JPH0451991B2 - - Google Patents
Info
- Publication number
- JPH0451991B2 JPH0451991B2 JP57076857A JP7685782A JPH0451991B2 JP H0451991 B2 JPH0451991 B2 JP H0451991B2 JP 57076857 A JP57076857 A JP 57076857A JP 7685782 A JP7685782 A JP 7685782A JP H0451991 B2 JPH0451991 B2 JP H0451991B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- electrode
- insulating frame
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
Description
【発明の詳細な説明】
本発明は発光装置の組立を簡単に行なうことの
できる構造を具備した発光装置用電極構体に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrode assembly for a light emitting device having a structure that allows easy assembly of the light emitting device.
従来の発光装置で、発光半導体（以下、発光素
子チツプという）を載置する電極構体は、第１図
で示すように、第１のタイバー１、第２のタイバ
ー２で一対の電極体３および４の発光素子チツプ
取付部、いわゆる、ボンデイングパツド部５を支
えているが、その支えが充分ではなく特に、ボン
デイングパツド部５に機械的外部応力が加わつた
場合、容易に塑性変形を生じ、実用に耐えないと
いう問題点があつた。 In a conventional light emitting device, an electrode assembly on which a light emitting semiconductor (hereinafter referred to as a light emitting element chip) is placed has a first tie bar 1, a second tie bar 2, a pair of electrode bodies 3, and a second tie bar 2, as shown in FIG. 4 supports the light emitting element chip mounting portion, the so-called bonding pad portion 5, but the support is insufficient and, in particular, when external mechanical stress is applied to the bonding pad portion 5, plastic deformation easily occurs. However, there was a problem that it was not practical.
また従来の発光装置で、電極体３，４が第１図
に示しているように相対向する形状でなく、平行
に並べその先端にLEDチツプをボンデイングし
て樹脂封止をする縦型フレームのものがある。こ
の場合電極体先端は、開放されているので、ダイ
スボンデイング及びワイヤボンデイング時に、電
極体の先端がふらつきやすく発光装置を作成する
作業の安定性に欠けるという不都合もあつた。 In addition, in conventional light emitting devices, the electrode bodies 3 and 4 are not shaped to face each other as shown in Figure 1, but are arranged in parallel and have a vertical frame with an LED chip bonded to the tip and sealed with resin. There is something. In this case, since the tip of the electrode body is open, there is also the problem that the tip of the electrode body tends to wobble during die bonding and wire bonding, resulting in a lack of stability in the work of producing a light emitting device.
本発明は、これら上述の問題点を解消したもの
で、相対向する少なくとも一対の電極体と、前記
電極体を支持するフレームとを平面的に一体形成
し、かつ、前記電極体の相対向する先端部を、主
面方向を開放した絶縁体枠体で囲い、同先端部の
主面を露出させ、その主面の反対面を前記絶縁体
枠体の底部に密着固定したことを特徴とする発光
装置用電極構体を提供するものである。絶縁枠体
は内面反射側壁を有し、かつ、枠体内部は、透光
性樹脂で充填している。 The present invention solves these above-mentioned problems by integrally forming at least one pair of electrode bodies facing each other and a frame supporting the electrode bodies in a planar manner, and The tip is surrounded by an insulator frame whose main surface is open, the main surface of the tip is exposed, and the opposite surface of the main surface is tightly fixed to the bottom of the insulator frame. An electrode structure for a light emitting device is provided. The insulating frame has internal reflective side walls, and the inside of the frame is filled with a translucent resin.
次に、本発明の発光装置用電極構体について図
面を参照しつつ実施例により詳しく説明する。 Next, the electrode structure for a light emitting device of the present invention will be described in detail by way of examples with reference to the drawings.
発明の実施例に係る発光装置用電極構体は、第
２図にその斜視図、第３図にそのＡ−A′断面図
を示すように、上方に開口した凹部の絶縁枠体６
を、たとえば、成形樹脂材料、セラミツク材料、
ガラス無機質材料といつた電気的絶縁材料で形成
し、この絶縁枠体６で、電極体３および４のボン
デイングパツド部５をその主面が露出するように
して、この部分を囲んで固定化せしめる構造とな
つている。すなわち、本実施例の発光装置用電極
構体では、従来のリードフレームにみられた、ボ
ンデイングパツド部５に対する外部応力が加わつ
た場合に生ずる塑性変形の不良発生の問題もな
く、取り扱い時にボンデイングパツド部５に外部
応力が加わらないよう細心の注意を払う必要はな
く、その取り扱いが非常に簡単になる。 As shown in FIG. 2 as a perspective view and as shown in FIG.
For example, molded resin materials, ceramic materials,
The insulating frame 6 is made of an electrically insulating material such as glass inorganic material, and is fixed by surrounding the bonding pad portions 5 of the electrode bodies 3 and 4 with their main surfaces exposed. It has a structure that encourages In other words, the electrode assembly for a light emitting device of this embodiment does not have the problem of plastic deformation defects that occur when external stress is applied to the bonding pad portion 5, which was seen in conventional lead frames, and the bonding pad portion 5 does not deform during handling. There is no need to take great care not to apply external stress to the door portion 5, and its handling becomes very easy.
第４図は本発明に係る発光装置用電極構体を発
光ダイオードに用いた断面図を示すもので、第１
図〜第３図と同一番号は同一部分を示す。 FIG. 4 shows a cross-sectional view of a light emitting diode in which the electrode structure for a light emitting device according to the present invention is used.
The same numbers as in FIGS. 3 to 3 indicate the same parts.
同図から明らかな様に、実際の半導体装置の組
立に際しては、ボンデイングパツド部５の電気的
絶縁材料による固定化に伴ない、同部５に導電装
着材７を介して半導体チツプ、たとえば発光素子
チツプ８を載置して、金属細線９により電極接続
する際、機械的安定性と取扱いの作業性が飛躍的
に向上させることができ、また、封止工程におい
ては、絶縁枠体５で囲まれた凹部に、たとえば、
透光性エポキシ樹脂１０を注入硬化せしめること
により、封止外囲器の形成ができる。電気的絶縁
枠体６の凹部を封止外囲器の一部として積極的に
利用することにより、封止用成形の工程が簡素化
され、経済的に安価な半導体装置を提供すること
が可能である。 As is clear from the figure, when actually assembling a semiconductor device, as the bonding pad portion 5 is fixed with an electrically insulating material, a semiconductor chip, for example, a light emitting device, is attached to the bonding pad portion 5 via a conductive attachment material 7. When mounting the element chip 8 and connecting the electrodes with the thin metal wires 9, mechanical stability and handling workability can be dramatically improved. In an enclosed recess, e.g.
By injecting and curing the translucent epoxy resin 10, a sealed envelope can be formed. By actively utilizing the recessed portion of the electrically insulating frame 6 as a part of the sealing envelope, the sealing molding process is simplified and it is possible to provide an economically inexpensive semiconductor device. It is.
また特に、半導体発光装置に利用する場合、電
気的絶縁材料部に、遮光性でかつ反射効率の良い
材料を用いることにより、絶縁枠体６の開口上方
部へのみ有効に光を導くことができ、下方、側方
への光の漏れも防止することができる。 In particular, when used in a semiconductor light emitting device, by using a material with light blocking properties and high reflection efficiency for the electrically insulating material part, light can be effectively guided only to the upper part of the opening of the insulating frame 6. It is also possible to prevent light from leaking downward and to the sides.
なお、実施例においては、電気的絶縁枠体とし
て直方体のものを用いたが、安定な形状を有する
ものであれば、これが円柱状あるいは角柱状であ
つてもよい。 In the embodiment, a rectangular parallelepiped is used as the electrically insulating frame, but it may be cylindrical or prismatic as long as it has a stable shape.
以上説明してきたところから明らかなように、
本発明の発光装置用電極構体は、従来のリードフ
レームの塑性変形に伴なう不都合を排除する効果
が奏される。 As is clear from what has been explained above,
The electrode assembly for a light emitting device of the present invention has the effect of eliminating the disadvantages associated with plastic deformation of conventional lead frames.
さらに、縦型フレームの先端にLEDチツプを
ボンデイングして樹脂防止をすることにより形成
される発光ダイオードにおいてダイスボンデイン
グ、ワイヤボンデイング時におこる、リードフレ
ーム先端のふらつきによる作業の安定性の欠如
が、本発明の場合には、絶縁枠体が先端を固定し
ているので安定した作業が可能となる。 Furthermore, the present invention eliminates the lack of work stability due to wobbling of the lead frame tip that occurs during die bonding and wire bonding in light emitting diodes that are formed by bonding an LED chip to the tip of a vertical frame and preventing resin. In this case, stable work is possible because the insulating frame fixes the tip.
第１図は従来のリードフレームの斜視図、第２
図は本発明の実施例に係る発光装置用電極構体の
斜視図、第３図はそのＡ−A′の断面図、第４図
は本発明に係る発光装置用電極構体を発光ダイオ
ードに用いた場合の断面図である。
１，２……支持体、３，４……電極体、５……
ボンデイングパツド部、６……絶縁枠体、７……
導電接着材、８……半導体チツプ、９……金属細
線、１０……封止樹脂。
Figure 1 is a perspective view of a conventional lead frame, Figure 2 is a perspective view of a conventional lead frame.
The figure is a perspective view of an electrode structure for a light emitting device according to an embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line A-A', and FIG. FIG. 1, 2... Support body, 3, 4... Electrode body, 5...
Bonding pad section, 6... Insulating frame, 7...
Conductive adhesive, 8... Semiconductor chip, 9... Fine metal wire, 10... Sealing resin.
Claims (1)
電極体を支持するフレームとを平面的に一体形成
し、かつ、前記電極体の相対向する先端部を、主
面方向を開放した絶縁枠体で囲い、同先端部の主
面を露出させ、その主面の反対面を前記絶縁枠体
の底部に密着固定したことを特徴とする発光装置
用電極構体。 ２ 絶縁枠体は内面反射側壁を有することを特徴
とする請求項１記載の発光装置用電極構体。 ３ 絶縁枠体内部を透光性樹脂で充填させたこと
を特徴とする請求項１，２記載の発光装置用電極
構体。[Scope of Claims] 1. At least one pair of electrode bodies facing each other and a frame supporting the electrode bodies are integrally formed in a planar manner, and the opposing tips of the electrode bodies are arranged so that the opposite ends thereof face each other in the main surface direction. 1. An electrode assembly for a light emitting device, characterized in that the electrode structure is surrounded by an open insulating frame, the main surface of the tip is exposed, and the opposite surface of the main surface is closely fixed to the bottom of the insulating frame. 2. The electrode structure for a light emitting device according to claim 1, wherein the insulating frame has an internally reflecting side wall. 3. The electrode structure for a light emitting device according to claim 1, wherein the inside of the insulating frame is filled with a translucent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57076857A JPS58194382A (en) | 1982-05-08 | 1982-05-08 | Electrode structure for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57076857A JPS58194382A (en) | 1982-05-08 | 1982-05-08 | Electrode structure for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58194382A JPS58194382A (en) | 1983-11-12 |
| JPH0451991B2 true JPH0451991B2 (en) | 1992-08-20 |
Family
ID=13617318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57076857A Granted JPS58194382A (en) | 1982-05-08 | 1982-05-08 | Electrode structure for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58194382A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0273364B1 (en) * | 1986-12-26 | 1992-03-25 | Idec Izumi Corporation | Electronic part carrying strip and method of manufacturing the same |
| EP0646971B1 (en) | 1993-09-30 | 1997-03-12 | Siemens Aktiengesellschaft | Two-terminal SMT-miniature-housing of semiconductor device and process of manufacturing the same |
| EP1566846B1 (en) | 1997-07-29 | 2016-02-03 | OSRAM Opto Semiconductors GmbH | Optoelectronic device |
| JP5338899B2 (en) * | 2009-03-30 | 2013-11-13 | 株式会社オートネットワーク技術研究所 | Optical communication module and method for manufacturing optical communication module |
| JP5338900B2 (en) * | 2009-03-30 | 2013-11-13 | 株式会社オートネットワーク技術研究所 | Optical communication module and method for manufacturing optical communication module |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50104565U (en) * | 1974-02-01 | 1975-08-28 | ||
| US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
| JPS5338973A (en) * | 1976-09-22 | 1978-04-10 | Hitachi Ltd | Lead frame |
| JPS5947462B2 (en) * | 1977-01-13 | 1984-11-19 | 日本電気株式会社 | Lead configuration for semiconductor devices |
| JPS53108880U (en) * | 1977-02-08 | 1978-08-31 | ||
| JPS5824453Y2 (en) * | 1978-05-11 | 1983-05-25 | 三洋電機株式会社 | light emitting diode board |
| JPS55105388A (en) * | 1979-02-07 | 1980-08-12 | Toshiba Corp | Manufacture of light emission display device |
| JPS5776856A (en) * | 1980-10-30 | 1982-05-14 | Toshiba Corp | Manufacture of semiconductor device |
| JPS582079A (en) * | 1981-06-29 | 1983-01-07 | Nippon Denyo Kk | Light emitting diode lamp and manufacture thereof |
-
1982
- 1982-05-08 JP JP57076857A patent/JPS58194382A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58194382A (en) | 1983-11-12 |
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