JPH0455191U - - Google Patents
Info
- Publication number
- JPH0455191U JPH0455191U JP9658490U JP9658490U JPH0455191U JP H0455191 U JPH0455191 U JP H0455191U JP 9658490 U JP9658490 U JP 9658490U JP 9658490 U JP9658490 U JP 9658490U JP H0455191 U JPH0455191 U JP H0455191U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- bellows
- flange
- electronic component
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 239000003507 refrigerant Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の原理説明図、第２図は本考案
による一実施例の説明図で、ａは側面図、ｂは組
立説明図、第３図のａ，ｂ，ｃは本考案のベロー
ズの加工説明図、第４図は従来の説明図で、ａは
側面断面図、ｂはベローズの接合説明図を示す。
図において、１は冷却プレート、２は電子部品
、３はフランジ、４はプレート、５はベローズ、
６は肉厚部、７はＯリング、８は止め輪、９は媒
体、３Ａ，４Ａは口金、６Ａは外周、６Ｂは内周
を示す。
Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the present invention, where a is a side view, b is an explanatory diagram of assembly, and a, b, and c in Fig. 3 are illustrations of the present invention. FIG. 4 is an explanatory diagram of a conventional bellows process, in which a is a side sectional view and b is an explanatory diagram of bellows joining. In the figure, 1 is a cooling plate, 2 is an electronic component, 3 is a flange, 4 is a plate, 5 is a bellows,
6 is a thick part, 7 is an O-ring, 8 is a retaining ring, 9 is a medium, 3A and 4A are caps, 6A is an outer periphery, and 6B is an inner periphery.
Claims (1)
子部品２に当接されるプレート４と、一端が該フ
ランジ３に、他端が該プレート４に連結されるベ
ローズ５とを備え、該冷却プレート１から該ベロ
ーズ５の内部に冷媒９が送出されることで該電子
部品２の冷却を行う電子部品の冷却素子であつて
、 前記フランジ３および前記プレート４のそれぞ
れにＯリング７を保持した口金３Ａ，４Ａを形成
すると共に、前記ベローズ５の両端末に肉厚部６
を形成し、該肉厚部６の内周６Ｂを該口金３Ａ，
４Ａに挿入し、該肉厚部６の内周６Ｂを該Ｏリン
グ７を介在することで該口金３Ａ，４Ａに係止さ
せるよう該肉厚部６の外周６Ａに装着する止め輪
８を設けて成ることを特徴とする電子部品の冷却
素子。[Claims for Utility Model Registration] A flange 3 that is locked to the cooling plate 1, a plate 4 that comes into contact with the electronic component 2, and a bellows that is connected to the flange 3 at one end and to the plate 4 at the other end. 5, the electronic component cooling element cools the electronic component 2 by sending a refrigerant 9 from the cooling plate 1 into the bellows 5, each of the flange 3 and the plate 4. The caps 3A and 4A holding O-rings 7 are formed in the bellows 5, and thick portions 6 are formed at both ends of the bellows 5.
, and the inner periphery 6B of the thick portion 6 is connected to the base 3A,
A retaining ring 8 is provided on the outer periphery 6A of the thick part 6 so that the inner periphery 6B of the thick part 6 is locked to the caps 3A and 4A through the O-ring 7. A cooling element for electronic components, characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9658490U JPH0455191U (en) | 1990-09-14 | 1990-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9658490U JPH0455191U (en) | 1990-09-14 | 1990-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0455191U true JPH0455191U (en) | 1992-05-12 |
Family
ID=31836243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9658490U Pending JPH0455191U (en) | 1990-09-14 | 1990-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455191U (en) |
-
1990
- 1990-09-14 JP JP9658490U patent/JPH0455191U/ja active Pending
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