JPH0453097B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an outer lead bonding apparatus for connecting the outer leads of a semiconductor device to the outer leads of a substrate and mounting the semiconductor device on the substrate.

In this type of equipment, a carrier tape on which a number of semiconductor devices are mounted at equal pitches is transferred in the longitudinal direction, and a printed circuit board to which semiconductor mounting is to be mounted is transferred to the underside of the carrier tape or to another position, and the printed circuit board is cut from the carrier tape. The semiconductor device is lowered and stacked on the board at the mounting position, and the outer lead portions are thermally fused to connect and bond each other.

In this operation, when cutting and taking out the semiconductor mount from the carrier tape, no particular care was taken to align the positions of the semiconductor mount and the cutting mount, and cutting was performed as is.

[Problem that the invention seeks to solve]

However, semiconductor mounting is not always mounted in the correct position relative to the carrier tape.
There may be deviations in the X and Y directions or in the θ direction (rotational direction).

For example, as shown in FIG.
On the other hand, assume that the semiconductor device 2 is installed in the hole 12 at a position rotated by θ ₁ from the reference position. Since the cutter of the cutting device is set in accordance with the reference position, when the outer lead 4 is cut with the cutter, the cutting lines will be lines 14 and 15, and the length of the outer lead 4 will be irregular.

The semiconductor device 2 cut diagonally in this way can be carried to the printed circuit board on the bonding stage and bonded. However, as shown in FIG. As described later, the semiconductor device 2 is moved and aligned in the X, Y, and θ directions according to the pattern of the leads 5, and then brought into close contact with each other and heated and pressed to join the leads 5 and 4. be done.

Although alignment with the leads 5 of the semiconductor device 2 can be achieved by such movement of X, Y, and θ, the overlapping of the leads 5 and 4 becomes uneven, and as shown in FIG. There was a problem in that the overlap length was significantly different from that of B, and there was a risk of connection failure in short portions.

The present invention solves the above-mentioned problems in the conventional devices, and even if the semiconductor device is mounted on the carrier tape at a position shifted from the reference position, the cutting is performed correctly, the leads overlap well, and connection failures are prevented. The object of the present invention is to provide a highly reliable outer lead bonding device that is free from any risk of damage.

[Means for solving problems]

As a means for solving the above-mentioned problems, the present invention involves cutting a plurality of semiconductor devices from a carrier tape to which a plurality of semiconductor devices are attached at the outer lead portion using a cutting device, and removing the semiconductor devices from a printed circuit board. An outer lead bonding device that connects with an outer lead portion and attaches to a printed circuit board, comprising: a pre-cutting positional deviation detection device that detects a positional deviation of the semiconductor device on the carrier tape from a reference position before cutting; a cutting device alignment device that aligns the cutting device with the position of the semiconductor device at a shifted position based on a detection signal of a pre-cutting positional shift detection device; An outer lead bonding device is provided, comprising: a pre-attachment positional deviation detection device for detecting a positional shift; and a pre-attachment positional shift correction device for correcting the positional shift based on the detected value of the pre-attachment positional shift. It is something to do.

〔Example〕

Embodiments of the present invention will be described using the drawings.

FIG. 1 shows a semiconductor device 2 in a part of a printed circuit 1.
3 shows a printed circuit board 3 in which is incorporated.

FIG. 2 is an enlarged view of the vicinity of the semiconductor device 2, and the semiconductor device 2 as shown by the solid line in FIG.
The tips of the outer leads 4 are mounted so as to be overlapped with the leads 5 of the printed circuit on the printed circuit board 3.

As shown in FIG. 3, the semiconductor device 2 is provided with leads 8 connected to pads 7 on the periphery of the IC chip 6. The leads 8 are mutually supported and reinforced by a lead holding plate 9. The ends of the leads 8 protrude from the lead holding plate 9 to form the outer leads 4. 10 is a mark for position detection.

In FIG. 3, the semiconductor device 2 is shown shifted from the reference position by an angle θ ₁ in the rotational direction.

The semiconductor device 2 is manufactured as follows. That is, as shown by the two-dot chain line in FIG. 3, a large number of holes 12 (only one is shown in the figure) are provided at equal pitches along the longitudinal direction of the long carrier tape 11 made of plastic film. The IC chip 6 is connected to the inner end of the lead 8 which extends inward. Up to this state, it is manufactured in advance using an inner lead bonder.

The carrier film 11 in such a state is led to an outer lead bonding device, and the bridge portions of the leads 8 are cut uniformly along the cutting lines 14 and 15 by aligning the semiconductor device 2 and the cutting device as described later. , take out the semiconductor device 2. A portion of the lead 8 protrudes from the lead holding plate 9 and the outer lead 4
form.

A hole 16 as shown in FIG. 4 is provided at a predetermined location on the printed circuit board 3, and a lead 5 made of a printed circuit is provided at a part of the periphery of the hole 16. A semiconductor device 2 as shown by the solid line in FIG. 3 is placed on top of this hole 16, an outer lead 4 is placed on top of the lead 5,
Pressure and heat are applied from above to fuse the lead 5 and the outer lead 4. In this way, the semiconductor device 2 is mounted on the printed circuit board 3.

The outer lead bonding apparatus that performs the above operations will be explained in detail.

FIG. 5 is a side view of the apparatus, in which an XY table 19 on which a bonding head 18 is mounted, an outer lead cutting section 20, a transfer section 21, and a bonding stage 22 are provided on a frame 17.

The bonding head 18 is provided with a bonding tool 23 for fusing the outer leads, and a camera 24 for detecting a positional shift of the semiconductor device 2 with respect to the printed circuit board 3.

A holder 25 for the carrier tape 11 is fixed to the cutting section 20, and a cutter 26 for cutting the outer lead 4 and a camera 55 for detecting the position of the semiconductor device 2 before cutting are mounted on a θ table (rotary table).
It is placed on an XYθ table 56 consisting of an X table and a Y table.

The transfer unit 21 has a suction mechanism 27 at its tip that absorbs the semiconductor device 2, and an arm 28 that rotates around a vertical axis.

Bonding stage 22 is XY table 2
9. Consists of a θ table 30 that rotates, a Z table 31 that moves up and down, and a suction table 32 that has an opening for vacuum suction on its top surface.

A signal indicating the positional deviation of the semiconductor device 2 before mounting obtained by the detection by the camera 24 is inputted to the camera control unit CCU33 to display an image on the monitor 34, and further to the pattern recognition unit PRU35.
It enters the interface control system 36, passes through the stage driver 54, and goes to the XY tables 19, 2.
9. Signals are given to the θ table 30 and Z table 31 to control their movements.

Similarly, the X, Y,
The θ deviation signal is designed to control the movement of the XYθ table 56.

In FIGS. 6 and 7, 37 is a guide rail that intermittently moves the printed circuit boards 3 horizontally one by one (the moving device is not shown), and 38 is a guide rail that moves the printed circuit boards 3 one by one on the guide rail 37. The loader 39 is an unloader that receives the printed circuit boards 3 discharged from the guide rail 37 one by one.

In FIGS. 7 and 8, 11 is a carrier tape, and 40 is a guide rail that intermittently moves the carrier tape substantially horizontally and parallel to the printed circuit board 3 at substantially the same height (the drive device is not shown). 41 is a supply reel for the carrier tape 11;
2 is a storage reel for the spacer film 43, 44 is a feed sprocket, and 45 is an empty tape storage box.

FIG. 9 is a detailed view of the cutting section 20, and shows the die 46.
and a punch 47. Reference numeral 48 is a presser that receives downward force from a spring 49. When the frame 50 moves significantly in the XY directions due to the operation of the camera 55, the punch 47 enters into the cradle 25 without hitting the guide rail 40.

FIG. 10 shows the suction mechanism 27 at the tip of the arm.
Hollow hole 51 is connected to a vacuum source and attracts semiconductor device 2 .

FIG. 11 shows details of the upper part of the bonding stage 22. A hollow suction shaft 52 provided on the suction table 32 penetrates from below the guide rail 37,
The Z table (FIG. 5) is raised and lowered, and when raised, the attracted semiconductor device 2 is supported in a lifted state, so that a gap can be maintained between the outer leads 4 and the leads 5. When lowered, the upper surface of the suction shaft 52 is lower than the lower surface of the IC chip 6, creating a gap. 5
Reference numeral 3 denotes a positioning pin for the printed circuit board 3 that can be retracted and retracted.

The bonding tool 23 is supported so as to be movable up and down, is heated, and connects the outer lead 4 to the lead 5.
It is designed to be connected by pressing it on and fusing it.

To explain the operation, when a certain semiconductor device 2 reaches the cutting section 20 of the carrier tape 11 fed out from the supply reel 41 by the action of the feed sprocket 44 in FIG. 8, the transport is temporarily stopped, and as shown in FIG. The XYθ table 56 operated to position the camera 55 directly above the semiconductor device 2 performs pattern recognition, and the
The amount of deviation in the X, Y, and θ directions with respect to a reference position (stored in advance) is detected in the same manner as pattern recognition by the camera 24, which will be described later. Two marks 10 shown in FIG. 3 are used for this pattern recognition.

The XYθ table 56 is operated based on the X, Y, and θ deviations detected in this way, the cutter 26 is moved, and the die 46 and punch 47 in FIG.
As shown in FIG. 3, the cutting lines 14 and 15 are X,
Both the Y direction and the θ direction match the position of the semiconductor 2.

In this state, the die 46 of the cutter 26 is lowered.
First, the presser 48 contacts the outer lead 4 and clamps the outer lead 4 with the punch 47 to fix it. If die 46 is pressed down again, die 4
6 and the punch 47, the outer lead 4
As shown in FIG. 3, the semiconductor devices 2 are separated by cutting to the same length.

Next, the arm 28 is rotated to attract the semiconductor device 2 with the attraction mechanism 27, and the arm 28 is returned to move the attraction mechanism 27 to position the semiconductor device 2 directly above the bonding stage 22.

At this time, the suction table 32 is raised, and the upper end of the suction shaft 52 is at a position 52'.

The arm 28 is lowered, the semiconductor device 2 is placed on the upper end of the suction shaft 52 of the suction stand 32, the suction shaft 52 performs suction, the suction mechanism 27 stops the suction action, and the semiconductor device 2 is removed from above. At this time, the lower surface of the outer lead 4 is separated upward from the upper surface of the lead 5 by h.

Here, pattern recognition is performed from above using the camera 24. For pattern recognition, a reference pattern in which the two marks 10 at approximately diagonal positions on the semiconductor device 2 are at accurate reference positions is stored in advance, and the reference pattern is stored in advance when the actual semiconductor held on the suction shaft 52 is used. The deviation between the alignment mark of the device 2 and the alignment mark of the reference pattern is detected optically and electrically while moving the XY table 29, and a signal of the amount of deviation is obtained. On the other hand, the positional deviation of the leads 5 of the printed circuit board 3 is similarly detected optically and electrically while moving the XY table 19, and a signal indicating the amount of deviation is obtained. The positions of the leads 5 on the printed circuit board 3 side and the outer leads 4' of the semiconductor device 2 are confirmed by the detection signals of both of the amounts of deviation, and the deviations in the X and Y directions and in θ are detected, and the interface control system By the output signal from 36, XY table 2
9. The leads 5 and the outer leads 4' are aligned by the movement of the θ table 30, and then the semiconductor device 2 is lowered by operating the Z table 31 so that the outer leads 4' overlap and contact the leads 5.

In parallel with this movement, the bonding tool 23 is moved by the XY table 19, reaches directly above the semiconductor device 2, and descends to bond the outer lead 4'.

The movement of the transfer section 21 does not have to be a rotational movement like the arm 28, but the suction mechanism 27 may reciprocate between the guide rails 40 and 37 by linear movement.

〔Effect of the invention〕

According to the present invention, in the cutting section, the amount of deviation before cutting of the semiconductor position with respect to the reference position is detected and the cutter is aligned with the deviation amount before cutting, thereby making it possible to make the length of the outer lead uniform and printing. The overlapping length of the leads on the substrate is uniform, no connection failure occurs, and a highly reliable outer lead bonding device can be provided, which is extremely effective in practice.

[Brief explanation of drawings]

The drawings relate to embodiments of the present invention, and FIG. 1 is a plan view of a printed circuit board, FIG. 2 is an enlarged plan view of the vicinity of the semiconductor device, FIG. 3 is an enlarged plan view of the semiconductor device, and FIG. 4 is a printed circuit board. FIG. 5 is a side view of the outer lead bonding device, FIG. 6 is a front view thereof, FIG. 7 is a plan view of FIG. 6, FIG. 9 is a detailed view of the cut portion, FIG. 10 is a partial sectional view of the adsorption mechanism, FIG. 11 is a sectional view of the top of the bonding stage, and FIG. 12 is a plan view illustrating the cutting state of the conventional example.
FIG. 13 is a plan view of the hole in the mating printed circuit board, and FIG. 14 is a plan view showing the bonded state. 1...Printed circuit, 2...Semiconductor device, 3...
...Printed circuit board, 4,4'...outer lead,
5...Lead, 6...IC chip, 7...Putted,
8, 8'...Lead, 9...Lead holding plate, 10
...Mark, 11...Carrier tape, 12...
Hole, 13... End part, 14, 15... Cutting line, 1
6... Hole, 17... Frame, 18... Bonding head, 19... XY table, 20... Cutting section, 21... Transfer section, 22... Bonding stage, 23... Bonding tool, 24...
camera, 25...cradle, 26...katsuta, 27
... Suction mechanism, 28 ... Arm, 29 ... XY table, 30 ... θ table, 31 ... Z table, 32 ... Suction table, 33 ... CCU, 34 ...
Monitor, 35... PRU, 36... Interface control system, 37... Guide rail, 38... Loader, 39... Unloader, 40... Guide rail, 41... Supply reel, 42... Storage reel,
43... Spacer film, 44... Feed sprocket, 45... Empty tape storage box, 46... Die, 47... Punch, 48... Press, 49...
Spring, 50... Frame, 51... Hollow hole, 5
2,52'...Adsorption shaft, 53...Pin, 54...
Stage driver, 55... Camera, 56...
XYθ table.

Claims (1)

[Scope of Claims] 1. A plurality of semiconductor devices are cut from a carrier tape on which a plurality of semiconductor devices are attached at outer lead portions using a cutting device, and the semiconductor devices are connected to outer lead portions of a printed circuit board and printed. In an outer lead bonding device attached to a substrate, the semiconductor device on the carrier tape includes a pre-cutting positional deviation detection device for detecting a positional deviation from a reference position before cutting, and a detection device for detecting a positional deviation before cutting. a cutting device alignment device that aligns the cutting device with the position of the semiconductor device at a deviated position based on a signal; and a pre-mounting position shift detection device that detects a positional shift of the semiconductor device with respect to the substrate at the mounting position. An outer lead bonding apparatus comprising: a pre-attachment positional shift correcting device for correcting the positional shift based on a detected value of the pre-attachment positional shift.