JPH0454562U

JPH0454562U -

Info

Publication number: JPH0454562U
Application number: JP9575290U
Authority: JP
Priority date: 1990-09-11
Filing date: 1990-09-11
Publication date: 1992-05-11
Anticipated expiration: 2005-05-31
Also published as: JPH0723104Y2

Description

[Brief explanation of the drawing]

第１図は本考案装置を装備したリフロー炉の一
部を省略した要部の一部切欠側面図、第２図は同
上要部の平面図、第３図は同上要部の拡大正面図
、第４図は下反り防止、および／または、補正用
のチエン昇降機構の正面図、第５図は下反り防止
、および／または、補正用のチエンの一部拡大正
面図である。Ａ……リフロー炉、１ａ，１ｂ……無端チエン
、２……プリント基板、３ａ……予熱ゾーン（昇
温ゾーン）、３ｂ……溶融ゾーン（リフローゾー
ン）、４……冷却ゾーン、５……固定レール、６
……水平移動レール、７ａ，７ｂ……保持杆、８
ａ，８ｂ……レール、９ａ，９ｂ……上反り補正
用の無端チエン、１０ａ，１０ｂ……水平ピン、
１１ａ，１１ｂ……アタツチメント、３５……移
動保持杆、３６……レール、３７……アタツチメ
ント、３８……下反り防止、および／または、補
正用の無端チエン、３９……螺杆、４０……スプ
ロケツト、４１……チエン、４２……スプロケツ
ト。 Fig. 1 is a partially cutaway side view of the main parts of a reflow oven equipped with the device of the present invention, with some parts omitted, Fig. 2 is a plan view of the main parts of the same, and Fig. 3 is an enlarged front view of the main parts of the same. FIG. 4 is a front view of a chain lifting mechanism for preventing and/or correcting downward warping, and FIG. 5 is a partially enlarged front view of the chain for preventing and/or correcting downward warping. A... Reflow oven, 1a, 1b... Endless chain, 2... Printed circuit board, 3a... Preheating zone (temperature raising zone), 3b... Melting zone (reflow zone), 4... Cooling zone, 5... Fixed rail, 6
...Horizontal movement rail, 7a, 7b...Holding rod, 8
a, 8b...Rail, 9a, 9b...Endless chain for upward curvature correction, 10a, 10b...Horizontal pin,
11a, 11b... Attachment, 35... Moving holding rod, 36... Rail, 37... Attachment, 38... Endless chain for preventing downward warpage and/or correction, 39... Screw rod, 40... Sprocket , 41...Chain, 42...Sprocket.

Claims

[Claims for Utility Model Registration] (1) To continuously heat-treat the printed circuit board to a desired temperature profile along the path of the printed circuit board transported by a transport body composed of two parallel endless strips. , in a reflow furnace in which at least a preheating zone (temperature raising zone), a cream solder melting zone (reflow zone), and a cooling zone are arranged in series in this order, the two endless strips 1a constituting the above-mentioned conveying body. ,1
An endless strip 38 that moves at substantially the same speed as the conveyance speed of the conveyor and has means for preventing downward warping of the printed circuit board and/or correcting means is disposed in the center between portions b. 38 from at least the upper side of the melting zone (reflow zone),
A reflow oven characterized in that a reflow oven is formed between the ends of the cooling zone. (2) The reflow oven according to claim 1, wherein the endless strip 38 is provided between the vicinity of the starting end of the preheating zone (temperature raising zone) and the terminal end of the cooling zone. (3) Directly above the endless strips 1a, 1b from near the starting end to the terminal end of the cooling zone, moving in the same direction at substantially the same speed as the endless strips 1a, 1b, and above the printed circuit board. The reflow oven according to claim 1 or 2, further comprising endless conditions 9a and 9b having warpage correction means.