JPH045688B2 - - Google Patents
Info
- Publication number
- JPH045688B2 JPH045688B2 JP62262028A JP26202887A JPH045688B2 JP H045688 B2 JPH045688 B2 JP H045688B2 JP 62262028 A JP62262028 A JP 62262028A JP 26202887 A JP26202887 A JP 26202887A JP H045688 B2 JPH045688 B2 JP H045688B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- component
- resins
- ipn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 69
- 239000011347 resin Substances 0.000 claims description 69
- 229920005992 thermoplastic resin Polymers 0.000 claims description 28
- 239000010419 fine particle Substances 0.000 claims description 24
- 239000000835 fiber Substances 0.000 claims description 23
- 239000011159 matrix material Substances 0.000 claims description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000004952 Polyamide Substances 0.000 claims description 9
- 229920002647 polyamide Polymers 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000002131 composite material Substances 0.000 description 19
- 239000012783 reinforcing fiber Substances 0.000 description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229920000049 Carbon (fiber) Polymers 0.000 description 7
- 239000004917 carbon fiber Substances 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000004695 Polyether sulfone Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 229920006393 polyether sulfone Polymers 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000004643 cyanate ester Substances 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000011859 microparticle Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000002087 whitening effect Effects 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920006037 cross link polymer Polymers 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003733 fiber-reinforced composite Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 229920001727 cellulose butyrate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 230000009975 flexible effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229910000489 osmium tetroxide Inorganic materials 0.000 description 1
- 239000012285 osmium tetroxide Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/04—Polymer mixtures characterised by other features containing interpenetrating networks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、先進複合材料として強度、弾性率、
さらにはこれらを比重で除した比強度、比弾性率
の大なることを要求される構造体に用いられるプ
リプレグに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is an advanced composite material with high strength, elastic modulus,
Furthermore, the present invention relates to prepregs used in structures that are required to have a high specific strength and specific modulus of elasticity, which are obtained by dividing these by specific gravity.
[従来の技術]
繊維強化複合材料は、強化繊維とマトリツクス
樹脂を必須の構成要素とする不均一材料であり、
このため繊維軸方向の物性とそれ以外の方向の物
性に大きな差が存在する。たとえば、落錘衝撃に
対する抵抗性は層間剥離強度によつて支配される
ため強化繊維の強度を向上させても抜本的な改良
には結びつかないことが知られている。このた
め、繊維軸方向以外の物性を改良することを目的
として、マトリツクス樹脂の靭性を改良すること
の他に、種々の方法による改良が提案されてい
る。[Prior Art] Fiber-reinforced composite materials are heterogeneous materials that have reinforcing fibers and matrix resin as essential components.
Therefore, there is a large difference between the physical properties in the fiber axis direction and the physical properties in other directions. For example, it is known that resistance to falling weight impact is controlled by delamination strength, so improving the strength of reinforcing fibers does not lead to drastic improvements. Therefore, in addition to improving the toughness of the matrix resin, various improvements have been proposed for the purpose of improving physical properties in directions other than the fiber axis direction.
USP3472730号明細書(1969年)では、繊維
強化シートの片面あるいは両面にエラストマー
性物質により改質した熱硬化性樹脂からなる独
立外層フイルム(Separate Exterior Film)
を配することにより耐層間剥離力の改善がなさ
れることが開示されている。 USP 3472730 (1969) describes a separate exterior film consisting of a thermosetting resin modified with an elastomeric substance on one or both sides of a fiber-reinforced sheet.
It has been disclosed that the delamination resistance can be improved by disposing a .
特開昭51−58484号公報(特公昭58−31296号
公報)では、繊維強化エポキシ樹脂プリプレグ
の表面にポリエーテルスルホンフイルムを存在
させることで、成形性および曲げ強度の改善が
なされることが開示されている。 JP-A-51-58484 (JP-A-58-31296) discloses that moldability and bending strength can be improved by the presence of a polyether sulfone film on the surface of a fiber-reinforced epoxy resin prepreg. has been done.
特開昭54−3879号公報、特開昭56−115216号
公報、特開昭60−44334号公報では、繊維強化
シートの層間に短繊維チツプ、チヨツプドスト
ランド、ミルドフアイバーを配し、層間強度の
向上がなされることが開示されている。 In JP-A-54-3879, JP-A-56-115216, and JP-A-60-44334, short fiber chips, chopped strands, and milled fibers are arranged between the layers of a fiber reinforced sheet, It is disclosed that interlaminar strength is improved.
特開昭60−63229号公報では、繊維強化プリ
プレグの層間にエラストマーで改質したエポキ
シ樹脂フイルムを配して層間強度の改善がなさ
れることが開示されている。 JP-A-60-63229 discloses that an epoxy resin film modified with an elastomer is disposed between the layers of fiber-reinforced prepreg to improve the interlayer strength.
USP4539253号明細書(1985年)(対応特開
昭60−231738号公報)では、繊維強化プリプレ
グの層間に軽量繊維を基材とする、不織布、織
布、マツト、キヤリアーにエラストマーで改質
したエポキシ樹脂を含浸させたフイルムを配し
て層間強度の改善がなされることが開示されて
いる。 USP 4539253 (1985) (corresponding to Japanese Patent Application Laid-open No. 60-231738) discloses that non-woven fabrics, woven fabrics, mats, and carriers made of epoxy modified with elastomers are made of lightweight fibers as a base material between layers of fiber-reinforced prepreg. It is disclosed that interlaminar strength can be improved by disposing a resin-impregnated film.
USP4604319号明細書(1986年)(対応特開
昭号公報60−231738)では、繊維強化プリプレ
グの層間に熱可塑性樹脂フイルムを配して層間
強度の改善がなされることが開示されている。 USP 4604319 (1986) (corresponding to Japanese Patent Application Laid-Open No. 60-231738) discloses that interlaminar strength can be improved by disposing a thermoplastic resin film between the layers of fiber-reinforced prepreg.
しかし、これらの手法は、その効果が不十分で
あるばかりでなく、それぞれに欠点を有してい
る。エラストマー改質熱硬化性樹脂を含む独立外
層フイルムを用いた場合には、エラストマーの含
量が多くなると耐熱性が低下し、エラストマーの
含量が少ないと層間強度の改善効果は非常に少な
い。 However, these methods are not only insufficiently effective, but also have their own drawbacks. When using an independent outer layer film containing an elastomer-modified thermosetting resin, the heat resistance decreases as the elastomer content increases, and the effect of improving interlaminar strength is very small when the elastomer content is low.
また、熱可塑性樹脂フイルムを用いた場合には
耐熱性の良好な熱可塑性樹脂フイルムを用いるこ
とにより耐熱性と層間強度の改善効果の両立がな
されるが熱硬化性樹脂の利点であるタツク性(粘
着性)やドレーブ性が失われる。また、耐溶剤性
が良くないという熱可塑性樹脂の一般的欠点が複
合材料に反映してしまう。 In addition, when a thermoplastic resin film is used, it is possible to achieve both heat resistance and interlaminar strength improvement effects by using a thermoplastic resin film with good heat resistance. adhesiveness) and drape properties are lost. Moreover, the general drawback of thermoplastic resins, such as poor solvent resistance, is reflected in the composite material.
また、短繊維チヨツプ、チヨツプドストランド
ミルドフアイバーを用いることは、層間を厚くす
るため、コンポジツト全体としての強度低下を招
く。 Furthermore, the use of chopped short fibers or chopped strand milled fibers increases the thickness of the interlayers, resulting in a decrease in the strength of the composite as a whole.
一方、本発明者らな本発明に先だち、熱可塑性
樹脂を微粒子化したものをプリプレグの表面に局
在化させることにより、プリプレグのタツク性、
ドレープ性を有したまま耐衝撃性の大幅に改良さ
れた複合材料を与えるプリプレグを発明した。 On the other hand, prior to the present invention, the present inventors have improved the toughness of prepreg by localizing finely divided thermoplastic resin on the surface of prepreg.
We have invented a prepreg that provides a composite material with significantly improved impact resistance while retaining drapability.
しかしながら、これらの手法は、熱可塑性樹脂
が一般的にもつ耐溶剤性がよくないという欠点を
有している。また、選んだ熱可塑性樹脂の種類に
よつては、マトリツクス樹脂との接着性が十分と
いえず、そのため耐衝撃性、耐疲労性に欠点を有
するものもあつた。 However, these methods have the drawback that thermoplastic resins generally have poor solvent resistance. Furthermore, depending on the type of thermoplastic resin selected, the adhesion with the matrix resin may not be sufficient, and therefore some have drawbacks in impact resistance and fatigue resistance.
[発明が解決しようとする問題点]
そこで、本発明者らは上記欠点のない、耐衝撃
性、耐溶剤性、耐疲労性の優れた繊維強化複合材
料を与えるプリプレグについて鋭意研究を行つた
結果、優れた耐衝撃性を有し、しかも耐溶剤性に
おいても耐疲労性においても良好な性質を有する
複合材料を与えるプリプレグを発明するに致つた
のである。[Problems to be Solved by the Invention] Therefore, the present inventors conducted extensive research on prepregs that provide fiber-reinforced composite materials with excellent impact resistance, solvent resistance, and fatigue resistance without the above-mentioned drawbacks. This led to the invention of a prepreg that provides a composite material with excellent impact resistance, as well as good properties in terms of solvent resistance and fatigue resistance.
[問題点を解決するための手段]
本願発明は次の構成を有する。すなわち下記構
成要素[A],[B],[C]を必須とし、構成要素
[C]の90%以上の量がプリプレグの表面からプ
リプレグの厚さの30%の深さの範囲内に局在化す
るプリプレグ
[A]:長繊維からなる強化繊維
[B]:マトリツクス樹脂
[C]:熱可塑性樹脂と熱硬化性樹脂との組合せ
によりセミIPN(高分子相互侵入網目構造)
化した、もしくはセミIPN化しうる樹脂微粒
子
(長繊維からなる強化繊維の説明)
本発明の構成要素[A]は長繊維からなる強化
繊維である。本発明に用いる強化繊維は、一般に
高性能強化繊維として用いられる耐熱性および引
張強度の良好な繊維である。たとえば、その強化
繊維には、炭素繊維、黒鉛繊維、アラミド繊維、
炭化ケイ素繊維、アルミナ繊維、ボロン繊維があ
げらる。このうち比強度、比弾性率が良好で軽量
化に大きな寄与が認められる炭素繊維や黒鉛繊維
が本発明には最も良好である。炭素繊維や黒鉛繊
維は用途に応じてあらゆる種類の炭素繊維や黒鉛
繊維を用いることが可能であるが、引張強度450
Kgf/mm2、引張伸度1.6%以上の高強度高伸度炭
素繊維が最も適している。また、本発明には長繊
維状の強化繊維を用いるが、その長さは5cm以上
であることが好ましい。それより短い場合、強化
繊維の強度を複合材料として十分に発現させるこ
とが困難となる。また、炭素繊維や黒鉛繊維は他
の強化繊維を混合して用いてもかまわない。ま
た、強化繊維はその形状や配列を限定されず、た
とえば、単一方向、ランダム方向、シート状、マ
ツト状、織物状、組み紐状であつても使用可能で
ある。また、特に、比強度、比弾性率が高いこと
を要求される用途には強化繊維が単一方向に引き
揃えられた配列が最も適しているが、取り扱いの
容易なクロス(織物)状の配列も本発明には適し
ている。[Means for solving the problems] The present invention has the following configuration. In other words, the following components [A], [B], and [C] are essential, and 90% or more of component [C] is localized within a depth range of 30% of the thickness of the prepreg from the surface of the prepreg. Currently available prepreg [A]: Reinforced fiber made of long fibers [B]: Matrix resin [C]: Semi-IPN (polymer interpenetrating network structure) is created by a combination of thermoplastic resin and thermosetting resin.
(Explanation of reinforcing fibers made of long fibers) Component [A] of the present invention is a reinforcing fiber made of long fibers. The reinforcing fibers used in the present invention are generally used as high-performance reinforcing fibers and have good heat resistance and tensile strength. For example, the reinforcing fibers include carbon fiber, graphite fiber, aramid fiber,
Examples include silicon carbide fiber, alumina fiber, and boron fiber. Among these, carbon fibers and graphite fibers are most suitable for the present invention because they have good specific strength and specific modulus and are recognized to greatly contribute to weight reduction. All kinds of carbon fibers and graphite fibers can be used depending on the purpose, but the tensile strength is 450.
High strength and high elongation carbon fiber with Kgf/mm 2 and tensile elongation of 1.6% or more is most suitable. Further, although long reinforcing fibers are used in the present invention, the length thereof is preferably 5 cm or more. If it is shorter than that, it becomes difficult to fully develop the strength of the reinforcing fibers as a composite material. Further, carbon fibers and graphite fibers may be used in combination with other reinforcing fibers. Furthermore, the reinforcing fibers are not limited in their shape or arrangement, and can be used in, for example, unidirectional, random directional, sheet-like, mat-like, woven-like, or braid-like forms. In particular, for applications that require high specific strength and specific modulus, an arrangement in which the reinforcing fibers are aligned in a single direction is most suitable, but a cross (woven) arrangement is easier to handle. are also suitable for the present invention.
(マトリツクス樹脂の説明)
本発明の構成要素[B]はマトリツクス樹脂で
ある。(Description of matrix resin) Component [B] of the present invention is a matrix resin.
本発明に用いるマトリツクス樹脂には熱硬化性
樹脂および熱硬化性樹脂と熱可塑性樹脂を混合し
た樹脂が挙げられる。 The matrix resin used in the present invention includes thermosetting resins and resins obtained by mixing thermosetting resins and thermoplastic resins.
本発明に用いる熱硬化性樹脂は、熱または光や
電子線などの外部からのエネルギーにより硬化し
て、少なくとも部分的に三次元硬化物を形成する
樹脂であれば特に限定されない。好ましい熱硬化
性樹脂としては、エポキシ樹脂があげられ、一般
に硬化剤や硬化触媒と組合せて用いられる。本発
明に適したエポキシ樹脂としては特に、アミン
類、フエノール類、炭素炭素二重結合を有する化
合物を前駆体とするエポキシ樹脂が好ましい。 The thermosetting resin used in the present invention is not particularly limited as long as it is a resin that can be cured by heat or external energy such as light or an electron beam to at least partially form a three-dimensional cured product. Preferred thermosetting resins include epoxy resins, which are generally used in combination with curing agents and curing catalysts. Particularly preferred epoxy resins suitable for the present invention are epoxy resins whose precursors are amines, phenols, and compounds having carbon-carbon double bonds.
また、これらのエポキシ樹脂は単独で用いても
よいし、適宜配合して用いてもよい。 Further, these epoxy resins may be used alone or in an appropriate combination.
エポキシ樹脂はエポキシ硬化剤と組合せて、好
ましく用いられる。エポキシ硬化剤はエポキシ基
と反応しうる活性基を有する化合物であればこれ
を用いることができる。好ましくは、アミノ基、
酸無水物基、アジド基を有する化合物が適してい
る。 Epoxy resins are preferably used in combination with epoxy curing agents. Any compound having an active group capable of reacting with an epoxy group can be used as the epoxy curing agent. Preferably, an amino group,
Compounds having an acid anhydride group or an azide group are suitable.
本発明においては、マトリツクス樹脂としてさ
らに、マレイミド樹脂、アセチレン末端を有する
樹脂、ナジツク酸末端を有する樹脂、シアン酸エ
ステル末端を有する樹脂、ビニル末端を有する樹
脂、アリル末端を有する樹脂が好ましく用いられ
る。これらは、適宜、エポキシ樹脂や、他の樹脂
と混合しても良い。また、反応性希釈剤を用いた
り、熱可塑性樹脂やエラストマーなどの改質剤を
混合して用いてもかまわない。 In the present invention, maleimide resins, resins with acetylene ends, resins with nadic acid ends, resins with cyanate ester ends, resins with vinyl ends, and resins with allyl ends are preferably used as the matrix resin in the present invention. These may be mixed with epoxy resin or other resins as appropriate. Further, a reactive diluent may be used, or a modifier such as a thermoplastic resin or an elastomer may be mixed and used.
マレイミド樹脂は、末端にマレイミド基を平均
2個以上含む化合物である。シアン酸エステル末
端を有する樹脂は、ビスフエノールAに代表され
る多価フエノールのシアン酸エステル化合物が好
適である。シアン酸エステル樹脂は、特にビスマ
レイミド樹脂と組合わせることによりプリプレグ
に適した樹脂とすることができ、三菱ガス化学(株)
製BTレジンが市販されており本発明に適してい
る。これらは一般にエポキシ樹脂より、耐熱性と
耐水性が良好である半面、靭性や耐衝撃性が劣る
ため用途に応じて選択して用いられる。本発明に
おいてエポキシ樹脂の代わりにこれらの他の熱硬
化性樹脂を用いても、本発明の効果は同様であ
る。また、ビニル末端を有する樹脂およびアリル
末端を有する樹脂は、市販の汎用樹脂が用いられ
るが耐熱性が前者の樹脂群より劣るので、主とし
て希釈剤として用いられる。 A maleimide resin is a compound containing an average of two or more maleimide groups at its terminal ends. As the resin having a cyanate ester terminal, a cyanate ester compound of a polyhydric phenol typified by bisphenol A is suitable. Cyanate ester resin can be made into a resin suitable for prepregs, especially when combined with bismaleimide resin, and Mitsubishi Gas Chemical Co., Ltd.
BT resin is commercially available and suitable for the present invention. These generally have better heat resistance and water resistance than epoxy resins, but are inferior in toughness and impact resistance, so they are selected and used depending on the application. Even if these other thermosetting resins are used in place of the epoxy resin in the present invention, the effects of the present invention are the same. Furthermore, commercially available general-purpose resins are used as the vinyl-terminated resin and the allyl-terminated resin, but their heat resistance is inferior to the former group of resins, so they are mainly used as diluents.
本発明に、マトリツクス樹脂として、上記の熱
硬化性樹脂に熱可塑性樹脂を混合して用いること
も好適である。本発明に好適な熱可塑性樹脂は、
主鎖に炭素炭素結合、アミド結合、イミド結合、
エステル結合、エーテル結合、カーボネート結
合、ウレタン結合、尿素結合、チオエーテル結
合、スルホン結合、イミダゾール結合、カルボニ
ル結合から選ばれる結合を有する熱可塑性樹脂で
ある。 In the present invention, it is also suitable to use a mixture of the above-mentioned thermosetting resin and a thermoplastic resin as the matrix resin. Thermoplastic resins suitable for the present invention are:
Carbon-carbon bonds, amide bonds, imide bonds in the main chain,
It is a thermoplastic resin having bonds selected from ester bonds, ether bonds, carbonate bonds, urethane bonds, urea bonds, thioether bonds, sulfone bonds, imidazole bonds, and carbonyl bonds.
これらの熱可塑性樹脂は、市販のポリマーを用
いても良く、また、市販のポリマーより分子量の
低い、いわゆるオリゴマーを用いても良い。オリ
ゴマーとしては、熱硬化性樹脂と反応しうる官能
基を末端または分子鎖中に有するオリゴマーがさ
らに好ましい。 As these thermoplastic resins, commercially available polymers may be used, or so-called oligomers having a lower molecular weight than commercially available polymers may be used. As the oligomer, an oligomer having a functional group capable of reacting with the thermosetting resin at the terminal or in the molecular chain is more preferable.
熱硬化性樹脂と熱可塑性樹脂の混合物は、それ
らを単独で用いた場合より良好な結果を与える。
これは、熱硬化性樹脂が一般に脆い欠点を有しな
がらオートクレーブによる低圧成型が可能である
のに対して、熱可塑性樹脂が一般に強靭である利
点を有しながらオートクレーブによる低圧成型が
困難であるという二律背反した特性を示すため、
それらを混合して用いることで物性と成形性のバ
ランスをとることができるためである。 Mixtures of thermosets and thermoplastics give better results than when they are used alone.
This is because thermosetting resins generally have the disadvantage of being brittle but can be molded at low pressure in an autoclave, while thermoplastic resins have the advantage of being tough but are difficult to mold at low pressure in an autoclave. In order to exhibit contradictory characteristics,
This is because by mixing and using them, it is possible to balance physical properties and moldability.
また、エポキシ樹脂に微粉末状シリカなどの無
機質微粒子やエラストマーなどを少量混合するこ
とも可能である。 It is also possible to mix a small amount of inorganic fine particles such as finely powdered silica or an elastomer with the epoxy resin.
(微粒子の説明)
構成要素[C]は熱可塑性樹脂と熱硬化性樹脂
との組合せによりセミIPN化したもしくはセミ
IPN化しうる樹脂微粒子である。なお、IPNとし
てはInterpenetrating Polymer Networkの略で
架橋高分子どうしの相互侵入網目構造をいい、一
方、セミIPNとは架橋高分子と直鎖状高分子との
相互侵入網目構造をいう。(Description of fine particles) Component [C] is semi-IPN or semi-IPN made by a combination of thermoplastic resin and thermosetting resin.
These are fine resin particles that can be converted into IPN. Note that IPN is an abbreviation for Interpenetrating Polymer Network, and refers to an interpenetrating network structure of crosslinked polymers, while semi-IPN refers to an interpenetrating network structure of crosslinked polymers and linear polymers.
熱可塑性樹脂と熱硬化性樹脂とをセミIPN化し
たものを微粒子とすれば、その組成を選ぶことに
より、粒子自体の靭性を保ちつつ耐溶剤性やマト
リツクス樹脂との接着性の良好な微粒子を得るこ
とができる。但し、このセミIPN化は複合材料成
形中に達成されるものであつてもさしつかえな
い。これを構成要素[C]としたプリプレグを成
形して得た複合材料は耐衝撃性、耐溶剤性および
耐疲労性に優れる。 If we make microparticles by semi-IPNing a thermoplastic resin and a thermosetting resin, by selecting the composition, we can create microparticles that maintain the toughness of the particles themselves and have good solvent resistance and adhesion to the matrix resin. Obtainable. However, it is acceptable even if this semi-IPN is achieved during molding of the composite material. A composite material obtained by molding a prepreg containing this as component [C] has excellent impact resistance, solvent resistance, and fatigue resistance.
ここで用いる熱可塑性樹脂は、主鎖に、炭素炭
素結合、アミド結合、イミド結合、エステル結
合、エーテル結合、カーボネート結合、ウレタン
結合、尿素結合、チオエーテル結合、スルホン結
合、イミダゾール結合、カルボル結合から選ばれ
る結合を有する熱可塑性樹脂である。具体的に
は、ポリアククリレート、ポリ酢酸ビニル、ポリ
スチロールに代表されるビニル系樹脂、ポリアミ
ド、ポリアラミド、ポリエステル、ポリアセター
ル、ポリカーボナート、ポリフエニレンオキシ
ド、ポリフエニレンスルフイド、ポリアリレー
ト、ポリベンズイミダゾール、ポリイミド、ポリ
アミドイミド、ポリエーテルイミド、ポリスルホ
ン、ポリエーテルスルホン、ポリエーテルエーテ
ルケトンのようなエンジニアリングプラスチツク
に属する熱可塑性樹脂、ポリエチレン、ポリプロ
ピレンに代表される炭化水素系樹脂、酢酸セルロ
ース、酪酸セルロースに代表されるセルロース誘
導体が挙げられる。特に、ポリアミド、ポリカー
ボナート、ポリアセタール、ポリフエニレンオキ
シド、ポリフエニレンスルフイド、ポリアリレー
ト、ポリエステル、ポリアミドイミド、ポリイミ
ド、ポリエーテルイミド、ポリスルホン、ポリエ
ーテルスルホン、ポリエーテルエーテルケトン、
ポリアラミド、ポリベンズイミダゾールは耐衝撃
性に優れるので本発明に使用する微粒子の素材と
して適している。この中でも、ポリアミド、ポリ
エーテルイミド、ポリエーテルスルホン、ポリス
ルホンは、高靭性かつ耐熱性良好であり、後記の
熱硬化性樹脂とのセミIPN微粒子も調製しやすい
ため本発明に好的である。ポリアミドの靭性は特
に優れており非晶質透明ナイロンに属するものを
使用することにより耐熱性をも兼ね備えることが
できる。 The thermoplastic resin used here has a main chain selected from carbon-carbon bonds, amide bonds, imide bonds, ester bonds, ether bonds, carbonate bonds, urethane bonds, urea bonds, thioether bonds, sulfone bonds, imidazole bonds, and carbol bonds. It is a thermoplastic resin with a bond that Specifically, vinyl resins such as polyacrylate, polyvinyl acetate, and polystyrene, polyamide, polyaramid, polyester, polyacetal, polycarbonate, polyphenylene oxide, polyphenylene sulfide, polyarylate, and polybenz Thermoplastic resins that belong to engineering plastics such as imidazole, polyimide, polyamideimide, polyetherimide, polysulfone, polyethersulfone, and polyetheretherketone, hydrocarbon resins such as polyethylene and polypropylene, cellulose acetate, and cellulose butyrate. Typical examples include cellulose derivatives. In particular, polyamide, polycarbonate, polyacetal, polyphenylene oxide, polyphenylene sulfide, polyarylate, polyester, polyamideimide, polyimide, polyetherimide, polysulfone, polyethersulfone, polyetheretherketone,
Polyaramid and polybenzimidazole have excellent impact resistance and are therefore suitable as materials for the fine particles used in the present invention. Among these, polyamide, polyetherimide, polyethersulfone, and polysulfone are preferable for the present invention because they have high toughness and good heat resistance, and semi-IPN fine particles with a thermosetting resin described later can be easily prepared. Polyamide has particularly excellent toughness, and by using a polyamide that belongs to the amorphous transparent nylon category, it can also have heat resistance.
熱可塑性樹脂は、組合せる熱可塑性樹脂とセミ
IPNを形成するものであれば良い。具体的にはエ
ポキシ樹脂、ビスマレイミド樹脂、フエノール樹
脂、不飽和ポリエステル樹脂、ポリイミド樹脂等
があげられる。 Thermoplastic resin is a combination of thermoplastic resin and semi-
Anything that forms an IPN is fine. Specific examples include epoxy resins, bismaleimide resins, phenol resins, unsaturated polyester resins, and polyimide resins.
構成要素[C]を形成する熱可塑性樹脂と熱硬
化性樹脂との比率は、熱可塑性樹脂の重量分率が
30−99%程度が良い。99%を越えると微粒子の耐
溶剤性が劣るし、一方、30%未満では微粒子の靭
性不足により、複合材料の耐衝撃特性が劣るため
好ましくない。特に好ましくは50−98%である。 The ratio of the thermoplastic resin and thermosetting resin forming component [C] is such that the weight fraction of the thermoplastic resin is
About 30-99% is good. If it exceeds 99%, the solvent resistance of the fine particles will be poor, while if it is less than 30%, the impact resistance of the composite material will deteriorate due to insufficient toughness of the fine particles, which is not preferable. Particularly preferred is 50-98%.
熱硬化性樹脂の重量分率が意外にも2%程度の
少量でも耐溶剤性の向上効果は大きく、また疲労
特性も急激に向上する。一方、用いる熱可塑性樹
脂微粒子は熱硬化性樹脂とのセミIPN化によつて
靭性が低下すると考えられるため、複合材料の耐
衝撃性は熱可塑性樹脂微粒子そのものを用いた場
合と比べて低下することが通常予想される。とこ
ろが、熱硬化性樹脂の重量分率の小さい範囲にお
いては意外にも耐衝撃性は向上傾向にあるという
効果を見出した。これは、セミIPN化によつて微
粒子とマトリツクス樹脂との接着性が向上したた
めと考えられる。 Surprisingly, even when the weight fraction of the thermosetting resin is as small as 2%, the effect of improving solvent resistance is large and the fatigue properties are also rapidly improved. On the other hand, it is thought that the toughness of the thermoplastic resin fine particles used decreases due to semi-IPN formation with the thermosetting resin, so the impact resistance of the composite material is lower than when the thermoplastic resin fine particles themselves are used. is normally expected. However, it has surprisingly been found that the impact resistance tends to improve in a range where the weight fraction of the thermosetting resin is small. This is thought to be due to the improved adhesion between the fine particles and the matrix resin due to semi-IPN.
構成要素[C]が、ポリアミドとエポキシ樹脂
によりセミIPNを形成した、もしくはセミIPNを
形成しうる微粒子である場合、最終目的物である
複合材料の種々の特性すなわち耐衝撃特性、耐溶
剤性、耐疲労性、耐熱性等のバランスが最適のも
のが得られる。さらには、熱可塑性樹脂を構造材
料に使用した時の一般的欠点とされているクリー
プ特性もセミIPN化により向上するのである。 When component [C] is a semi-IPN formed from polyamide and an epoxy resin, or fine particles capable of forming a semi-IPN, various properties of the final target composite material, such as impact resistance, solvent resistance, An optimal balance of fatigue resistance, heat resistance, etc. can be obtained. Furthermore, the creep property, which is a common drawback when thermoplastic resins are used as structural materials, can be improved by making them semi-IPN.
また、構成要素[C]が微粒子であることは次
の利点を持つ。すなわち、微粒子であれば、マト
リツクス樹脂中に分散した状態で存在するため、
マトリツクス樹脂のもタツク性、ドレープ性がプ
リプレグ特性として反映され、取り扱い性に優れ
たプリプレグとなる。 Moreover, the fact that the component [C] is a fine particle has the following advantages. In other words, fine particles exist in a dispersed state in the matrix resin, so
The tackiness and drape properties of the matrix resin are reflected in the prepreg properties, resulting in a prepreg with excellent handling properties.
構成要素[C]の分布については、プリプレグ
の表面層すなわち、成形して複合材料になつた場
合のプリプレグシートとプリプレグシートとの間
に偏つて存在することが耐衝撃性の優れた複合材
料を与えるために重要である。 Regarding the distribution of component [C], its presence in the surface layer of the prepreg, that is, between the prepreg sheets when molded into a composite material, makes it possible to obtain a composite material with excellent impact resistance. It is important to give.
通常の構成要素[C]の添加ではマトリツクス
樹脂に対する構成要素[C]の含有率の分だけの
改質効果のみが期待されるにすぎないが、プリプ
レグの表面層に偏つて存在する場合は前述の加成
性に基づく予想をはるかに越え、特に耐衝撃性の
向上に関しては、全く予期し得ないほどの著しい
効果が見出されたのである。これを満たす条件
は、構成要素[C]の90%以上が、プリプレグの
表面からプリプレグの厚さの30%の深さの範囲内
に局在化するということである。この条件をはず
れて、プリプレグ内部深くに構成要素[C]が入
つた場合、複合材料の耐衝撃性は条件にあつたも
のと比べて劣る。 When the usual component [C] is added, only the modification effect corresponding to the content of the component [C] in the matrix resin is expected, but if it is concentrated in the surface layer of the prepreg, the above-mentioned A completely unexpected and remarkable effect was discovered, far exceeding expectations based on the additivity of the material, and particularly in terms of improving impact resistance. The condition that satisfies this is that 90% or more of the component [C] is localized within a depth range of 30% of the thickness of the prepreg from the surface of the prepreg. If this condition is not met and component [C] enters deep inside the prepreg, the impact resistance of the composite material will be inferior to that which meets the condition.
構成要素[C]の90%以上が、プリプレグの表
面からプリプレグの厚さの10%の深さの範囲内に
局在化する場合は、より顕著な効果が現れるので
さらに好ましいといえる。 It is more preferable if 90% or more of the constituent element [C] is localized within a depth range of 10% of the thickness of the prepreg from the surface of the prepreg because a more significant effect appears.
なお、本発明によるプリプレグは、プリプレグ
の両面において構成要素[C]が偏つて分布した
ものが、プリプレグの表裏にかかわりなく、自由
に積層することが可能であるため、最適である。
しかし、プリプレグの片面のみに構成要素[C]
が同様の分布をしたプリプレグでも、プリプレグ
どおしを積層する時に構成要素[C]が必ずプリ
プレグ間にくるように注意を払つて使用すれば同
様の効果が得られるため、プリプレグの片面のみ
に構成要素[C]が偏つた分布も本発明には含ま
れる。 Note that the prepreg according to the present invention is optimal because the component [C] is unevenly distributed on both sides of the prepreg because it can be laminated freely regardless of the front and back sides of the prepreg.
However, the component [C] is only on one side of the prepreg.
Even if the prepregs have a similar distribution, the same effect can be obtained if the component [C] is always placed between the prepregs when stacking the prepregs. The present invention also includes a distribution in which the component [C] is biased.
プリプレグ中の構成要素[C]の分布状態の評
価は、次のようにして行う。 The distribution state of the component [C] in the prepreg is evaluated as follows.
まず、プリプレグを二枚の平滑な支持板の間に
はさんで密着させ、長時間かけて徐々に温度を上
げて硬化させせる。この時に重要なのは可能なか
ぎり低温でゲル化させることである。ゲル化しな
いうちに温度を上げるとプリプレグ中の樹脂が流
動し、構成要素[C]が移動するため、プリプレ
グ中における正確な分布状態の評価ができない。 First, the prepreg is sandwiched between two smooth support plates and brought into close contact with each other, and the temperature is gradually raised over a long period of time to harden the prepreg. What is important at this time is to gel at the lowest possible temperature. If the temperature is raised before gelation occurs, the resin in the prepreg will flow and the component [C] will move, making it impossible to accurately evaluate the distribution state in the prepreg.
ゲル化した後、さらに時間をかけて徐々に温度
をかけてプリプレグを硬化させる。この、硬化し
たプリプレグを用いてその断面を200倍以上に拡
大して、200mm×200mm以上の写真を撮る。 After gelation, the prepreg is cured by gradually increasing the temperature over an additional period of time. Using this cured prepreg, the cross section is enlarged 200 times or more and a photograph of 200 mm x 200 mm or more is taken.
この断面写真を用い、まず平均的なプリプレグ
の厚みを求める。層の平均厚みは写真上で、任意
に選んだ少なくとも5箇所で測り、その平均をと
る。次に、両方の支持板に接していた面からプリ
プレグの厚みの30%の位置にプリプレグの面方向
と平行に線をひく。支持板に接していた面と30%
の平行線の間に存在する構成要素[C]の面積を
プリプレグの両面について定量し、これと、プリ
プレグの全幅に渡つて存在する構成要素[C]の
面積を定量し、その比をとることによりプリプレ
グの表面からプリプレグの厚さの30%以内に存在
する構成要素[C]の量が算出される。構成要素
[C]の面積の定量は断面写真から所定の領域に
存在する構成要素[C]部分を全て切り取り、そ
の重量を秤ることにより行う。構成要素[C]の
部分的な分布のばらつきの影響を排除するため、
この評価は得られた写真の幅全域に渡つて行い、
かつ、任意に選んだ5箇所以上の写真について同
様の評価を行い、その平均をとる必要がある。 Using this cross-sectional photograph, first determine the average thickness of the prepreg. The average thickness of the layer is measured at at least 5 arbitrarily selected points on the photograph, and the average thickness is taken. Next, draw a line parallel to the surface direction of the prepreg at a position 30% of the thickness of the prepreg from the surface that was in contact with both support plates. 30% of the surface that was in contact with the support plate
Quantify the area of the component [C] existing between the parallel lines on both sides of the prepreg, quantify this and the area of the component [C] that exists across the entire width of the prepreg, and calculate the ratio. The amount of component [C] present within 30% of the thickness of the prepreg from the surface of the prepreg is calculated. The area of the component [C] is determined by cutting out all the component [C] portions present in a predetermined area from the cross-sectional photograph and weighing them. In order to eliminate the influence of variations in the partial distribution of component [C],
This evaluation was performed over the entire width of the obtained photographs,
In addition, it is necessary to perform similar evaluations on five or more arbitrarily selected photographs and take the average.
構成要素[C]とマトリツクス樹脂との見分け
がつきにくい時は、一方を選択的に染色して観察
する。顕微鏡は光学顕微鏡でも観察可能である
が、染色剤によつては走査型電子顕微鏡のほうが
観察に適している場合もある。 When it is difficult to distinguish between component [C] and matrix resin, one is selectively dyed and observed. Although it is possible to observe using an optical microscope, depending on the stain, a scanning electron microscope may be more suitable for observation.
構成要素[C]の形状は球状に限られるもので
はない。もちろん球状であつてもよいが、樹脂塊
を粉砕した微粉体や、スプレードライ法、再沈殿
法で得られる構成要素[C]のごとく形状さまざ
まの状態で一向に差し支えない。その他、繊維を
短く切断したミルドフアイバー状でも、また針
状、ウイスカー状でも差し支えない。 The shape of component [C] is not limited to a spherical shape. Of course, it may be spherical, but it may be in various shapes, such as a fine powder obtained by crushing a resin lump, or component [C] obtained by a spray drying method or a reprecipitation method. In addition, it may be in the form of milled fibers obtained by cutting the fibers into short lengths, or in the form of needles or whiskers.
構成要素[C]の大きさは粒径で表現される
が、この場合の粒径とは遠心沈降速度法などで求
められる体積平均粒径を意味する。 The size of component [C] is expressed by particle size, and particle size in this case means the volume average particle size determined by centrifugal sedimentation velocity method or the like.
構成要素[C]の大きさは、複合材料となつた
時、強化繊維の配列を著しく乱すほど大きくなけ
ればよい。粒径が150μmをこえる場合は強化繊維
の配列を乱したり、積層して得られる複合材料の
層間を必要以上に厚くするため複合材料としたと
きの物性を低下させる欠点がある。 The size of component [C] need not be so large as to significantly disturb the alignment of the reinforcing fibers when it is made into a composite material. If the particle size exceeds 150 μm, the arrangement of reinforcing fibers may be disturbed or the interlayers of the composite material obtained by lamination may become thicker than necessary, resulting in a disadvantage of deteriorating the physical properties of the composite material.
構成要素[C]の量としてはマトリツクス樹脂
100重量部に対して1重量部〜100重量部の範囲が
適している。1重量部未満では構成要素[C]の
効果がほとんど現れず、また100重量部をこえる
とマトリツクス樹脂との混合が困難になるうえ、
プリプレグのタツク性、ドレープ性が大幅に低下
してしまう。 The amount of component [C] is matrix resin.
A range of 1 part by weight to 100 parts by weight per 100 parts by weight is suitable. If it is less than 1 part by weight, the effect of component [C] will hardly be exhibited, and if it exceeds 100 parts by weight, it will be difficult to mix with the matrix resin, and
The tackiness and drapability of the prepreg will be significantly reduced.
特にマトリツクス樹脂の剛性を複合材料の圧縮
強度の発現に活かしたまま、破断伸度にたかい柔
軟な特性を有する構成要素[C]で複合材料の層
間を高靭化するような目的で使用する場合は、む
しろ1重量部〜30重量部の少ない範囲のほうが好
適である。 In particular, when the rigidity of the matrix resin is utilized to develop the compressive strength of the composite material, the component [C] has a flexible property with high elongation at break and is used for the purpose of increasing the toughness between the layers of the composite material. Rather, a small range of 1 part by weight to 30 parts by weight is preferable.
以下、実施例により本発明をより詳細に説明す
る。 Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例 1
以下の構成よりなる一方向プリプレグを製造し
た。プリプレグの製造は、まずあらかじめ下記の
AとBからなる樹脂の重量分率22%のプリプレグ
を作成し、この両面にCとBのブレンド樹脂を離
型紙上に薄く塗布した樹脂フイルムを貼りつける
ことにより行なつた。なお下記のCの重量部は上
記の二段階の工程を経て最終的に得られたプリプ
レグ樹脂中に含まれる微粒子の量である。Example 1 A unidirectional prepreg having the following configuration was manufactured. To manufacture prepreg, first prepare a prepreg with a weight fraction of 22% of the following resins A and B, and then paste a resin film on both sides of the prepreg with a thin layer of release paper coated with a blended resin of C and B. This was done by Note that the part by weight C below is the amount of fine particles contained in the prepreg resin finally obtained through the above two-step process.
A 強化繊維−炭素繊維T800(東レ(株)製)
B マトリツクス樹脂−以下の組成を有する樹脂
組成物
1 テトラグリシジルジアミノジフエニルメタ
ン(住友化学工業(株)製、ELM434)
……80重量部
2 アミノフエノール型エポキシ樹脂(チバガ
イギー(株)製、0510) ……20重量部
3 4,4′ジアミノジフエニルスルホン(住友
化学工業(株)製、スミキユアS)
……53.4重量部)
C セミIPN微粒子
非晶質透明ナイロン(三菱化成(株)製グリルア
ミドTR−55)、ビスフエノールA型エポキシ
樹脂(油化シエルエポキシ(株)製、エピコート
828)、及びポリアミド系硬化剤(富士化成(株)
製、トーマイド#296)の重量分率が96/3/
1の割合からなる平均粒径16μのセミIPN微粒
子 ……21重量部
得られたプリプレグ中の樹脂の重量分率は34%
であつた。単位面積あたりの樹脂量は69g/m2、
単位面積あたりの炭素繊維量は149g/m2であつ
た。A Reinforcing fiber - carbon fiber T800 (manufactured by Toray Industries, Inc.) B Matrix resin - a resin composition having the following composition 1 Tetraglycidyldiaminodiphenylmethane (manufactured by Sumitomo Chemical Co., Ltd., ELM434)
...80 parts by weight 2 Aminophenol-type epoxy resin (manufactured by Ciba Geigy Co., Ltd., 0510) ...20 parts by weight 3 4,4' Diaminodiphenylsulfone (manufactured by Sumitomo Chemical Co., Ltd., Sumikiure S)
...53.4 parts by weight) C Semi-IPN fine particles Amorphous transparent nylon (Mitsubishi Kasei Co., Ltd., Grilamid TR-55), bisphenol A type epoxy resin (Yuka Ciel Epoxy Co., Ltd., Epicoat)
828), and polyamide curing agent (Fuji Kasei Co., Ltd.)
The weight fraction of Tomide #296) is 96/3/
Semi-IPN fine particles with an average particle size of 16μ consisting of a ratio of
It was hot. The amount of resin per unit area is 69g/ m2 ,
The amount of carbon fiber per unit area was 149 g/m 2 .
このプリプレグを2枚の平滑なテフロン板の間
にはさみ、7日間かけて徐々に150℃まで上げて
硬化させ、その断面を観察した。プリプレグ表面
の厚みの30%までの範囲に存在する微粒子の量を
評価したところその値は98%であり、微粒子は層
間に局在化していた。断面観察は、微粒子を四酸
化オスミウムで選択的に染色し、走査型電子顕微
鏡で行なつた。 This prepreg was sandwiched between two smooth Teflon plates, and the temperature was gradually raised to 150°C for 7 days to cure it, and its cross section was observed. When the amount of fine particles present within a range of up to 30% of the thickness of the prepreg surface was evaluated, the value was 98%, indicating that the fine particles were localized between the layers. Cross-sectional observation was performed by selectively staining the microparticles with osmium tetroxide and using a scanning electron microscope.
つぎに、このプリプレグを32枚疑似等方的に積
層し、通常のオートクレーブによる成形を180℃
で2時間、6Kgf/cm2の圧力下で行つた。成形
後、断面を光学顕微鏡で観察すると、セミIPN粒
子は積層板の層間部分に集中的に存在しているこ
とが確認できた。 Next, 32 sheets of this prepreg were laminated in a quasi-isotropic manner and molded using a normal autoclave at 180°C.
The test was carried out for 2 hours under a pressure of 6 kgf/cm 2 . When the cross section was observed under an optical microscope after molding, it was confirmed that the semi-IPN particles were concentrated in the interlayer parts of the laminate.
疑似等方硬化板を縦150mm、横100mmに切削し
て、中心に1500インチ・ポンド/インチの落錘衝
撃を与えたのち、超音波探傷機により損傷面積を
測定したところ0.7平方インチであつた。ついで、
ASTM D−695に従い衝撃後の圧縮強度を測定
すると37.5Kg/mm2であつた。 After cutting a quasi-isotropically hardened plate to 150 mm in length and 100 mm in width and applying a falling weight impact of 1500 inch-pounds/inch to the center, the damage area was measured using an ultrasonic flaw detector and was found to be 0.7 square inches. . Then,
The compressive strength after impact was measured according to ASTM D-695 and was 37.5 Kg/mm 2 .
また、同じプリプレグを用いて一方向16ply積
層板を成形し、縦1cm,横10cmに切りだしメチル
エチルケトン中で24時間煮沸したが、表面に白化
現象は認められなかつた。この試片の曲げ強度は
178Kg/mm2であり、浸せき前の強度177Kg/mm2と同
等であつた。 Furthermore, a unidirectional 16 ply laminate was formed using the same prepreg, cut into pieces of 1 cm in length and 10 cm in width, and boiled in methyl ethyl ketone for 24 hours, but no whitening phenomenon was observed on the surface. The bending strength of this specimen is
The strength was 178Kg/ mm2 , which was equivalent to the strength before immersion, which was 177Kg/ mm2 .
耐疲労特性はEDS(板端剥離強度)試験モード
で繰り返し荷重(引張)をかけ評価したが、20
Kg/mm2の応力によつては106回の繰り返しをかけ
ても剥離は生じなかつた。 The fatigue resistance was evaluated by applying repeated loads (tensile) in the EDS (edge peel strength) test mode.
At a stress of Kg/mm 2 , no peeling occurred even after 10 6 repetitions.
実施例 2
微粒子としてポリエーテルスルホン5003P(三
井東圧(株)製)、ビスフエノールA型エポキシ樹脂
(油化シエルエポキシ(株)製、エピコート828)、及
び4,4′−ジアミノジフエニルメタン(半井化学
(株)製)の重量分率が70/30/10からなる平均粒径
20μのセミIPN微粒子を用いた。その他は実施例
1と同様の手順を繰り返した。1500インチ・ポン
ド/インチの落錘衝撃を与えたのち、超音波探傷
機により損傷面積を測定したところ2.0平方イン
チであつた。ついで、ASTM D−695に従い衝
撃後の圧縮強度を測定したところ30.1Kg/mm2であ
つた。この積層板をメチルエチルケトン中で24時
間煮沸したところ、外観には変化が認められなか
つた。Example 2 As fine particles, polyether sulfone 5003P (manufactured by Mitsui Toatsu Co., Ltd.), bisphenol A type epoxy resin (manufactured by Yuka Ciel Epoxy Co., Ltd., Epicoat 828), and 4,4'-diaminodiphenylmethane ( Hani Chemical
Co., Ltd.) with a weight fraction of 70/30/10.
Semi-IPN fine particles of 20μ were used. Otherwise, the same procedure as in Example 1 was repeated. After applying a falling weight impact of 1500 inch pounds per inch, the damage area was measured using an ultrasonic flaw detector and was found to be 2.0 square inches. Then, the compressive strength after impact was measured according to ASTM D-695 and found to be 30.1 Kg/mm 2 . When this laminate was boiled in methyl ethyl ketone for 24 hours, no change in appearance was observed.
比較例 1
微粒子として、非晶質透明ナイロン(グリルア
ミドTR−55)の平均粒径13μの微粒子を用いた。
その他は実施例1と同様の手順を繰り返した。
1500インチ・ポンド/インチの落錘衝撃を与えた
のち、超音波探傷機により損傷面積を測定したと
ころ0.7平方インチであつた。ついで、ASTM
D−695に従い衝撃後の圧縮強度を測定したとこ
ろ35.0Kg/mm2と良好であつた。Comparative Example 1 As the fine particles, fine particles of amorphous transparent nylon (Grylamid TR-55) with an average particle size of 13 μm were used.
Otherwise, the same procedure as in Example 1 was repeated.
After applying a falling weight impact of 1500 inch pounds per inch, the damage area was measured using an ultrasonic flaw detector and was found to be 0.7 square inches. Next, ASTM
The compressive strength after impact was measured according to D-695 and was found to be 35.0 Kg/mm 2 , which was good.
しかし、積層板をメチルエチルケトン中で24時
間煮沸したところ、表面の白化現象が著しく、そ
の曲げ強度は165Kg/mm2であり、浸せき前の度177
Kg/mm2と比べ低下した。 However, when the laminate was boiled in methyl ethyl ketone for 24 hours, the surface showed significant whitening, and its bending strength was 165 kg/ mm2 , which was 177 kg before immersion.
It decreased compared to Kg/mm 2 .
また、EDSモードでの疲労試験では20Kg/mm2
の応力を4×105回繰り返しかけると板端剥離が
生じた。 In addition, in the fatigue test in EDS mode, 20Kg/mm 2
When a stress of 4×10 5 times was applied repeatedly, plate edge peeling occurred.
比較例 2
微粒子としてポリエーテルスルホン5003Pの平
均粒径10μのものを用いた。その他は、実施例1
と同様の手順を繰り返した。Comparative Example 2 Polyethersulfone 5003P having an average particle size of 10 μm was used as the fine particles. Others are Example 1
The same procedure was repeated.
落錘衝撃による損傷面積は4平方インチと大き
く、衝撃後の圧縮強度は21.2Kg/mm2という低い値
であつた。 The area damaged by the falling weight impact was as large as 4 square inches, and the compressive strength after the impact was as low as 21.2 kg/mm 2 .
また、メチルエチルケトン中で24時間煮沸した
ところ、表面の白化現象がみられた。 Furthermore, when boiled in methyl ethyl ketone for 24 hours, a whitening phenomenon was observed on the surface.
[発明の効果]
本発明によるプリプレグは、プリプレグとして
のタツク性、ドレープ性を確保しつつ、コンポジ
ツトとしたときに高い耐衝撃性、耐溶剤性、耐疲
労性、耐クリープ特性を得ることができる。[Effects of the Invention] The prepreg according to the present invention can obtain high impact resistance, solvent resistance, fatigue resistance, and creep resistance when made into a composite while ensuring tackiness and drapability as a prepreg. .
Claims (1)
し、構成要素[C]の90%以上の量がプリプレグ
の表面からプリプレグの厚さの30%の深さの範囲
内に局在化するプリプレグ [A]:長繊維からなる強化繊維 [B]:マトリツクス樹脂 [C]:熱可塑性樹脂と熱硬化性樹脂との組合せ
によりセミIPN(高分子相互侵入網目構造)
化した、もしくはセミIPN化しうる樹脂微粒
子 2 構成要素[C]が、エポキシ樹脂とセミIPN
化した、もしくはセミIPN化しうるポリアミドを
素材とする微粒子であることを特徴とする特許請
求の範囲第1項記載のプリプレグ。[Claims] 1. The following components [A], [B], and [C] are essential, and 90% or more of component [C] is distributed from the surface of the prepreg to 30% of the thickness of the prepreg. Prepreg localized within a range of depth [A]: Reinforced fiber made of long fibers [B]: Matrix resin [C]: Semi-IPN (polymer interpenetration) formed by a combination of thermoplastic resin and thermosetting resin. mesh structure)
Resin fine particles 2 that can be converted into or semi-IPN Component [C] is an epoxy resin and semi-IPN
2. The prepreg according to claim 1, wherein the prepreg is fine particles made of polyamide that can be converted into polyamide or semi-IPN.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62262028A JPH01104624A (en) | 1987-10-16 | 1987-10-16 | Prepreg using resin fine particles |
| AT87311364T ATE101407T1 (en) | 1986-12-25 | 1987-12-23 | TOUGH COMPOSITE MATERIALS. |
| EP19870311364 EP0274899B1 (en) | 1986-12-25 | 1987-12-23 | Highly tough composite materials |
| ES87311364T ES2051274T3 (en) | 1986-12-25 | 1987-12-23 | HIGHLY RESISTANT COMPOSITE MATERIALS. |
| DE3789054T DE3789054T2 (en) | 1986-12-25 | 1987-12-23 | Tough composite materials. |
| US07/137,720 US5028478A (en) | 1986-12-25 | 1987-12-24 | Fiber reinforced composite materials having resin practice inter-layer zones |
| US08/005,181 US5789073A (en) | 1986-12-25 | 1993-01-15 | Fiber reinforced composite materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62262028A JPH01104624A (en) | 1987-10-16 | 1987-10-16 | Prepreg using resin fine particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104624A JPH01104624A (en) | 1989-04-21 |
| JPH045688B2 true JPH045688B2 (en) | 1992-02-03 |
Family
ID=17370021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62262028A Granted JPH01104624A (en) | 1986-12-25 | 1987-10-16 | Prepreg using resin fine particles |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104624A (en) |
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-
1987
- 1987-10-16 JP JP62262028A patent/JPH01104624A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01104624A (en) | 1989-04-21 |
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