449838U (en) | 1990-09-03 | 1990-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9261690U JPH0449838U (en) | 1990-09-03 | 1990-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0449838U true JPH0449838U (en) | 1992-04-27 |
Family
ID=31829223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9261690U Pending JPH0449838U (en) | 1990-09-03 | 1990-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0449838U (en) |
-
1990
- 1990-09-03 JP JP9261690U patent/JPH0449838U/ja active Pending
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