JPH045653U - - Google Patents
Info
- Publication number
- JPH045653U JPH045653U JP4609290U JP4609290U JPH045653U JP H045653 U JPH045653 U JP H045653U JP 4609290 U JP4609290 U JP 4609290U JP 4609290 U JP4609290 U JP 4609290U JP H045653 U JPH045653 U JP H045653U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- solder film
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の電子部品の一実施例を示す斜
視図、第２図は本考案の電子部品の実装状態を示
す一部断面図、第３図は電子部品の製造工程を示
す図、第４図は従来の電子部品を示す斜視図であ
る。
１……電子部品、１１……本体、１２……リー
ド、１３……半田膜。
FIG. 1 is a perspective view showing an embodiment of the electronic component of the present invention, FIG. 2 is a partial sectional view showing the mounting state of the electronic component of the present invention, and FIG. 3 is a diagram showing the manufacturing process of the electronic component. FIG. 4 is a perspective view showing a conventional electronic component. 1...Electronic component, 11...Main body, 12...Lead, 13...Solder film.
Claims (1)
このリードをプリント基板に電気的に接続する電
子部品において、 前記リードのプリント基板への実装面に半田膜
を設けたことを特徴とする電子部品。 (2) 前記半田膜は、クラツドにより形成したこ
とを特徴とする請求項１記載の電子部品。 (3) 前記半田膜は電子部品のリードを成形する
際に設けることを特徴とする請求項１記載の電子
部品。[Scope of claims for utility model registration] (1) Having a plurality of leads extending protruding from the main body,
An electronic component in which the lead is electrically connected to a printed circuit board, characterized in that a solder film is provided on the mounting surface of the lead to the printed circuit board. (2) The electronic component according to claim 1, wherein the solder film is formed of a cladding. (3) The electronic component according to claim 1, wherein the solder film is provided when molding a lead of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4609290U JPH045653U (en) | 1990-04-27 | 1990-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4609290U JPH045653U (en) | 1990-04-27 | 1990-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045653U true JPH045653U (en) | 1992-01-20 |
Family
ID=31560866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4609290U Pending JPH045653U (en) | 1990-04-27 | 1990-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045653U (en) |
-
1990
- 1990-04-27 JP JP4609290U patent/JPH045653U/ja active Pending