JPH0452260A - Method for thermally spraying ceramics on metal sheet - Google Patents
Method for thermally spraying ceramics on metal sheetInfo
- Publication number
- JPH0452260A JPH0452260A JP16249090A JP16249090A JPH0452260A JP H0452260 A JPH0452260 A JP H0452260A JP 16249090 A JP16249090 A JP 16249090A JP 16249090 A JP16249090 A JP 16249090A JP H0452260 A JPH0452260 A JP H0452260A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- metal sheet
- electroplating
- rough surface
- roughened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 33
- 239000002184 metal Substances 0.000 title claims abstract description 33
- 239000000919 ceramic Substances 0.000 title claims abstract description 13
- 238000005507 spraying Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 21
- 238000009713 electroplating Methods 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 18
- 238000007751 thermal spraying Methods 0.000 claims description 8
- 238000005524 ceramic coating Methods 0.000 abstract description 3
- 238000007788 roughening Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 238000005488 sandblasting Methods 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 229910000976 Electrical steel Inorganic materials 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 229910000365 copper sulfate Inorganic materials 0.000 description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007750 plasma spraying Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RSEBUVRVKCANEP-UHFFFAOYSA-N 2-pyrroline Chemical compound C1CC=CN1 RSEBUVRVKCANEP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 101100342332 Mus musculus Klf16 gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- ZVJHJDDKYZXRJI-UHFFFAOYSA-N pyrroline Natural products C1CC=NC1 ZVJHJDDKYZXRJI-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating By Spraying Or Casting (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、セラミック皮膜を有する金属板の製造法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a metal plate having a ceramic coating.
（従来の技術）
セラミック溶射は、セラミックコーティングの一手法と
して広く知られている。特にプラズマ溶射の出現以来、
その量産性にすぐれることから主に金属製品の耐摩耗性
、耐熱性、表面硬度、電気絶縁性、断熱性等の改良、す
なわち表面改質に広く用いられている。(Prior Art) Ceramic spraying is widely known as a method of ceramic coating. Especially since the advent of plasma spraying,
Because of its excellent mass-producibility, it is widely used mainly for improving the wear resistance, heat resistance, surface hardness, electrical insulation, heat insulation, etc. of metal products, that is, for surface modification.
このセラミック溶射において最も重要なのは、セラミッ
ク溶射皮膜と母材との密着性をいかに確保するかである
。圧延加工や切削加工された金属の表面へ直接溶射した
のでは十分な密着力は得られない。The most important thing in this ceramic spraying is how to ensure the adhesion between the ceramic spray coating and the base material. Direct thermal spraying onto the surface of rolled or cut metal does not provide sufficient adhesion.
そこで、この密着性確保のためにサンドブラストによる
母材表面の粗化が広く行われている。Therefore, in order to ensure this adhesion, roughening of the surface of the base material by sandblasting is widely practiced.
これは母材表面に研摩粒子を圧縮エアとともにたたきつ
けることにより母材表面に凹凸を形成し、溶射皮膜の投
錨効果による密着力を高めるものである。This method creates irregularities on the surface of the base material by hitting the surface of the base material with abrasive particles together with compressed air, thereby increasing the adhesion of the thermally sprayed coating due to its anchoring effect.
（発明が解決しようとする課題）
しかし、サンドブラスト加工は、先に述べたように研摩
粒子を母材表面にたたきつけるために母材表面は、研摩
粒子の衝突によって面方向に延びようとする。母材が、
ブロック等のバルク材であるときには、母材の変形は少
なくてすむが展性のある金属板では、そりが発生してし
まう。そりの量は、板厚が薄いほど大きくなる傾向にあ
る。(Problems to be Solved by the Invention) However, in the sandblasting process, as described above, since the abrasive particles are struck against the surface of the base material, the surface of the base material tends to extend in the plane direction due to the collision of the abrasive particles. The base material is
When the material is a bulk material such as a block, there is little deformation of the base material, but when the material is a malleable metal plate, warping occurs. The amount of warpage tends to increase as the plate thickness becomes thinner.
そりの発生を緩和するためには、研摩粒子の搬送エア圧
力を低くするか、もしくは、粒径の小さな研摩粒子を用
いる方法が考えられる。しかし、これらの方法では溶射
皮膜の密着力を十分に確保するための粗面を得ることが
困難となってしまう。In order to reduce the occurrence of warping, it is possible to reduce the air pressure for conveying the abrasive particles or to use abrasive particles with a small particle size. However, with these methods, it is difficult to obtain a rough surface to ensure sufficient adhesion of the thermal spray coating.
また、サンドブラストを行なわないで、金属板を酸によ
るエツチング処理等により粗化する方法も行われてはい
るが、サンドブラスト法はどの十分な溶射層の密着力が
得られない。Furthermore, methods have been used in which the metal plate is roughened by etching with acid or the like without sandblasting, but the sandblasting method does not provide sufficient adhesion of the sprayed layer.
このように、従来行われているサンドブラストを行った
後の溶射又は酸によるエツチング処理後の溶射では、粗
面形成後の金属板のそりの発生防止と溶射層の密着力の
確保という２つの課題を同時に解決することができなか
った。In this way, conventional thermal spraying after sandblasting or acid etching has two problems: preventing warping of the metal plate after forming a rough surface and ensuring the adhesion of the sprayed layer. could not be solved at the same time.
本発明は、上記２つの課題を同時に解決する方法を提供
することを目的とするものである。The present invention aims to provide a method for solving the above two problems at the same time.
（課電を解決するための手段）
すなわち本発明は、母材である金属板の被溶射面を電気
めっきにより粗面形成した後溶射することを特徴とする
金属板へのセラミックの溶射方法である。(Means for solving electrification) That is, the present invention is a method for thermal spraying ceramic onto a metal plate, which is characterized in that the surface to be thermally sprayed of a base metal plate is roughened by electroplating and then thermal sprayed. be.
ここで、電気めっきによって得る粗面の形状は、めっき
金属結晶粒子の集合体である多結晶構造である必要があ
る。このときの粗面の表面粗さは、１〜１０μｍの範囲
であることが好ましい。すなわち、粗さ１ｌｔｆ１１以
下では溶射層との十分な密着強度が得られず、また、粗
さ１０μｍ以上では、溶射セラミックスの電気絶縁性、
断熱性等の特性を損う恐れがあるためである。Here, the shape of the rough surface obtained by electroplating needs to have a polycrystalline structure that is an aggregate of plated metal crystal particles. The surface roughness of the rough surface at this time is preferably in the range of 1 to 10 μm. That is, if the roughness is less than 1ltf11, sufficient adhesion strength with the sprayed layer cannot be obtained, and if the roughness is more than 10μm, the electrical insulation properties of the sprayed ceramics
This is because there is a possibility that properties such as heat insulation properties may be impaired.
また、この電気めっきによる粗′苗と金属板との密着力
が不足する場合には、粗面と金属板との間に通常の平滑
なめっきを必要に応じて設ければよい。In addition, if the adhesion between the seedlings and the metal plate is insufficient due to this electroplating, ordinary smooth plating may be provided between the rough surface and the metal plate as necessary.
このようなめっき金属結晶粒子の集合体である多結晶構
造の粗面を電気めっきで得るための方法としては、陰極
すなわち金属板の電流密度を通常の一般的な平滑なめっ
きを得るための電流密度よりも高くすればよい。そして
、先に述べた表面粗さ１〜１０μｍの範１になるように
電流密度とめっき時間を適宜調整すればよい。In order to obtain a rough surface with a polycrystalline structure, which is an aggregate of plated metal crystal particles, by electroplating, the current density of the cathode, that is, the metal plate, is changed to the current density that is normally used to obtain smooth plating. Just make it higher than the density. Then, the current density and plating time may be adjusted as appropriate so that the surface roughness is within the range 1 of 1 to 10 μm.
本発明で使用できる金属板としては、銅板、アルミ板、
ニッケル板、銀板、鋼板、インバー合金板、またはこれ
らの合金板、クラツド板、めっき板などが挙げられる。Metal plates that can be used in the present invention include copper plates, aluminum plates,
Examples include nickel plates, silver plates, steel plates, invar alloy plates, alloy plates thereof, clad plates, plated plates, etc.
また、この金属板表面へ析出させるめっき金属としては
、銅、ニッケル、クロム、アルミ、亜鉛等を用いること
ができる。Further, as the plating metal to be deposited on the surface of this metal plate, copper, nickel, chromium, aluminum, zinc, etc. can be used.
また、溶射方法としては、プラズマ溶射法、ガス溶射法
、減圧溶射法等を適用できる。Further, as a thermal spraying method, a plasma spraying method, a gas spraying method, a reduced pressure spraying method, etc. can be applied.
溶射するセラミックとしては、アルミナ、チタニア、ジ
ルコニア、カルシア、マグネシア、チタン酸バリウム、
クロミア、ムライト、ジルコン、コージェライト等を用
いることができる。Ceramics to be sprayed include alumina, titania, zirconia, calcia, magnesia, barium titanate,
Chromia, mullite, zircon, cordierite, etc. can be used.
（作用）
従来のサンドブラスト法を用いて金属板を粗化した場合
にはそりが発生してしまうが、本発明の方法では、先に
も述べたように電気めっきにより粗面を形成するためそ
りは発生しない。(Function) When a metal plate is roughened using the conventional sandblasting method, warping occurs, but in the method of the present invention, as mentioned earlier, the roughened surface is formed by electroplating. does not occur.
また、このようにして得られた粗面は、溶射層との間に
十分な投錨効果をもたらす。その粗面と溶射層との密着
力は、酸によるエツチングで得た粗面と溶射層の密着力
より強く、サンドブラスト法で得た粗面と溶射層の密着
力と同等かそれ以上である。Furthermore, the rough surface thus obtained provides a sufficient anchoring effect with the thermal spray layer. The adhesion between the rough surface and the sprayed layer is stronger than the adhesion between the rough surface and the sprayed layer obtained by acid etching, and is equal to or greater than the adhesion between the roughened surface and the sprayed layer obtained by sandblasting.
このように本発明の方法によれば、金属板へのセラミッ
クの溶射において、金属板の粗面形成時のそり発生を防
止し、なおかつ溶射層の強い密着力を得ることができる
。As described above, according to the method of the present invention, when thermally spraying ceramic onto a metal plate, it is possible to prevent warpage when forming a rough surface of the metal plate, and to obtain strong adhesion of the thermally sprayed layer.
（実施例） 本発明の実施例を第１図を用いて以下説明する。(Example) An embodiment of the present invention will be described below with reference to FIG.
金属板として板厚０．２１のケイ素鋼板１を用いた。こ
のケイ素鋼板にピロリン階調によりストライクめっき層
２を形成した後、硫酸銅めっきにより銅めっき層３を形
成した。硫酸銅めっき液の主組成は、硫酸銅１３０ｇ／
ｌ、硫酸１００ ｇ ／ Ｌとした。硫酸銅めっき時の
這流密度は最初は３λ／ ｄ ｒｎ”とし、厚さ６μｍ
の通常の平滑なめっきを施し、次に層流密度を１２Ａ／
ｄｒｒｆにし、めっき金属を粒子状に析出させて、第２
図に示すような結晶粒子の集合体である多結晶構造の粗
面を得た。このときの表面粗さは約５μｍであり、そり
は発生しなかった。A silicon steel plate 1 having a thickness of 0.21 mm was used as the metal plate. A strike plating layer 2 was formed on this silicon steel plate using pyrroline gradation, and then a copper plating layer 3 was formed using copper sulfate plating. The main composition of the copper sulfate plating solution is copper sulfate 130g/
l, sulfuric acid 100 g/L. The creeping flow density during copper sulfate plating is initially 3λ/drn'', and the thickness is 6μm.
Normal smooth plating is applied, and then the laminar flow density is 12A/
drrf, the plating metal is precipitated in the form of particles, and the second
A rough surface with a polycrystalline structure, which is an aggregate of crystal particles as shown in the figure, was obtained. The surface roughness at this time was about 5 μm, and no warping occurred.
次にこの粗面に対してプラズマ溶射法でアルミナを溶射
し、厚さ５０μｍのアルミナ皮膜４を形成した。アルミ
ナ皮膜とめっき層及びめっき層と金属板との密着力は十
分なレベルにあり問題はなかった。Next, alumina was sprayed onto this rough surface using a plasma spraying method to form an alumina film 4 having a thickness of 50 μm. The adhesion between the alumina film and the plating layer and between the plating layer and the metal plate were at a sufficient level and there were no problems.
比較のためサンドブラスト法で表面を粗化したケイ素鋼
板は、大きなそり及び変形が発生し溶射不可となった。For comparison, a silicon steel sheet whose surface was roughened by sandblasting had large warpage and deformation, making thermal spraying impossible.
また、塩化第二鉄に浸漬した後、硫酸に浸漬して粗面を
形成したケイ素鋼板にも同じ条件で溶射を行った。この
ときのアルミナ皮膜は、カッターナイフ刃先との擦過で
容易にはく離し、密着力が先に述べた本発明の方法で得
たものより劣ることがわかった。Furthermore, thermal spraying was carried out under the same conditions on a silicon steel plate which had been immersed in ferric chloride and then immersed in sulfuric acid to form a rough surface. It was found that the alumina film at this time was easily peeled off by abrasion with the cutting edge of the cutter knife, and its adhesion was inferior to that obtained by the method of the present invention described above.
（発明の効果）
以上述べてきたように本発明の方法によれば、金属板へ
のセラミック溶射において金属板の粗面形成時のそりの
発生を防止し、なおかつ溶射層の雀い密着力を得ること
ができる。(Effects of the Invention) As described above, according to the method of the present invention, it is possible to prevent the occurrence of warping when forming a rough surface of a metal plate in ceramic spraying on a metal plate, and to improve the adhesion of the sprayed layer. Obtainable.
第１図は本発明の実施例である硫酸鋼めっきにより粗面
を形成した後アルミナ皮膜を形成したケイ素鋼板の断面
模式図、第２図は硫酸銅めっきにより得た粗面の電顕写
真。
符号の説明
１・・・ケイ素鋼板 ２・・・ストライクめっき
層３・・・銅めっき層 ４・・・アルミナ皮膜第
１図FIG. 1 is a schematic cross-sectional view of a silicon steel sheet in which a rough surface was formed by sulfuric acid steel plating according to an embodiment of the present invention, and then an alumina film was formed, and FIG. 2 is an electron micrograph of the rough surface obtained by copper sulfate plating. Explanation of symbols 1...Silicon steel plate 2...Strike plating layer 3...Copper plating layer 4...Alumina film Figure 1
Claims (2)
電気めっきで粗面を形成した後溶射することを特徴とす
る金属板へのセラミックの溶射方法。1. A method for thermally spraying ceramic onto a metal plate, the method comprising forming a rough surface on the surface of the metal plate by electroplating and then thermally spraying the metal plate.
で粗面を形成した後溶射することを特徴とする金属板へ
のセラミックの溶射方法。2. A method for thermal spraying ceramic onto a metal plate, which comprises applying smooth plating to the surface of the metal plate, forming a rough surface by electroplating, and then thermal spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16249090A JPH0452260A (en) | 1990-06-20 | 1990-06-20 | Method for thermally spraying ceramics on metal sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16249090A JPH0452260A (en) | 1990-06-20 | 1990-06-20 | Method for thermally spraying ceramics on metal sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452260A true JPH0452260A (en) | 1992-02-20 |
Family
ID=15755610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16249090A Pending JPH0452260A (en) | 1990-06-20 | 1990-06-20 | Method for thermally spraying ceramics on metal sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452260A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008032127A (en) * | 2006-07-28 | 2008-02-14 | Ntn Corp | Method for manufacturing bearing member raceway and method for manufacturing rolling bearing |
| JP2011137553A (en) * | 2011-04-05 | 2011-07-14 | Ntn Corp | Method of manufacturing raceway member of bearing and method of manufacturing rolling bearing |
-
1990
- 1990-06-20 JP JP16249090A patent/JPH0452260A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008032127A (en) * | 2006-07-28 | 2008-02-14 | Ntn Corp | Method for manufacturing bearing member raceway and method for manufacturing rolling bearing |
| JP2011137553A (en) * | 2011-04-05 | 2011-07-14 | Ntn Corp | Method of manufacturing raceway member of bearing and method of manufacturing rolling bearing |
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