JPH0450112B2 - - Google Patents

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Publication number
JPH0450112B2
JPH0450112B2 JP15371784A JP15371784A JPH0450112B2 JP H0450112 B2 JPH0450112 B2 JP H0450112B2 JP 15371784 A JP15371784 A JP 15371784A JP 15371784 A JP15371784 A JP 15371784A JP H0450112 B2 JPH0450112 B2 JP H0450112B2
Authority
JP
Japan
Prior art keywords
flux
group
brazing
kbf
fluorides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15371784A
Other languages
Japanese (ja)
Other versions
JPS6133791A (en
Inventor
Takashi Fukumaki
Katsuhiko Shioda
Satoshi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15371784A priority Critical patent/JPS6133791A/en
Publication of JPS6133791A publication Critical patent/JPS6133791A/en
Publication of JPH0450112B2 publication Critical patent/JPH0450112B2/ja
Granted legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3606Borates or B-oxides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3603Halide salts
    • B23K35/3605Fluorides

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Prevention Of Electric Corrosion (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

〔発明の利用分野〕 本発明は新規なろう付用フラツクスに係り、特
にAlまたはAl合金の板、管、その他の構成物、
電子部品の接合に好適なろう付用フラツクスに関
するものである。 〔発明の背景〕 従来、AlまたはAl合金のろう付には、塩化物
系のフラツクスが一般的に用いられている。しか
しながら、この塩化物系のフラツクスは吸湿性が
大きく、湿気が存在すると吸湿して母材を腐食さ
せることがある。そのため、塩化物系のフラツク
スにおいては、ろう付後に残渣フラツクスを完全
に除去しなければならないという問題があつた。 このような問題点を改良する従来のフラツクス
としては、米国特許3951328号に示すように、弗
化物のフラツクスが提案されている。 この弗化物系フラツクスは、KFとAlF3を混
合、溶解して、K3AlF6とKAlF4の混合物を含む
ようにしたものである。 したがつて、このフラツクスにおいては、KF
−AlF3の状態図の共晶点よりもKF含有量を微量
増加しても融点が著しく上昇する。たとえば、
KFが50重量%(AlF350重量%)では、フラツク
スの融点は560〜700℃を示すようになる。そこ
で、ろう付が通常行われる600〜620℃の範囲で
は、半溶融状態となり、フラツクスの活性度が低
下し、ぬれ広がり性が悪くなつて末ろう付品が発
生する恐れがある。また、このAlおよびAl合金
用フラツクスにおいては、ろう付後の耐食性を向
上させる効果がなく、ろう付製品の耐食性に欠陥
を生ずることがあるという問題点を有していた。 〔発明の目的〕 本発明の目的は、吸湿性がないとともに、ぬれ
広がり性に優れ、且つ被接合表面に耐食性金属、
特にZnを残留させることにより耐食性を向上さ
せるろう付用フラツクスを提供することにある。 〔発明の概要〕 本発明は、KBF4を主成分とし、該KBF4B
族、A族、B族、B族金属の弗化物を少なく
とも1種含有し、前記B族及びB族金属の弗化
物を20重量%以下、A族及びB族金属の弗化物
を45重量%以下含有するろう付用フラツクスであ
る。 ろう付後、残渣フラツクスを除去しなくとも耐
食性を保持することができるフラツクスの必須条
件は、ろう付後の表面における残渣フラツクスに
吸湿性の成分が存在しないことである。非吸湿性
のフラツクスとしては弗化物系の成分が多い。ま
たAlおよびAl合金部材の酸化皮膜を除去し、ぬ
れ広がりを大きくするのは塩化物系の成分が一般
的に使用されている。しかし塩化物系のほとんど
は吸湿性を有するため、ろう付後の残渣フラツク
スを完全に除去しないと、耐食性を著しく低下さ
せる。そこで、特にAlおよびAl合金に対する弗
化物系フラツクスとして、好適な融点、ぬれ広が
り性および犠牲陽極皮膜を形成する作用を付与す
るために種々、検討した結果、KBF4にろうのぬ
れ性を増す元素およびこれらの弗化物、被ろう付
物の表面に犠牲陽極皮膜を形成する元素およびこ
れらの弗化物を単独あるいは複合で付加すること
により、優れたろう付特性を示すことを見い出し
た。 本発明はこのような知見に基づいてなされたも
のであつて、KBF4に添加してろうのぬれ性を増
す弗化物、もしくはKBF4に添加して被ろう付物
の表面に犠牲陽極皮膜を形成する弗化物を含有す
ることを特徴としている。 主要組成のKBF4はそれ自身が530℃程の融点
を有しているので、単体でもフラツクスとして使
用することが考えられる。確かに高い濃度の
KBF4粉末を用いればろうのぬれは得られる。し
かし実用面ではそのような使い方はできないの
で、ある種の添加元素によつてフラツクス濃度を
薄くして適用できるようにすることが必要であ
る。種々の調査の結果が上記に示すような弗化物
である。 ろうのぬれ性を増す弗化物は周期率表のB族、
A族、B族、および、B族の各々元素の弗化
物から選ばれた少なくとも1つの弗化物からな
り、また被ろう付物の表面に犠牲陽極皮膜を形成
する弗素化合物は周期率表のB族及びA族の各
各の元素の弗化物から選ばれた少なくとも1つの
弗化物からなる。 そして選ばれた弗化物はぬれ性を増すために重
量比で20%以下含有させるのが好ましく、また犠
牲陽極皮膜を形成させるために、重量比で45%以
下含有させるのが望ましく、本発明の目的は達せ
られる。 さらに詳しくは、ぬれ性を増す周期率表のB
族にはCu、AgおよびAuが含まれ、これらの弗化
物としてはCuF2、AgFおよびAuFがある。A
にはCaおよびMgがあり、これらの弗化物として
はCaF2およびMgF2がある。B族にはZnおよび
Cdがあり、これらの弗化物としてはZnF2および
CdF2がある。B族にはAlおよびGaがあり、こ
れらの弗化物としてはAlF3およびGaF3がある。 また、被ろう付物の表面に犠牲陽極皮膜を形成
させるB族にはZnおよびCdがあり、これらの弗
化物としてはZnF2およびCdF2がある。さらにA
族にはCaおよびMgがあり、これらの弗化物とし
てはCaF2およびMgF2がある。 次に、ぬれ性を増す元素および弗化性、犠牲陽
極皮膜を形成して耐食性に寄与する元素および弗
化物のフラツクスに対する作用効果について述べ
る。 ぬれ性を増す弗化物としては、KBF4に対し重
量比で20%以下添加することが好ましく、それ以
上添加してもぬれ性の向上に付与しないことが判
明したからである。 フラツクスの組成例としては、重量比で90%
KBF4−10%CaF2、88%KBF4−12%CuF2および
85%KBF4−15%AlF3等が好例である。 これらの組成範囲はろう材の融点を鑑み、それ
以下の温度で活性反応ができる範囲である。また
その他にZnF2・4H2Oの弗化物を各々のフラツク
スに添加しても良好なぬれ性を示す。 次に、被ろう付物の表面に犠牲陽極皮膜を形成
するフラツクス添加物として、代表面には
ZnF2・4H2Oがある。フラツクスに添加する
ZnF2・4H2Oは、たとえばAlの表面に犠牲陽極皮
膜を形成するために所定のZn濃度と拡散深さが
必要となり、その添加量な重量%で45%以下とす
ることが好ましい。このようにZnF2・4H2Oを含
むフラツクスでろう付すれば、ろう付部表面に
Znからなる犠牲陽極皮膜が形成される。 ZnはAlに対して卑な、電位であるから、Al表
面に形成された皮膜は、Alに対して犠牲陽極と
なり、Alの腐食を防止する役割がある。 そこで、KBF4とZnF2・4H2Oとの比を変えて
フラツクスと作り、ろう付によるぬれ性と犠牲陽
極皮膜の形成状態を調査すると、ZnF2・4H2Oの
添加量は重量%で45%まで含有させることができ
る。そしし下限は約6%程度である。 この成分範囲はフラツクスの活性温度としても
好適である。上記のZnF2・4H2Oの他にAlF3等の
弗化物を添加しても、犠牲陽極皮膜を形成する効
果はかわらない。 このような成分を有するフラツクスは常法によ
つて製造される。例えば所定成分となるように配
合されたKBF4−ZnF2・4H2Oの2成分、もしく
はそれにAlF3を含有させた3成分を水に入れ、
撹拌しながらクリーム状とし、乾燥して粉末とす
る方法等がある。 また必要なフラツクス濃度になるように水を準
備し、その中に配合したフラツクスの原料を入
れ、撹拌してフラツクスとする方法も採用可能で
ある。 クリーム状とした後、乾燥して粉末として作成
したフラツクスには、配合成分が80%のKBF4
20%のZnF2・4H2Oの場合、KBF4、ZnF2の他に
KZnF3等の化合物が含有され、また配合成分が
68%のKBF4、17%のZnF2・4H2Oおよび15%の
AlF3の場合、KBF4、ZnF2、AlF3の他にKZnF3
KAlF4等の化合物が含有される。これらの化合
物にはKFは検出されず、そのためフラツクスと
して保存するときでも吸湿性が著しく低く、長期
に渡つて安定である。 本発明のフラツクスを用いたろう付方法として
は、例えば、AlまたはAl合金の板、管、その他
の構造物の被接合面にJIS Z3263に明示されてい
るAl−Si系の硬ろうと共に配合して、硬ろうお
よびフラツクス両者の融点以上、かつAlまたは
Al合金の被接合材の融点以下の温度に加熱して
ろう付する方法が採用される。そして、信頼性の
高いろう付継手を得るために、15〜20%重量%の
水溶液として薄めて不活性雰囲気中でろう付面に
塗布し、乾燥させる。 このようにしてフラツクスを塗布し、ろう付し
た後の被ろう付物の表面には、X線回折の調査に
よりKZnF3、KAlF4、ZnO等の化合物が認めら
れた。 〔発明の実施例〕 重量%でKBF4を80%、ZnF2・4H2Oを20%含
有するフラツクス(本発明No.1)と、KBF4を70
%、ZnF2・4H2Oを17%およびAlF3を13%含有し
たフラツクス(本発明No.2)を作成した。 また夫々の原料の粉末粒径が約15μmを用い、
水を原料1に対して約0.6用意し、その中に秤量
したKBF4を添加し撹拌する。続いて秤量した
ZnF2・4H2Oを添加し撹拌しながらペースト状と
する。次に約100℃の恒温槽の中で水分を蒸発さ
せる。固化したフラツクスはライカイ機で粉砕し
てフラツクスの粉末を作成した。 上記のようにして作つたフラツクスを約15%の
フラツクス濃度(残水分)にし、Al板(A1050:
50□×1t)とφ2.4をφ13に加工した4343ろう材を
フラツクス水溶液中に浸漬して付着させ、ぬれ広
がりを試験した。また腐食試験はA1050板上にブ
レージングシート(心材:3003、皮材:4343)を
直角に配置してフラツクス水溶液中に浸漬して付
着させた。 上記ぬれ広がりおよび腐食試験片共いずれも
N2流入電気炉で、615℃、10秒間加熱した。 また比較のために本発明で用いたものと同じ形
状のぬれ広がりおよび腐食試験片を用い、フラツ
クスは重量%で、KF50%、AlF350%の成分(比
較例1)、またKF55%、AlF345%の成分(比較
例2)、およびKF34%、AlF346%、ZnF2
4H2O14%、およびLiF6%の成分(比較例3)の
フラツクスについて行つた。フラツクスの作成
は、比較例1および2については溶融、冷却、固
化後粉砕した。比較例3のものは本発明と同様に
クリーム状とした後乾燥して粉砕したもので、い
ずれも15%のフラツクス濃度にして使用した。 その結果を第1表に揚げる。
[Field of Application of the Invention] The present invention relates to a novel brazing flux, particularly for plates, pipes, and other components made of Al or Al alloy.
The present invention relates to a brazing flux suitable for joining electronic components. [Background of the Invention] Conventionally, chloride-based fluxes have been generally used for brazing Al or Al alloys. However, this chloride-based flux is highly hygroscopic, and if moisture is present, it may absorb moisture and corrode the base material. Therefore, in the case of chloride-based fluxes, there was a problem in that the residual flux had to be completely removed after brazing. As a conventional flux for improving these problems, a fluoride flux has been proposed as shown in US Pat. No. 3,951,328. This fluoride flux contains a mixture of K 3 AlF 6 and KAlF 4 by mixing and dissolving KF and AlF 3 . Therefore, in this flux, KF
-Even if the KF content is slightly increased beyond the eutectic point in the phase diagram of AlF 3 , the melting point increases significantly. for example,
When KF is 50% by weight (AlF 3 is 50% by weight), the melting point of the flux is 560-700°C. Therefore, in the range of 600 to 620° C. where brazing is normally performed, the flux becomes a semi-molten state, the activity of the flux decreases, the wetting and spreading properties deteriorate, and there is a risk that a partially soldered product may occur. Furthermore, this flux for Al and Al alloys has a problem in that it is not effective in improving corrosion resistance after brazing, and may cause defects in the corrosion resistance of brazed products. [Objective of the Invention] The object of the present invention is to have no hygroscopicity, excellent wettability, and a corrosion-resistant metal on the surface to be joined.
In particular, the object of the present invention is to provide a brazing flux that improves corrosion resistance by retaining Zn. [Summary of the invention] The present invention has KBF 4 as a main component, and the KBF 4 is B
Contains at least one fluoride of Group A , Group B , Group B metal, 20% by weight or less of fluoride of Group B and Group B metal, and 45% by weight of fluoride of Group A and Group B metal. The brazing flux contained below is as follows. An essential condition for a flux that can maintain corrosion resistance without removing the residual flux after brazing is that no hygroscopic components are present in the residual flux on the surface after brazing. Non-hygroscopic fluxes often contain fluoride components. In addition, chloride-based components are generally used to remove oxide films on Al and Al alloy members and increase wetting and spreading. However, since most of the chloride-based materials have hygroscopic properties, if the residual flux after brazing is not completely removed, corrosion resistance will be significantly reduced. Therefore, as a result of various studies in order to impart a suitable melting point, wettability and ability to form a sacrificial anodic film as a fluoride flux for Al and Al alloys, we found that KBF 4 has an element that increases the wettability of wax. It has also been found that excellent brazing properties can be exhibited by adding these fluorides, an element that forms a sacrificial anodic film on the surface of the object to be brazed, and these fluorides alone or in combination. The present invention was made based on this knowledge, and it is possible to add fluoride to KBF 4 to increase the wettability of the solder, or to add it to KBF 4 to form a sacrificial anodic film on the surface of the object to be brazed. It is characterized by containing fluorides that form. Since KBF 4 , the main component, itself has a melting point of about 530°C, it is conceivable that it can be used alone as a flux. Certainly high concentration
Wax wetting is obtained using KBF 4 powder. However, in practical terms, such use is not possible, so it is necessary to reduce the flux concentration by adding a certain kind of additive element to make it usable. The results of various investigations are fluorides as shown above. Fluorides, which increase the wettability of wax, are in Group B of the periodic table.
The fluorine compound, which is composed of at least one fluoride selected from the fluorides of each of Group A , Group B , and Group B elements, and which forms the sacrificial anodic film on the surface of the brazing object is B in the periodic table. It consists of at least one fluoride selected from the fluorides of each element of Group A and Group A. The selected fluoride is preferably contained in an amount of 20% or less by weight to increase wettability, and preferably 45% or less by weight to form a sacrificial anode film. The goal will be achieved. For more information, see B of the periodic table that increases wettability.
The family includes Cu, Ag and Au, the fluorides of which are CuF 2 , AgF and AuF. Group A includes Ca and Mg, and their fluorides include CaF2 and MgF2 . Group B includes Zn and
Cd, and these fluorides include ZnF2 and
There is CdF 2 . Group B includes Al and Ga, and their fluorides include AlF 3 and GaF 3 . In addition, the B group that forms a sacrificial anodic film on the surface of the object to be brazed includes Zn and Cd, and fluorides of these include ZnF 2 and CdF 2 . Further A
The family includes Ca and Mg, and their fluorides include CaF 2 and MgF 2 . Next, the effects of elements and fluorides that increase wettability, elements that form a sacrificial anode film and contribute to corrosion resistance, and fluorides on flux will be described. This is because it has been found that the fluoride that increases wettability is preferably added in a weight ratio of 20% or less to KBF 4 , and that adding more than that does not improve wettability. An example of flux composition is 90% by weight.
KBF4−10 % CaF2 , 88% KBF4−12 % CuF2 and
A good example is 85% KBF4-15 % AlF3 . Considering the melting point of the brazing filler metal, these composition ranges are within the range at which an active reaction can occur at a temperature below that temperature. In addition, good wettability is exhibited even when a fluoride of ZnF 2 .4H 2 O is added to each flux. Next, as a flux additive that forms a sacrificial anodic film on the surface of the object to be brazed,
There is ZnF 2 4H 2 O. add to flux
ZnF 2 .4H 2 O requires a predetermined Zn concentration and diffusion depth in order to form a sacrificial anodic film on the surface of Al, for example, and the amount added is preferably 45% or less by weight. If you braze with flux containing ZnF 2 4H 2 O in this way, the surface of the brazed part will be
A sacrificial anodic film consisting of Zn is formed. Since Zn has a base potential with respect to Al, the film formed on the Al surface serves as a sacrificial anode for Al and has the role of preventing corrosion of Al. Therefore, we created fluxes with different ratios of KBF 4 and ZnF 2 4H 2 O, and investigated the wettability during brazing and the formation of sacrificial anodic films, and found that the amount of ZnF 2 4H 2 O added was in terms of weight percent. It can be contained up to 45%. The lower limit is about 6%. This range of components is also suitable as the activation temperature of the flux. Even if a fluoride such as AlF 3 is added in addition to the above-mentioned ZnF 2 .4H 2 O, the effect of forming a sacrificial anode film does not change. Fluxes containing such components are produced by conventional methods. For example, if two components, KBF 4 -ZnF 2 4H 2 O, which are blended to form a predetermined composition, or three components containing AlF 3 are added to water,
There are methods such as making it into a creamy state while stirring and then drying it into a powder. Alternatively, a method can be adopted in which water is prepared so as to have the required flux concentration, the blended flux raw materials are added thereto, and the mixture is stirred to obtain a flux. The flux, which is made into a cream and then dried to create a powder, contains 80% KBF 4 and
For 20% ZnF 2 4H 2 O, in addition to KBF 4 and ZnF 2
Contains compounds such as KZnF 3 , and contains compounded ingredients.
68% KBF4 , 17% ZnF2.4H2O and 15 %
In the case of AlF 3 , in addition to KBF 4 , ZnF 2 , AlF 3 , KZnF 3 ,
Contains compounds such as KAlF4 . KF is not detected in these compounds, so even when stored as a flux, their hygroscopicity is extremely low and they are stable over long periods of time. A brazing method using the flux of the present invention includes, for example, blending the flux with an Al-Si based hard solder specified in JIS Z3263 on the surfaces of Al or Al alloy plates, pipes, and other structures to be joined. , above the melting point of both hard solder and flux, and Al or
A method is adopted in which the aluminum alloy material is heated to a temperature below the melting point of the material to be joined and brazed. Then, in order to obtain a reliable brazed joint, it is diluted as a 15-20% by weight aqueous solution, applied to the brazed surface in an inert atmosphere, and dried. Compounds such as KZnF 3 , KAlF 4 and ZnO were found on the surface of the object to be brazed after the flux was applied and brazed by X-ray diffraction. [Embodiment of the invention] A flux containing 80% KBF 4 and 20% ZnF 2 4H 2 O (invention No. 1) by weight and 70% KBF 4
%, a flux (invention No. 2) containing 17% ZnF 2 .4H 2 O and 13% AlF 3 was prepared. In addition, using a powder particle size of approximately 15 μm for each raw material,
Prepare approximately 0.6 parts of water per 1 part of the raw material, add 4 weighed KBF to the water, and stir. It was then weighed
Add ZnF 2 4H 2 O and make into a paste while stirring. Next, the water is evaporated in a constant temperature bath at approximately 100°C. The solidified flux was pulverized using a Raikai machine to create flux powder. The flux made as above was made to have a flux concentration (residual moisture) of about 15%, and the aluminum plate (A1050:
50□×1t) and 4343 brazing filler metal, which had been processed from φ2.4 to φ13, were immersed in an aqueous flux solution to adhere to it, and the wetting and spreading was tested. In the corrosion test, a brazing sheet (heart material: 3003, skin material: 4343) was placed at right angles to an A1050 board and immersed in an aqueous flux solution to adhere it. Both of the above wet spread and corrosion test pieces
It was heated at 615° C. for 10 seconds in an N 2 inflow electric furnace. For comparison, wetting and corrosion test specimens with the same shape as those used in the present invention were used. 3 45% component (comparative example 2), and KF 34%, AlF 3 46%, ZnF 2 .
A flux containing 14% of 4H 2 O and 6% of LiF (Comparative Example 3) was tested. In Comparative Examples 1 and 2, the fluxes were prepared by melting, cooling, solidifying, and then pulverizing. Comparative Example 3 was made into a cream, dried and ground in the same way as in the present invention, and both were used at a flux concentration of 15%. The results are shown in Table 1.

〔発明の効果〕〔Effect of the invention〕

以上のように、本発明のろう付用フラツクスに
よれば、AlまたはAl合金に対するろう付のぬれ
広がり性に優れているとともに、ろう付部を含む
AlまたはAl合金の全表面の腐食を抑制すること
ができ、且つろう付後の洗浄作業を省略できると
いう顕著な効果を有する。
As described above, the brazing flux of the present invention has excellent wetting and spreading properties for brazing Al or Al alloy, and also
It has the remarkable effect of being able to suppress corrosion on the entire surface of Al or Al alloy, and eliminating cleaning work after brazing.

Claims (1)

【特許請求の範囲】[Claims] 1 KBF4を主成分とし、該KBF4B族、A
族、B族、B族金属の弗化物を少なくとも1種
含有し、前記B族及びB族金属の弗化物を20重
量%以下、A族及びB族金属の弗化物を45重量
%以下含有することを特徴とするろう付用フラツ
クス。
1 KBF 4 is the main component, and this KBF 4 is a B group, A
Contains at least one fluoride of Group B , Group B , and Group B metals, and contains 20% by weight or less of fluorides of Group B and Group B metals, and 45% by weight or less of fluorides of Group A and Group B metals. A brazing flux characterized by:
JP15371784A 1984-07-24 1984-07-24 Flux for brazing Granted JPS6133791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15371784A JPS6133791A (en) 1984-07-24 1984-07-24 Flux for brazing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15371784A JPS6133791A (en) 1984-07-24 1984-07-24 Flux for brazing

Publications (2)

Publication Number Publication Date
JPS6133791A JPS6133791A (en) 1986-02-17
JPH0450112B2 true JPH0450112B2 (en) 1992-08-13

Family

ID=15568560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15371784A Granted JPS6133791A (en) 1984-07-24 1984-07-24 Flux for brazing

Country Status (1)

Country Link
JP (1) JPS6133791A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4559570B2 (en) * 1999-12-09 2010-10-06 ステラケミファ株式会社 Method for producing high purity zinc borofluoride hexahydrate
JP4513675B2 (en) * 2004-10-21 2010-07-28 株式会社デンソー Brazing method of aluminum material and flux used therefor
CN109202331A (en) * 2018-11-01 2019-01-15 江苏科技大学 A kind of medicine core silver solder with excellent fluidity

Also Published As

Publication number Publication date
JPS6133791A (en) 1986-02-17

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