JPH0454563U - - Google Patents
Info
- Publication number
- JPH0454563U JPH0454563U JP9658290U JP9658290U JPH0454563U JP H0454563 U JPH0454563 U JP H0454563U JP 9658290 U JP9658290 U JP 9658290U JP 9658290 U JP9658290 U JP 9658290U JP H0454563 U JPH0454563 U JP H0454563U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- nozzle
- tank
- solder tank
- jetted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims 1
Landscapes
- Molten Solder (AREA)
Description
第１図は本考案の噴流半田付け装置の平面図、
第２図は該半田付け装置のＹ−Ｙ線の断面図であ
る。
１……ノズル、２……ダクト、３……ポンプ、
４……半田槽、５……フイルター、６……樋、７
……ヒーター。
Figure 1 is a plan view of the jet soldering device of the present invention;
FIG. 2 is a cross-sectional view of the soldering device taken along the Y-Y line. 1... Nozzle, 2... Duct, 3... Pump,
4...Solder tank, 5...Filter, 6...Gutter, 7
……heater.
Claims (1)
ルを分離し、これらをダクトで連結して、半田槽
の溶融半田を、ポンプによりノズルに輸送・噴流
させるとともに、該ノズルの片側或は両側には噴
流した溶融半田を流し込む樋を付設し、さらに該
樋は、上部にフイルターを設けた半田槽に連結し
て清浄になつた溶融半田が半田槽に流れ落ちるよ
うにした設備がコンパクトで、半田付け不良が起
こらない噴流半田付け装置。 (2) ノズルが半田槽よりも上に位置し、溶融半
田を半田槽側面に付設したポンプにより半田槽か
らノズルに輸送・噴流するようにした実用新案登
録請求の範囲第１項記載の噴流半田付け装置。 (3) フイルターが着脱自在に設置された金網篭
である実用新案登録請求の範囲第１項及び第２項
記載の噴流半田付け装置。[Scope of Claim for Utility Model Registration] (1) In a jet soldering device, a solder tank and a nozzle are separated, they are connected by a duct, and molten solder from the solder tank is transported and jetted to the nozzle by a pump, and A gutter is attached to one or both sides of the nozzle through which the jetted molten solder flows, and the gutter is further connected to a solder tank having a filter on the top so that the cleaned molten solder flows down into the solder tank. Jet soldering equipment is compact and does not cause soldering defects. (2) The jet solder according to claim 1, wherein the nozzle is located above the solder tank, and the molten solder is transported and jetted from the solder tank to the nozzle by a pump attached to the side of the solder tank. attaching device. (3) The jet soldering device according to claims 1 and 2 of the utility model registration claim, which is a wire mesh basket in which a filter is removably installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990096582U JP2504129Y2 (en) | 1990-09-13 | 1990-09-13 | Jet soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990096582U JP2504129Y2 (en) | 1990-09-13 | 1990-09-13 | Jet soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0454563U true JPH0454563U (en) | 1992-05-11 |
| JP2504129Y2 JP2504129Y2 (en) | 1996-07-10 |
Family
ID=31836241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990096582U Expired - Fee Related JP2504129Y2 (en) | 1990-09-13 | 1990-09-13 | Jet soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504129Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS532427U (en) * | 1976-06-24 | 1978-01-11 | ||
| JPS6037261A (en) * | 1982-01-12 | 1985-02-26 | エレクトロバート・リミテツド | Soldering apparatus |
-
1990
- 1990-09-13 JP JP1990096582U patent/JP2504129Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS532427U (en) * | 1976-06-24 | 1978-01-11 | ||
| JPS6037261A (en) * | 1982-01-12 | 1985-02-26 | エレクトロバート・リミテツド | Soldering apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504129Y2 (en) | 1996-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |