JPH0459183U - - Google Patents
Info
- Publication number
- JPH0459183U JPH0459183U JP10051590U JP10051590U JPH0459183U JP H0459183 U JPH0459183 U JP H0459183U JP 10051590 U JP10051590 U JP 10051590U JP 10051590 U JP10051590 U JP 10051590U JP H0459183 U JPH0459183 U JP H0459183U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer wiring
- copper foil
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の一実施例の斜視図、第２図は
第１図の部分拡大斜視図、第３図は第２図のＡ−
Ａ断面図である。 １……多層配線基板、２……銅箔、１１，１２
，〜１ｎ……層基板。
第１図の部分拡大斜視図、第３図は第２図のＡ−
Ａ断面図である。 １……多層配線基板、２……銅箔、１１，１２
，〜１ｎ……層基板。
Claims (1)
- 複数の外形の切断されたプリント配線基板を積
層・接着した多層配線基板において、各層のプリ
ント配線基板の隣接する二辺のそれぞれに隣接点
から一定の距離に少なくとも側面を含んで披着さ
れた一定幅の銅箔を有することを特徴とする多層
配線基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10051590U JPH0459183U (ja) | 1990-09-26 | 1990-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10051590U JPH0459183U (ja) | 1990-09-26 | 1990-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459183U true JPH0459183U (ja) | 1992-05-21 |
Family
ID=31843237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10051590U Pending JPH0459183U (ja) | 1990-09-26 | 1990-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459183U (ja) |
-
1990
- 1990-09-26 JP JP10051590U patent/JPH0459183U/ja active Pending