JPH0455055A - Jet type soldering device - Google Patents

Abstract

PURPOSE:To prevent a soldering defect by opening a nozzle in the direction orthogonal with the direction where objects to be soldered progress, freely rotatably providing an endless body in the direction orthogonal with the direction where the objects to be soldered progress in the form of closing this aperture and providing solder ejection holes over the entire length of this endless body. CONSTITUTION:The nozzle 12 and a pump mechanism 15 which pressurizes and supplies the molten solder 13 in a tank body 11 to the nozzle 12 through a duct 14 are provided in this tank body 11. The endless body 23 is freely turnably provided in the direction orthogonal with the direction where the objects to be soldered progress in the form of closing the aperture 22 of the nozzle 12. The ejection holes 26 provided over the entire length of the endless body 23 move without stopping even momentarily when this endless body 23 is turned. The molten solder 31 ejected from these ejection holes 26 moves at all times in the direction orthogonal with the direction A where the objects to be soldered progress. Gases are expelled from the recessed surfaces in the lower parts of the objects 32 to be soldered by the moving wave 31 thereof, by which the soldering defect by the stagnation of the gases is prevented.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a jet soldering device.

(Prior Art) As shown in Japanese Patent Publication No. 1-34712, a double nozzle type jet soldering device consisting of a primary nozzle and a secondary nozzle for soldering chip-mounted boards is well known. .

In the secondary nozzle, a cylindrical jet fluid is slidably fitted into a nozzle opening that is elongated in a direction perpendicular to the traveling direction of the substrate, and this jet fluid is linearly reciprocated by a crank device. , the solder waves jetted through a large number of small holes provided in the jet fluid are reciprocated in a direction intersecting the running direction of the board.

By moving the molten solder waves in this way, flux gas that tends to stay between chip components that are surface-mounted on the board at high density is expelled, thereby preventing soldering defects.

(Problems to be Solved by the Invention) Since the primary nozzle described in this publication reciprocates the cylindrical jet fluid using a crank mechanism, the jet fluid stops momentarily when switching between forward and backward motions. At that moment, the molten solder wave ejecting from the small hole of the jet also stops. Therefore, when the jet is stopped, the effect of reciprocating the jet does not appear between the chip parts facing the small hole of the jet.

The present invention has been made in view of these points, and provides a jet soldering device that does not stop the movement of molten solder waves in a direction perpendicular to the soldering direction even for a moment. The purpose is to

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a jet soldering device for soldering an object 32 to be soldered that is moved on a nozzle 12 by a molten solder wave 31 jetted from a nozzle 12. A nozzle 12 elongated in a direction perpendicular to the direction of movement A.
is opened, and an endless body 23 is provided so as to be freely rotatable in a direction perpendicular to the soldering direction A so as to close the opening 22 of this nozzle 12, and a large number of solder ejection holes 26 are provided along the entire length of this endless body 23. This is a jet soldering device equipped with a

(Function) In the present invention, by rotating the endless body 23, the solder spouting hole 26 provided over the entire length of the endless body 23 moves without stopping even for a moment, and the solder spouting through the spouting hole 26. The molten solder wave 31 also constantly moves in a direction perpendicular to the soldering direction A, and this moving wave 31 expels gas from the recessed part of the lower surface of the object 32 to be soldered.
Prevents soldering defects due to gas retention.

(Examples) Hereinafter, the present invention will be described in detail with reference to examples shown in the drawings.

As shown in FIG. 1, a nozzle 1 is installed inside the tank body 11.
2, and a pump mechanism 15 for supplying molten solder 13 in the tank under pressure to the nozzle 12 through a duct 14. This pump mechanism 15 includes a pump casing 16
, a suction port 17, a pump blade 18, a drive shaft 19, a transmission mechanism 20, a drive motor 21, and the like.

The upper end of the nozzle 12
Direction perpendicular to (perpendicular to the drawing surface) (left and right direction in Fig. 1)
It has a long and narrow opening. An endless body 23 is provided so as to be freely rotatable in a direction perpendicular to the soldering direction to close the opening 22 of the nozzle 12. A driving wheel 24 and a driven wheel 25 are supported via a bracket (not shown) on the side.
is wrapped around.

As shown in FIG. 2, the endless body 23 is formed of a strip plate made of stainless steel or the like, and a large number of solder injection holes 26 are provided at a constant pitch over its entire length. Furthermore, conical convex portions 27 and 28 that fit into the respective solder ejection holes 26 are protruded at the same pitch on the peripheral surfaces of the driving wheel 24 and the driven wheel 25.

As shown in FIGS. 3 and 4, the endless body 23
are provided in parallel, and the upper moving part of each endless body 23 is movably guided by two sets of guide rails 29 provided in the opening 22 of the nozzle 12.
Curvature of the upper moving part of is prevented.

The rotating parts at both ends of the two endless bodies 23 are wound around two sets of driving wheels 24 and driven wheels that operate independently of each other, and a third
As shown in the figure, the two endless bodies 23 are rotated in opposite directions.

Then, as shown in FIG.
3 is force-fed to the nozzle 12 by the pump mechanism 15, and is jetted from the nozzle 12 through the solder spouting hole 26 of the endless body 23 as a protruding molten solder wave 31.
Soldering is performed on the lower surface of the soldering object 32 (printed wiring board with chip components etc. mounted on the lower surface) which is moved above. At this time, as shown in FIG. 3, by rotating the endless body 23 in a direction perpendicular to the soldering direction A, the solder ejection holes 26 provided over the entire length of the endless body 23 are instantly released. The molten solder wave 31 that flows through the jet hole 26 also moves in a direction perpendicular to the soldering direction A, and this moving wave 31 moves the soldering object 32 without stopping. Gas is expelled from the recess on the lower surface of the solder to prevent soldering defects due to gas stagnation.

The solder injection hole 26 of the endless body 23 is frequently connected to the drive wheel 2.
4 and the conical convex portions 27, 28 of the driven wheel 25 are inserted, so there is no risk that the solder injection hole 26 will be clogged with oxides.

Note that the present invention is not limited to the above embodiments.

For example, the endless body 23 is not limited to the strip plate of the embodiment, but may also be a chain, in which case the driving wheels 24
Also, it is preferable to use a sprocket as the driven wheel 25. Further, the endless bodies 23 are not limited to two rows as in the embodiment, but may be one row or three or more rows. moreover,
Two or more rows of endless bodies may be driven in the same direction.

〔Effect of the invention〕

According to the present invention, an elongated nozzle is opened in a direction perpendicular to the direction of movement of the object to be soldered, and an endless body is provided so as to be freely rotatable in the direction orthogonal to the direction of movement of the object to be soldered, so as to close the opening of the nozzle. Since a large number of solder ejection holes are provided along the entire length of this endless body, this jet soldering device does not stop the movement of the molten solder wave in the direction perpendicular to the direction of movement of the object to be soldered, even for a moment. can be provided. This moving wave drives out the gas from the recessed portion of the lower surface of the object to be soldered, thereby preventing soldering defects due to gas retention.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing an embodiment of the jet soldering device of the present invention, Fig. 2 is a perspective view showing the essential part of the endless body, and Fig. 3 shows two rows of endless bodies and a guide rail. Plan view,
FIG. 4 is a sectional view thereof. 12... Nozzle, 22... Opening, 23... Endless body, 26
...Solder ejection hole, 31.. Molten solder wave, 32.. Object to be soldered. Σke'shi

Claims (1)

[Claims] (1) In a jet soldering device that solders objects to be soldered that are moved on the nozzle by waves of molten solder jetted from a nozzle, a long and narrow nozzle is opened in a direction perpendicular to the direction of movement of the objects to be soldered; A jet type characterized in that an endless body is provided so as to be freely rotatable in a direction perpendicular to the direction of movement of the object to be soldered so as to close the opening of the nozzle, and a large number of solder ejection holes are provided along the entire length of this endless body. Soldering equipment.