JPH0458438A - Manufacture of gas discharge type display panel - Google Patents

Abstract

PURPOSE:To form parts at a minute pitch while minutely forming parts themselves by forming parts of a substrate of a gas discharge panel using a screen printing method, a photolithography method and a sand blast method. CONSTITUTION:A solid pattern 33 of a material for forming cathode is printed or a glass substrate 31 by using a thick film printing method. A resist 35 having sand blast resistance is applied on the solid pattern 55. After adhering a mask having a drawn cathode pattern to the resist 35 followed by exposure, the pattern is fixed to obtain a resist pattern 35a. When abrasive of alumina powder is spraid on a sample by using a sand blast machine, a cathode pattern 33a is obtained. When this sample is baked in a baking furnace, a resin content contained in nickel paste and the resist used as the mask are combusted and removed so as to obtain a cathode 33b.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for manufacturing a gas discharge type display panel (hereinafter sometimes abbreviated as a gas discharge panel or panel), and particularly relates to a method for manufacturing a gas discharge type display panel (hereinafter sometimes abbreviated as a gas discharge panel or panel). The present invention relates to a method for manufacturing components to be formed on a panel substrate with high precision.

(Prior art) Gas discharge panels have characteristics such as a wide viewing angle, a high contrast ratio, self-luminous display that is easy to see, and the ability to be made thin. In addition to being used in display devices such as, it is expected to be applied to high-definition televisions and other devices.

A conventional manufacturing method for a gas discharge panel capable of full-color display among such gas discharge panels includes, for example, the method described below. FIG. 3 is a schematic process diagram of this conventional manufacturing method.

According to this method, first, a cathode paste is printed in a predetermined pattern on one substrate by a thick film printing method, and then it is dried and fired (steps S in FIG. 3) to S
3). Further, a paste for forming barrier ribs (also called cell spacing walls) is printed in a predetermined pattern on this substrate by a thick film printing method and then dried. Because the film thickness of the barrier rib is thick (for example, 160 to 200 um of polishing).
This film thickness cannot be obtained with one thick film printing. Therefore, the printing and drying of the base for barrier printing must be repeated multiple times (
Ste Rib 84-S6). Thereafter, this paste is fired (step S7).

After completing the steps up to this point, you can obtain the back board.

Also, on the other board, for example, ndium T
An anode is formed by patterning a deposited film (in oxide) (step 511). Roughly, a phosphor paste (in this example, a conductive phosphor paste containing indium oxide) is printed on this substrate in a predetermined pattern by a thick film printing method, and then dried and fired (steps 812 to 514). . After completing the steps up to this point, the front substrate is obtained.

Next, the front and rear substrates are aligned (step 521), and in this state, sealing glass is applied to the edges of both substrates (step 522), followed by sealing (step 523).

Next, after the space surrounded by both substrates and the seal portion is exhausted through the exhaust pipe valve, discharge gas is sealed into the above-mentioned gap via the exhaust pipe (step 824.25).

After that, the exhaust pipe was burnt off (chip-off),
A gas discharge panel is obtained.

FIG. 4 is a schematic cross-sectional view of one display cell portion of the panel manufactured as described above, cut along the thickness direction of the panel. In FIG. 4, 1] is one substrate, 13 is a cathode, ]5 is a barrier rib, 17 is the other substrate, ]9 is an anode, and 2] is a phosphor.

Depending on the design of the panel, the barrier ribs 15 may be formed on the front substrate side, or may be formed on both the front and rear substrates. Further, the anode 19 may also be formed by a thick film printing method.

In any case, in the conventional panel manufacturing method described above, barrier ribs, cathodes, anodes, phosphors, etc. (these are referred to as parts) were manufactured by thick film printing, so it is relatively easy to manufacture large panels ( It had the advantage that it could be formed.

(Invention or problem to be solved) However, for example, there is a literature ■ (IEICE technical report EID89-70 (1990, 1))
As disclosed in the 1990 IEICE National Symposium ``Latest Trends in Plasma Display'' held in conjunction with the 1990 Spring National Conference of the Institute of Electronics, Information and Communication Engineers, the current thick film printing method has a There is a limit to how many five barrier knobs can be formed, and it is not possible to fabricate components on a substrate at very fine pitches.

Therefore, in the above-mentioned conventional manufacturing method, there is a problem in that when attempting to obtain a gas discharge panel with high definition, a limit force is naturally generated.

This is especially noticeable on full-color display panels. This is because a full-color display panel requires display cells of three colors, red, green, and blue, in a dot, and therefore requires three times as high definition as a mono-color display panel. For example, if a 12-inch (1 inch is about 2.54 cm) panel capable of full-color display and a panel capacity of 640×480 dots is manufactured, eight barrier ribs are required per 1 mm.

Furthermore, in order to maintain the aperture ratio of each display cell at 50% or more under these conditions, the width of the knob (dimension indicated by W in Figure 4) must be approximately 62.5 um. It won't happen. However, with the current thick film printing method, it is not possible to form barrier ribs of such width at a density of 8 ribs/1 mm on the side bottom.

Furthermore, in conventional manufacturing methods, in order to be able to produce barrier ribs with high precision, a highly viscous paste that is less likely to cause pattern sag after printing is used. For this reason, it is difficult to make the pattern surface flat by using the flow of the paste itself, and the surface of the knob is uneven, so when aligning the front and rear substrates, it is difficult to make the pattern surface flat. There was a problem in that it was easily caught on the opposing substrate and the barrier ribs were easily chipped or bent.

In addition, as panels become more precise, parts other than the barrier ribs (specifically, cathodes, anodes, phosphors, etc.) are also becoming finer and finer.
It will have to be formed by pinching. For example, if we consider the above-mentioned example of a 12-inch panel with a capacity of 640 x 480 dots capable of full color display, the cathode and phosphor would be 50
It will have to be formed with a pitch of ~1100u. However, as with the barrier 1 knob, these parts cannot be manufactured using conventional panel manufacturing methods.

The above-mentioned document (2) discloses that there is an attempt to produce barrier ribs using the photonic technique. However, this method also does not give a satisfactory result.

This invention was made in view of these points,
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method that solves the above-mentioned problems and allows components to be formed on a gas discharge panel substrate to be manufactured on the substrate with higher precision than before.

(Means for Solving the Problems) In order to achieve this object, according to the present invention, the following parts (α to ■
T8 is characterized in that it is manufactured in a process including the steps of.

◇)...Step of depositing the above-mentioned component forming material on the above-mentioned substrate.

■...A process of applying a resist having sandblasting resistance onto the above-mentioned component forming material.

(2) A process of patterning the above-mentioned applied resist into a shape corresponding to the predetermined planar shape of the above-mentioned component.

(2) Using the resist pattern obtained by the patterning described above as a mask, the portion of the component forming material exposed from the mask is removed by sandblasting.

Note that the term "substrate" as used herein includes not only various substrates used as substrates for gas discharge panels, but also intermediate products in which components are formed on a substrate. In other words,
The manufacturing method of the present invention can also be used to roughly fabricate another component on a substrate on which one component is already formed.

Further, in carrying out the present invention, it is preferable that the above-mentioned components be one or more components selected from barrier ribs, anodes, cathodes, and phosphors.

Further, in carrying out the present invention, it is preferable that the above-mentioned component forming material is used as a paste for the component, and that the first paste is applied to the substrate by a thick film printing method.

(Function) According to the structure of the present invention, it is sufficient to apply the material for forming the component to the part of the substrate that is missing. In other words, if a thick film printing method is used to apply a part-forming material to a substrate, it is sufficient to print a large-area pattern on the substrate. Therefore, conventional thick film printing methods can be used.

Plus, it's sandblasting resistant! The resolution of the resist is much higher than that of the thick film printing method.

Therefore, a resist mask used in sandblasting to remove unnecessary portions of the component forming material can be formed with sufficiently fine dimensions.

Roughly speaking, this resist mask has a Zant blast resistance of 1
Therefore, the component forming material remains almost exactly as the mask dimensions are. This remaining portion constitutes the component.

In addition, in the case of a configuration in which the part forming material is made of this part forming paste and the paste is applied to the substrate using a thick film printing method, since only a flat pattern is printed, the paste is It will be better to use something with low viscosity. Therefore, the surface of the rough pattern after printing becomes smooth due to the flowing paste. In addition, since it is only necessary to print a flat pattern, the mesh of the plate (screen) used for printing can be made rougher than in the case of directly printing a component pattern.

Therefore, since the film thickness obtained by one printing can be increased, the number of repeated printings can be reduced when producing thick parts.

Additionally, the diameter of the wire that makes up the screen can be made thicker, increasing the durability of the screen.

(Example) Hereinafter, an example of the method for manufacturing a gas discharge panel of the present invention will be described with reference to the drawings. In addition, each figure used in the explanation shows the dimensions and dimensions of each component to the extent that this invention can be understood.
The shape and arrangement are schematically shown. Furthermore, the materials, film thicknesses, temperatures, times, and equipment used in the following description are merely preferred examples within the scope of the present invention. Therefore, it is important to understand that the present invention is not limited to only these conditions.

EXAMPLE 1 A first embodiment of the manufacturing method of the present invention will be explained using an example in which a cathode is formed on a substrate. Figures 1 (A) to (F) are process diagrams for explaining the process, and are process diagrams showing the cross section of the sample at the main steps in the process along a direction perpendicular to the long direction of the cathode. be.

First, a glass substrate 3] is prepared as a substrate (see Fig. 1).
A) ).

Next, a pattern 33 of cathode forming material is printed on the glass substrate 31 using a thick film printing method (FIG. 1(B)).
. The material for forming the cathode is, in this example, Dupont
The 09535% nickel paste made by Co., Ltd. is used. Moreover, the film thickness is 15 to 20 um. Thereafter, this sample was dried for one hour at a temperature of 150° C. (N%).

Next, a resist 35 having sandblasting resistance is applied on the flat pattern 33 (FIG. 1(C)). In this embodiment, a negative type resist called ○5BR-82B manufactured by Tokyo Ohka Kogyo Co., Ltd. is used as the resist including the sandblasting i'1ff. This resist is coated on the flat pattern 33 to a thickness of about 15 to 20 LIm by a subic coating method. The conditions in this case are 5 from the start of rotation.
Increase spinner speed by 500 rotations in seconds and increase n to 60.
Hold for 1 second, then increase the rotation speed to 1500 revolutions/second.
The condition is that the rotation speed is held for 5 seconds, and then the rotational speed is decreased for 5 seconds. After applying the resist, it is dried at a temperature of 70'C for 15 minutes.

Next, an anti-tack agent (anti-tack agent manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied onto the dried resist 35 by a spray coating method (not shown). The reason for using the tack preventive agent is to reduce the exposure percentage of the mask pattern to the resist 35.
This is to prevent the resist from sticking to the mask since it is performed using i-type exposure. This anti-tack agent may not be necessary if the exposure is not in close contact or depending on the characteristics of the resist.

Next, a mask (shown) on which a cathode pattern is drawn is applied to the resist 35, and then exposed at a predetermined exposure fi (resist film thickness (um) xo, 7 mJ/Cm2). Next, the exposed sample is developed by spraying a 0.2% sodium carbonate aqueous solution with a low-pressure spray, and then the pattern is fixed by spraying with 0.0001% hydrochloric acid, and the resist button 35a! (Fig. 1(D)).

Next, a sandblasting machine is used to spray alumina powder abrasive (No. 400) onto the sample. In addition, the sandblasting machine used in this example is Fuji Seisaku PF.
g made by r! Use powder type 5C-3%. Since the resist pattern 35a has sandblasting resistance, the portion of the flat pattern 33 not covered by the resist pattern 35a is removed to obtain a cathode pattern 33a (FIG. 1(E)). Thereafter, the abrasive material and the like are removed from the sample by spraying it with an air gun.

Next, this sample is fired in a firing furnace. In this example, firing is carried out in a firing condition where the temperature is maintained at 580"G for 10 minutes. During this firing process, the resin components contained in the Tsukeru paste and the resist used as a mask are burned and removed. A cathode 33b is obtained.

Leech λj1 Example Next, a second embodiment of the manufacturing method of the present invention will be explained using an example in which barrier ribs are formed on a substrate. Of course, the barrier ribs may be formed directly on the substrate, but in this example, a case will be described in which the barrier ribs are formed on the cathode-equipped substrate produced in the first example. Figures 2 (A) to (D) are
This is a process diagram for explaining the second embodiment, in which a sample in the main steps of the process is taken along a direction parallel to the long plane direction of the cathode 33b (a direction perpendicular to the direction in the case of the first embodiment). FIG.

The cathode 33b is lost during the later sandblasting process.
To avoid damage by abrasive materials, the cathode 33
A buffer layer resist manufactured by Tokyo Ohka Kogyo (a) is applied onto the substrate 3 with b by a spin code method. The condition is that the spinner rotates in 5 seconds from the start of rotation! Set it to 500 rpm and hold it for 15 seconds, then increase the rpm to 15
Rotate up to 00 rpm and hold for 1 second, then? & The condition is to reduce the rotation speed to ○ in 5 seconds. After applying the resist, this sample is dried at a temperature of 70'C for 15 minutes. Thereafter, exposure is performed at an exposure amount of 1515-2 O/cm2. As a result, a buffer layer 4] is obtained (FIG. 2(A)).

This resist forming the buffer layer 41 is an organic resin having a lower hardness than that of the cathode, and therefore has high resistance to sandblasting. Therefore, the cathode can be protected.

Next, since the resist constituting the buffer layer 4 is easily attacked by the solvent in the barrier rib forming material (glass paste to be described later), the buffer layer 47 is coated with a highly solvent-resistant buffer layer protective film. Form 43. This formation is performed under the same spin code conditions as the buffer layer 41 was formed (FIG. 2(A)). By providing the buffer layer protective film 43, the barrier rib forming material can be applied to the buffer layer 41.
Even when applied on top, the buffer layer 41 can be prevented from dissolving or swelling. Note that the resin for this buffer layer protective film 43 is also made by Tokyo Ohka Kogyo Co., Ltd.

Next, a pattern 45 of barrier rib forming material is printed on the buffer layer protective film 43 using a thick film printing method (FIG. 2(B)). In this example, the barrier rib forming material is Glass Space 889741% manufactured by DuPont.
I can use it. Here the height of the barrier rib is 160-200
Since a thickness of approximately 100 um is required, a heter pattern with this thickness cannot be obtained by one printing. For this reason, the distance pattern 45 is formed by repeating the printing and drying processes multiple times. Note that each drying process is performed at a temperature of 150°C for 1 hour. According to the method of the present invention, it is only necessary to form a flat pattern in thick film printing once the barrier ribs are formed. Therefore,
The mesh of the screen used during thick film printing can be made rougher than when the button of the Balnoy 1 knob itself is directly formed. For this reason, the film thickness obtained by one printing becomes thicker, so the number of repeated printings can be reduced compared to the conventional method. To explain with a specific example, if a mesh or 400 screen is used, it would take 20 overprints to obtain a solid pattern with a thickness of 160 Um, but if a mesh or 200 screen is used, it will only take 7 times. In this way, the number of overprints can be reduced. Furthermore, since the coarse mesh screen has thick wires, the durability of the screen can also be improved.

Next, a resist 35 having sandblasting resistance is applied on the solid pattern 45 of the barrier rib forming material by the sand coating method as in the first embodiment (FIG. 2(C)).
. Further, an anti-tack agent (not shown) is applied to the resist layer 35 in the same manner as in the first embodiment.

After that, this resist 35 is exposed, developed and fixed in the first step.
A resist baton (not shown) is formed by sequentially performing the steps under the same conditions as in Example I. Of course, the mask used during exposure is
It is a mask with a barrier rib pattern drawn on it.

Next, as in the first embodiment, unnecessary parts of the flattened pattern 45 were removed using a sandblasting machine, and then the abrasive material was removed from the sample using an air gun, and then a firing furnace was used to remove the abrasive material at a peak temperature of 530''C. The barrier rib pattern is fired under firing conditions that are maintained for 70 minutes.

During this firing process, the resin components contained in the glass paste, the resist used as a mask, the buffer layer protective film 43 and the buffer layer 4] exposed after the sunblasting process are burned and removed. A knob 45a is obtained (FIG. 2(D)). The thus obtained structure having the barrier ribs 45a and the cathode 33b corresponds to the back substrate of the gas discharge panel shown in FIG.

In this second embodiment, either the buffer layer 4] and the buffer layer protective film 43 were left under the barrier ribs 45a, or the buffer layer portions and buffer layer portions of the area where the barrier ribs were to be formed were removed before forming the barrier rib forming material. It is also possible to remove the buffer layer (:! protective film part) in advance. This way, the reliability of the barrier rib can be further improved because the bond between the knob and the substrate is better.

In addition, in this second example, the sandblasting conditions were adjusted to be harmless to the cathode and to remove the barrier rib forming material (it is clear that if this is optimized, the buffer layer 41 and the buffer layer protective film 43 will be unnecessary). It is.

Next, the third embodiment will be explained using an example in which a phosphor is formed on a substrate. In this embodiment, the front board shown in FIG. An example of producing an R structure will be explained.

First, an ITO film is formed on a glass substrate by a known method and roughly patterned by a known patterning technique to form an anode.

Next, in order to protect the ITO film from the abrasive material used in sandblasting, a buffer layer and a buffer layer protective film are formed on the anode-equipped substrate in the same manner as in the second embodiment.

Next, since this example assumes the production of a front substrate for a full-color gas discharge panel, three types of phosphors, red, green, and blue, are formed respectively. In this example, the material for forming each color of phosphor is a paste made by mixing 10 parts of phosphor powder with 5 parts of indium oxide powder and 20 to 25 parts of a viscosity adjusting vehicle to make it conductive. do. The phosphor powders for each color are made by Kasei Obtonics Co., Ltd. Specifically, they are used for red or #KX504A (
Product name), For sewing #PIG1, For blue #K X 501
A Theal.

Therefore, a pattern of paste of one of the three colors is formed on the protective crotch of the buffer layer by a thick film printing method. This is then dried at a temperature of 150'C for 1 hour.

Next, a resist having sandblasting resistance is applied on the phosphor pattern in the same manner as in the first embodiment.

Next, this resist is exposed, developed and fixed to form a resist pattern in the same manner as in the first embodiment. Of course, the mask used for exposure is a mask on which a phosphor pattern of the corresponding color is drawn.

Next, as in the first embodiment, unnecessary portions of the zero phosphor particles are removed using a sandblasting machine to form a phosphor pattern for one color. Thereafter, the abrasive material is removed from the sample using an air gun.

Next, the phosphor patterns of the remaining two colors are formed in accordance with the above-described procedure.

Then, use a firing furnace to reach a peak temperature of 460°C or 10°C.
Phosphor patterns for three colors are fired under firing conditions that are maintained for minutes.

During this baking process, the resist used as a mask, the buffer layer protection film, and the buffer layer exposed portions after the sunblasting process are burned off, and a front substrate having phosphors for three colors is obtained.

This front substrate and the rear substrate produced in the second embodiment are aligned and sealed in the same manner as before, the gap between these substrates is evacuated, and this gap is roughly filled with discharge gas, thereby producing a full-color display. Gas discharge panel is obtained (3rd
(See each process of steps 321 to S25 in the figure).

(Effects of the Invention) As is clear from the above description, according to the method for manufacturing a gas discharge panel of the present invention, parts (vanotube, cathode, anode, phosphor, etc.) are attached to the substrate of the gas discharge panel. 1-noon printing method, photolithography method, and sandblasting method are used, and the advantages of each method are skillfully combined and the disadvantages of each method are compensated for.

Therefore, the parts can be formed at a finer pitch and the parts themselves can be formed finer than before. Therefore, it becomes possible to manufacture higher-definition gas discharge panels in both monochrome and full color.

In addition, since thick film printing only requires printing a flat pattern, the screen mesh can be made coarser, thereby reducing the number of overprints and improving the durability and noteability of the screen.

Therefore, the panel manufacturing cost can be reduced.

In addition, since it is only necessary to print a flat pattern, a paste with a lower viscosity can be used than when printing a component pattern directly. Therefore, for example, the surface (upper surface) of the barrier wob becomes smooth, so that the upper surface of the barrier rib is less likely to break off when aligning the front and rear substrates.

[Brief explanation of the drawing]

Figures 1 (A) to (F) are process diagrams for explaining the first embodiment, Figures 2 (A) to (D) are process diagrams for explaining the second embodiment, and Figure 3. FIG. 4 is a process diagram showing a conventional method for manufacturing a color gas discharge panel. FIG. 4 is a diagram showing an example of the structure of a color gas discharge panel. 1... Substrate (glass substrate) 3... Flat pattern of cathode forming material 5... Resist 5a having sandblasting resistance... Resist pattern 3a... Cathode pattern, 33b... Cathode 1.・・・
Buffer layer 3... Buffer layer protective film 5... Sticky batter 5a of barrier rib forming material... Barrier rib. Special review applicant: Oki Electric Industry Co., Ltd. Process diagram for explaining the first embodiment Figure 1 Process diagram for explaining the first embodiment 35a Ni resist pattern 33b = cathode Process diagram for explaining the first embodiment Figure 1 Structure of color gas discharge panel Figure 4 shows an example.

Claims (3)

[Claims] (1) A method for manufacturing a gas discharge type display panel, characterized in that parts formed on a substrate of the gas discharge type display panel are manufactured by a process including the following steps (a) to (d). (a)・
...A step of depositing the component forming material on the substrate. (b)...A step of applying a resist having sandblasting resistance onto the deposited component forming material. (c)...A step of patterning the applied resist into a shape corresponding to a predetermined planar shape of the component. (d)... Using the resist pattern obtained by the patterning as a mask, a step of removing the portion of the component forming material exposed from the mask by sandblasting. (2) The method for manufacturing a gas discharge display panel according to claim 1, wherein the component is one or more components selected from barrier ribs, anodes, cathodes, and phosphors. A method of manufacturing a display panel. (3) The method for manufacturing a gas discharge type display panel according to claim 1, characterized in that the component forming material is a paste for the component, and the paste is applied to the substrate by a thick film printing method. A method for manufacturing a gas discharge type display panel.