JPH0458323U - - Google Patents
Info
- Publication number
- JPH0458323U JPH0458323U JP10141890U JP10141890U JPH0458323U JP H0458323 U JPH0458323 U JP H0458323U JP 10141890 U JP10141890 U JP 10141890U JP 10141890 U JP10141890 U JP 10141890U JP H0458323 U JPH0458323 U JP H0458323U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- parts
- opening
- axes
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
第１図は実施例１の断面図、第２図は実施例２
の断面図、第３図は実施例３の断面図、第４図は
他の実施例の断面図、第５図は従来例の断面図で
ある。
４ａ，４ｂ，４ｃ……被挿入部品、５ａ，５ｂ
，５ｃ，８……接着剤、６ａ，６ｂ，６ｃ……円
筒形の部品、７……開口部、９……密に嵌合する
部分。
Figure 1 is a sectional view of Example 1, Figure 2 is Example 2
3 is a sectional view of Embodiment 3, FIG. 4 is a sectional view of another embodiment, and FIG. 5 is a sectional view of a conventional example. 4a, 4b, 4c...Inserted parts, 5a, 5b
, 5c, 8...adhesive, 6a, 6b, 6c...cylindrical part, 7...opening, 9...part that fits tightly.
Claims (1)
前記２つの部品を接着結合する接着構造に於いて
、被挿入部品の形状が、前記２つの部品の軸心を
一致させるための挿入部品と密に嵌合する部分と
、接着剤が一定の厚さで充填される部分を有し、
接着剤が充填し易くするために被挿入部品の開口
部が大きな開口部を有する接着結合構造。 In an adhesive structure in which a cylindrical part is inserted into another part and the two parts are adhesively bonded with an adhesive, the shape of the inserted part is inserted so that the axes of the two parts coincide. It has a part that fits tightly with the part and a part that is filled with adhesive to a certain thickness,
Adhesive bonding structure in which the opening of the inserted part has a large opening to facilitate filling with adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10141890U JPH0458323U (en) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10141890U JPH0458323U (en) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0458323U true JPH0458323U (en) | 1992-05-19 |
Family
ID=31844844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10141890U Pending JPH0458323U (en) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0458323U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115629A (en) * | 1979-02-21 | 1980-09-05 | Eaton Corp | Fluid coupling |
| JPS57161089A (en) * | 1981-03-30 | 1982-10-04 | Furukawa Electric Co Ltd:The | Continuously plating apparatus for wire |
| JPS60153538A (en) * | 1984-01-23 | 1985-08-13 | Sharp Corp | Input device of coordinates |
| JPS62139588A (en) * | 1985-12-13 | 1987-06-23 | カシオ計算機株式会社 | sampling electronic instruments |
-
1990
- 1990-09-27 JP JP10141890U patent/JPH0458323U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115629A (en) * | 1979-02-21 | 1980-09-05 | Eaton Corp | Fluid coupling |
| JPS57161089A (en) * | 1981-03-30 | 1982-10-04 | Furukawa Electric Co Ltd:The | Continuously plating apparatus for wire |
| JPS60153538A (en) * | 1984-01-23 | 1985-08-13 | Sharp Corp | Input device of coordinates |
| JPS62139588A (en) * | 1985-12-13 | 1987-06-23 | カシオ計算機株式会社 | sampling electronic instruments |