JPH04567U - - Google Patents
Info
- Publication number
- JPH04567U JPH04567U JP3989290U JP3989290U JPH04567U JP H04567 U JPH04567 U JP H04567U JP 3989290 U JP3989290 U JP 3989290U JP 3989290 U JP3989290 U JP 3989290U JP H04567 U JPH04567 U JP H04567U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat sink
- metal material
- thermal conductivity
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
図面は本考案の一実施例を示すもので、第１図
は分解斜視図、第２図は正面図である。
１……放熱基板、２……絶縁層、３……発熱抵
抗体、４，５……ヒートパイプ、６……放熱板、
７〜１０……ヒートパイプ。
The drawings show an embodiment of the present invention, with FIG. 1 being an exploded perspective view and FIG. 2 being a front view. 1... heat dissipation board, 2... insulating layer, 3... heating resistor, 4, 5... heat pipe, 6... heat dissipation plate,
7-10...Heat pipe.
Claims (1)
に表面に発熱抵抗体が絶縁層を介して配列された
放熱基板と、扁平な断面形状を有して前記放熱基
板に埋設された複数本のヒートパイプと、熱伝導
性の高い金属材により形成されて前記放熱基板の
裏面に接合された放熱板と、この放熱板に埋設さ
れた複数本のヒートパイプとよりなることを特徴
とするサーマルヘツド冷却装置。 A heat dissipation board made of a metal material with high thermal conductivity and having heating resistors arranged on the surface with an insulating layer interposed therebetween, and a plurality of heat pipes having a flat cross-sectional shape and embedded in the heat dissipation board. A thermal head cooling device comprising: a heat sink made of a metal material with high thermal conductivity and bonded to the back surface of the heat sink; and a plurality of heat pipes embedded in the heat sink. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3989290U JP2526557Y2 (en) | 1990-04-13 | 1990-04-13 | Thermal head cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3989290U JP2526557Y2 (en) | 1990-04-13 | 1990-04-13 | Thermal head cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04567U true JPH04567U (en) | 1992-01-06 |
| JP2526557Y2 JP2526557Y2 (en) | 1997-02-19 |
Family
ID=31549200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3989290U Expired - Lifetime JP2526557Y2 (en) | 1990-04-13 | 1990-04-13 | Thermal head cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2526557Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166585A (en) * | 2000-11-30 | 2002-06-11 | Shinko Electric Co Ltd | Thermal head |
-
1990
- 1990-04-13 JP JP3989290U patent/JP2526557Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166585A (en) * | 2000-11-30 | 2002-06-11 | Shinko Electric Co Ltd | Thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2526557Y2 (en) | 1997-02-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |