JPH045693U - - Google Patents
Info
- Publication number
- JPH045693U JPH045693U JP4570990U JP4570990U JPH045693U JP H045693 U JPH045693 U JP H045693U JP 4570990 U JP4570990 U JP 4570990U JP 4570990 U JP4570990 U JP 4570990U JP H045693 U JPH045693 U JP H045693U
- Authority
- JP
- Japan
- Prior art keywords
- board
- pattern
- shielded
- copper foil
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案に係るシールド装置の組立前の
状態を示す正面図、第２図は第１図のシールド装
置の裏面側を示す正面図、第３図は同上装置の組
立状態を示す斜視図、第４図は同上装置の組立後
の状態を示す側面図、第５図は従来のシールド装
置の斜視図である。
１１……回路基板、１１ａ……アースパターン
、１３，１４，１５……基板部分、１３ａ，１４
ａ，１５ａ……銅箔パターン、１６，１６ａ……
ジヤンパー線。
Fig. 1 is a front view showing the state of the shield device according to the present invention before assembly, Fig. 2 is a front view showing the back side of the shield device of Fig. 1, and Fig. 3 is a perspective view showing the assembled state of the same device. FIG. 4 is a side view showing the state of the above device after assembly, and FIG. 5 is a perspective view of the conventional shield device. 11... Circuit board, 11a... Earth pattern, 13, 14, 15... Board part, 13a, 14
a, 15a...Copper foil pattern, 16, 16a...
Jumper line.
Claims (1)
、回路基板上のアースパターンを含むシールド予
定箇所に隣接して設けると共に、 上記各基板部分の銅箔パターンと上記シールド
予定箇所の上記アースパターンとを複数のジヤン
パー線で接続し、 上記各基板部分を上記回路基板より分割し、各
基板部分で上記シールド予定箇所を覆う構成とし
た事を特徴とするシールド装置。[Claims for Utility Model Registration] A plurality of board parts having a copper foil pattern on the board surface are provided adjacent to the intended shielding area including the earth pattern on the circuit board, and the copper foil pattern of each of the board parts and the above A shielding device characterized in that a part to be shielded is connected to the ground pattern by a plurality of jumper wires, each part of the board is divided from the circuit board, and each part of the board covers the part to be shielded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4570990U JPH045693U (en) | 1990-04-28 | 1990-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4570990U JPH045693U (en) | 1990-04-28 | 1990-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045693U true JPH045693U (en) | 1992-01-20 |
Family
ID=31560125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4570990U Pending JPH045693U (en) | 1990-04-28 | 1990-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045693U (en) |
-
1990
- 1990-04-28 JP JP4570990U patent/JPH045693U/ja active Pending