JPH0450275B2 - - Google Patents
Info
- Publication number
- JPH0450275B2 JPH0450275B2 JP23455888A JP23455888A JPH0450275B2 JP H0450275 B2 JPH0450275 B2 JP H0450275B2 JP 23455888 A JP23455888 A JP 23455888A JP 23455888 A JP23455888 A JP 23455888A JP H0450275 B2 JPH0450275 B2 JP H0450275B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon nitride
- nickel
- nitride sintered
- sintered body
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 229910001080 W alloy Inorganic materials 0.000 claims description 6
- 229910017945 Cu—Ti Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 3
- 230000005496 eutectics Effects 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000004881 precipitation hardening Methods 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- -1 W and Mo Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
「産業上の利用分野」
本発明は窒化ケイ素と金属を強固に接合する分
野で好適に利用されるものである。
「従来の技術」
セラミツクスと金属との接合は通常ろう付けに
よつて行われるが、セラミツクスと金属とは熱膨
張係数が大きく異なるため、その大きな膨張差に
よつて接合近傍には相当の歪が残存することにな
る。この歪によつてもろいセラミツクスに破壊が
おこる。これを防止するため熱膨張係数がセラミ
ツクスのそれに近いＷ，Mo等の低膨張金属を接
合すべきセラミツクスと金属との間に緩衝層とし
て介在させて接合したり、これら低膨張金属を
Cuで挾んでなるクラツド材を緩衝層として介在
させて接合する手段（実開昭59−160533号考案
「セラミツクと金属の接合構造」）が提案されてい
る。
「発明が解決しようとする課題」
しかし、上記従来技術では未だ構造材料として
接合強度に乏しいほか、Cuは耐熱性に乏しいた
め内燃機関等の高温部での使用に耐えないという
問題点がある。
本発明は、高い接合強度を有し且つ接合部の耐
熱性に優れたセラミツクスと金属との接合構造を
提供することを目的とする。
「課題を解決するための手段」
その手段は、窒化ケイ素焼結体と金属との間
に、緩衝材として窒化ケイ素焼結体側より順にニ
ツケル、タングステン合金及び再びニツケルを介
在させて、窒化ケイ素焼結体とニツケルとはAg
−Cu−Ti系ろうにて、各緩衝材間及びニツケル
と金属体とはAgろう又はAg−Cu共晶ろうにて接
合するところにある。
この場合、緩衝材全体の厚さは接合面の最長幅
の0.04〜0.4倍であるのが望ましい。タングステ
ン合金とは、Ｗ−Ni系合金、Ｗ−Cu系合金、Ｗ
−Cu−Ni系合金、Ｗ−Ni−Fe系合金、Ｗ−Fe−
Ni−Cr系合金等のＷを主成分とする金属をいい、
その熱膨張係数が接合すべき窒化ケイ素焼結体の
それの1.7倍以下であるものが望ましい。
「作用」
窒化ケイ素焼結体は、高温強度に優れエンジン
部品材料に好適である。Ag−Cu−Ti系ろうは、
窒化ケイ素焼結体の表面をメタライズ化せずとも
直接反応し、窒化ケイ素焼結体とニツケルとを接
合する。この窒化ケイ素焼結体側のニツケルは、
その一部がAg−Cu−Ti系ろう材と相互に拡散し
てAg−Cu−Ti−Ni系接合層を形成するが、残部
はその優れた延展性により窒化ケイ素と金属との
熱膨張差に起因する接合部の歪を弾性変形あるい
は塑性変形し緩和する。タングステン合金は、緩
衝材層の中央に位置して窒化ケイ素焼結体と金属
体との熱膨張差に起因する接合部の歪を緩和す
る。タングステン合金と金属体との間に介在させ
るニツケルは、その優れた延展性によりタングス
テン合金と金属体との熱膨張差に起因する接合部
の歪を弾性変形あるいは塑性変形し緩和する。
「実施例」
Si3N4含有率86wt％、熱膨張係数3.4×10-5／℃
（R.T.〜800℃）、抗折強度80Kg／mm2、ヤング率2.8
×104Kg／mm2の窒化ケイ素焼結体、第１表に示す
緩衝材、第２表に示すろう及びJIS規格SUS630
の析出硬化型ステンレス鋼を準備し、これらを第
３表に示す組み合わせで第１図に示すように配置
した。図中、１〜３は緩衝材、６〜９はろう材、
１２は窒化ケイ素焼結体、１３は析出硬化型ステ
ンレス鋼を示し、いずれも直径15mmの円盤ないし
円柱形状である。上記配置後、10-5Torrの真空
中温度930〜980℃で加熱することにより接合し、
Ｉ−ZOD衝撃値を測定した結果を第３表に併記
する。なお、Ｉ−ZOD衝撃値は、第２図に示す
如く、析出硬化型ステンレス鋼１３を固定し、窒
化ケイ素焼結体１２の接合面から10〔mm〕の点Ｐ
を打点として行つた。
"Industrial Application Field" The present invention is suitably used in the field of firmly bonding silicon nitride and metal. ``Prior art'' Ceramics and metals are usually joined by brazing, but since ceramics and metals have significantly different coefficients of thermal expansion, this large expansion difference causes considerable strain in the vicinity of the joint. It will remain. This distortion causes destruction of the fragile ceramics. To prevent this, low expansion metals such as W and Mo, whose coefficient of thermal expansion is close to that of ceramics, are interposed as a buffer layer between the ceramics and metals to be bonded, or these low expansion metals are bonded.
A method of bonding by interposing a cladding material made of Cu as a buffer layer has been proposed (proposed in Utility Model Application Publication No. 160533/1983, ``Ceramic-metal bonding structure''). ``Problems to be Solved by the Invention'' However, the above-mentioned conventional technology still has problems in that it still lacks bonding strength as a structural material, and Cu has poor heat resistance, so it cannot withstand use in high-temperature parts such as internal combustion engines. An object of the present invention is to provide a ceramic-metal bonding structure that has high bonding strength and excellent heat resistance at the bonded portion. "Means for Solving the Problem" The means is to interpose nickel, tungsten alloy, and again nickel as a buffer material between the silicon nitride sintered body and the metal, in order from the silicon nitride sintered body side, and to make silicon nitride sintered. Ag and nickel are Ag
-Cu-Ti based solder is used to connect the buffer materials and the nickel and metal body using Ag solder or Ag-Cu eutectic solder. In this case, the thickness of the entire cushioning material is preferably 0.04 to 0.4 times the longest width of the joint surface. Tungsten alloys include W-Ni alloy, W-Cu alloy, W-Ni alloy, and W-Cu alloy.
-Cu-Ni alloy, W-Ni-Fe alloy, W-Fe-
Refers to metals whose main component is W, such as Ni-Cr alloys,
It is desirable that the coefficient of thermal expansion is 1.7 times or less that of the silicon nitride sintered body to be joined. "Operation" Silicon nitride sintered bodies have excellent high-temperature strength and are suitable for engine parts materials. Ag-Cu-Ti based wax is
Direct reaction occurs without metalizing the surface of the silicon nitride sintered body, and the silicon nitride sintered body and nickel are joined together. The nickel on this silicon nitride sintered body side is
A part of it diffuses into the Ag-Cu-Ti brazing filler metal to form an Ag-Cu-Ti-Ni bonding layer, but the rest is due to the difference in thermal expansion between silicon nitride and metal due to its excellent ductility. The strain in the joint caused by this is alleviated by elastic or plastic deformation. The tungsten alloy is located in the center of the buffer material layer to alleviate strain in the joint caused by the difference in thermal expansion between the silicon nitride sintered body and the metal body. Nickel, which is interposed between the tungsten alloy and the metal body, elastically or plastically deforms and relieves strain at the joint due to the difference in thermal expansion between the tungsten alloy and the metal body due to its excellent extensibility. "Example" Si 3 N 4 content 86wt%, thermal expansion coefficient 3.4×10 -5 /℃
(RT~800℃), bending strength 80Kg/mm 2 , Young's modulus 2.8
×10 4 Kg/mm 2 silicon nitride sintered body, cushioning material shown in Table 1, wax shown in Table 2, and JIS standard SUS630
Precipitation hardening stainless steels were prepared, and these were arranged as shown in FIG. 1 in the combinations shown in Table 3. In the figure, 1 to 3 are cushioning materials, 6 to 9 are brazing materials,
Reference numeral 12 indicates a silicon nitride sintered body, and reference numeral 13 indicates a precipitation hardening stainless steel, both of which are in the shape of a disk or cylinder with a diameter of 15 mm. After the above arrangement, bonding is performed by heating at a temperature of 930 to 980°C in a vacuum of 10 -5 Torr,
The results of measuring I-ZOD impact values are also listed in Table 3. As shown in Fig. 2, the I-ZOD impact value is calculated at a point P 10 [mm] from the joint surface of the silicon nitride sintered body 12 with the precipitation hardening stainless steel 13 fixed.
was used as an RBI point.
【表】【table】
【表】【table】
【表】
第３表からわかるように本発明接合構造９及び
10はいずれも衝撃値が17〔Kg・cm〕以上となつた
が、ニツケルと同じく低ヤング率材料の銅をニツ
ケルに代えて緩衝材として用いた比較例の接合構
造５及び６は緩衝層の厚さを同じくしても衝撃値
が17〔Kg・cm〕に満たなかつた。
なお、上記実施例では各緩衝材間及びニツケル
と析出硬化型ステンレス鋼との接合にAgろうを
用いたが、Agろうに代えて公知のAg−Cu共晶ろ
うを用いても同様に作用する。
「発明の効果」
内燃機関の吸排気弁等、各種エンジン部品に適
用可能となる。[Table] As can be seen from Table 3, the present invention joining structure 9 and
No. 10 had an impact value of 17 [Kg cm] or more, but comparative examples No. 5 and No. 6, which used copper, which is a low Young's modulus material like nickel, as a buffer material instead of nickel, had a shock value of 17 [Kg cm] or more. Even if the thickness was the same, the impact value was less than 17 [Kg cm]. In addition, in the above example, Ag solder was used for bonding between each buffer material and between nickel and precipitation hardening stainless steel, but the same effect can be obtained by using a known Ag-Cu eutectic solder instead of Ag solder. . "Effects of the invention" The invention can be applied to various engine parts such as intake and exhaust valves of internal combustion engines.
第１図は本発明の一実施例に係る窒化ケイ素と
金属との接合構造の模式図、第２図はＩ−ZOD
衝撃値測定方法を説明するための側面図である。
１〜３……緩衝材、６〜９……ろう材、１２…
…窒化ケイ素焼結体、１３……析出硬化型ステン
レス鋼。
Fig. 1 is a schematic diagram of a bonding structure between silicon nitride and metal according to an embodiment of the present invention, and Fig. 2 is an I-ZOD
FIG. 3 is a side view for explaining an impact value measuring method. 1 to 3...buffer material, 6 to 9...brazing material, 12...
...Silicon nitride sintered body, 13...Precipitation hardening stainless steel.
Claims (1)
として窒化ケイ素焼結体側より順にニツケル、タ
ングステン合金及び再びニツケルを介在させて、
窒化ケイ素焼結体とニツケルとはAg−Cu−Ti系
ろうにて、各緩衝材間及びニツケルと金属体とは
Agろう又はAg−Cu共晶ろうにて接合してなる窒
化ケイ素と金属との接合構造。1. Between the silicon nitride sintered body and the metal body, nickel, tungsten alloy, and again nickel are interposed as a buffer material in order from the silicon nitride sintered body side,
The silicon nitride sintered body and nickel are Ag-Cu-Ti solder, and the difference between each buffer material and between nickel and the metal body is
A bonding structure of silicon nitride and metal bonded using Ag solder or Ag-Cu eutectic solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23455888A JPH01119571A (en) | 1988-09-19 | 1988-09-19 | Joint structure of silicon nitride and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23455888A JPH01119571A (en) | 1988-09-19 | 1988-09-19 | Joint structure of silicon nitride and metal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24737984A Division JPS61127674A (en) | 1984-11-22 | 1984-11-22 | Structure of bonding ceramic and metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01119571A JPH01119571A (en) | 1989-05-11 |
| JPH0450275B2 true JPH0450275B2 (en) | 1992-08-13 |
Family
ID=16972904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23455888A Granted JPH01119571A (en) | 1988-09-19 | 1988-09-19 | Joint structure of silicon nitride and metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01119571A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9096471B2 (en) * | 2009-11-27 | 2015-08-04 | Showa Denko K.K. | Method for producing a layered material |
| CN120272859A (en) * | 2025-04-15 | 2025-07-08 | 宁波大学 | Cu-Si3N4-FeCoCrNiMn nano layered composite material and preparation method thereof |
-
1988
- 1988-09-19 JP JP23455888A patent/JPH01119571A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01119571A (en) | 1989-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62104696A (en) | Metallic ceramics junction body and metallic ceramics coupling body formed by using said body | |
| US4723862A (en) | Ceramic-metal joint structure | |
| JPH0477129B2 (en) | ||
| JPH0438715B2 (en) | ||
| JPH0516382B2 (en) | ||
| JPH02175673A (en) | Joined body of ceramics and metal | |
| JPH0788262B2 (en) | Method for joining silicon nitride and metal | |
| JPH0450275B2 (en) | ||
| JPH0339991B2 (en) | ||
| JP3336485B2 (en) | Tappet | |
| JPH0234907B2 (en) | SERAMITSUKUSUTOKINZOKUTONOSETSUGOKOZO | |
| JP2660538B2 (en) | Joint structure of metal and ceramic bodies | |
| JPH05148054A (en) | Bonding structure of ceramics and metal | |
| JPH05194052A (en) | Brazing filler material for joining nonoxide ceramic to metal and method for joining the same | |
| JPH01205053A (en) | Joining stress buffer alloy of ceramics and metal and joined body of ceramics and metal formed by using said buffer alloy | |
| JP3153872B2 (en) | Metal-nitride ceramic bonding structure | |
| JPS63106305A (en) | Rocker arm with ceramics pad | |
| JPS61247666A (en) | Method of joining non-oxide ceramic and metal | |
| JPH0234909B2 (en) | SICSHOKETSUTAITOKINZOKUBUZAINOSETSUGOKOZO | |
| JPH0240631B2 (en) | ||
| JP2940030B2 (en) | Joining method of ceramics and metal | |
| JPH06345554A (en) | Silicon nitride ceramic joined body and production thereof | |
| JPS60255679A (en) | Bonded body of ceramic and metal | |
| JP3206987B2 (en) | Joint of ceramic and metal | |
| JPH0680481A (en) | Production of bonded material of oxide ceramics and metal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |