JPH0459385B2 - - Google Patents

Info

Publication number
JPH0459385B2
JPH0459385B2 JP56192421A JP19242181A JPH0459385B2 JP H0459385 B2 JPH0459385 B2 JP H0459385B2 JP 56192421 A JP56192421 A JP 56192421A JP 19242181 A JP19242181 A JP 19242181A JP H0459385 B2 JPH0459385 B2 JP H0459385B2
Authority
JP
Japan
Prior art keywords
gas
copper
molten copper
volume
core wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56192421A
Other languages
Japanese (ja)
Other versions
JPS5893863A (en
Inventor
Masaki Ikeda
Masahiko Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SWCC Corp
Original Assignee
Showa Electric Wire and Cable Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Electric Wire and Cable Co filed Critical Showa Electric Wire and Cable Co
Priority to JP56192421A priority Critical patent/JPS5893863A/en
Publication of JPS5893863A publication Critical patent/JPS5893863A/en
Publication of JPH0459385B2 publication Critical patent/JPH0459385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Description

【発明の詳細な説明】 本発明は溶融銅浸漬被覆方法に係り、特に発熱
型ガス発生装置で生成されたガスを脱水して成
る、CO2を高濃度で含有するガスを雰囲気ガスと
して使用する溶融銅浸漬被覆方法(デイツプフオ
ーミングプロセス)に関する。 溶融銅を収容するルツボに芯線を通して溶融銅
被覆芯線を製造する溶融銅浸漬被覆方法は、高品
質の銅材が得られることが知られている。 溶融銅浸漬被覆方法においては、得られる銅材
の品質は、溶融銅中に溶解されるガスによつて大
きい影響を受け、したがつて雰囲気ガスの管理は
重要な問題となつている。 従来、溶融銅浸漬被覆方法における雰囲気ガス
としては、特公昭49−39740号公報に記載された
H21〜10容量%、CO+CO21〜10容量%(但し
CO2/CO=2/1〜1/20)、N2残部の組成を
有するガスが汎用されてきた。 上記組成中H2は溶銅中に浸透して還元作用を
なし、COは溶銅表面で還元作用をするところか
らH2の吸蔵による鋼材の品質低下を防ぐ目的で
H2の量を制限するために用いられ、CO2は、CO
によるSiC加熱素子の侵食を防ぐため用いられる
ものである。 上記組成を有するガスは、例えば都市ガス、プ
ロパンガス、ケロシン等の原料ガスを吸熱型ガス
発生装置で分解し脱水した強還元性のガス(RX
ガス)や、前記原料ガスを一定比率で空気と混合
して発熱型ガス発生装置で分解し、生成ガスを脱
水した後、さらにモレキユラーシーブによりCO2
を除去したガス(NXガス)が使用されていた。 しかるにかかる雰囲気ガスでは、前者にあつて
は原料ガスを外部から加熱して分解する吸熱型ガ
ス発生装置を用いるため熱分解コストが高いとい
う難点があり、一方、後者にあつては発熱型ガス
発生装置を用いるため熱分解コストは前者に比べ
はるかに低いものの、高価なモレキユラーシーブ
を用いて大容量の真空ポンプで吸引しながらCO2
を除去する精製工程が加わるため、これに要する
費用が高く、そのうえ精製操作も煩雑であるとい
う難点があつた。 本発明者らは、かかる従来の難点を解消すべく
鋭意研究を進めていたところ、意外なことに、原
料ガスを一定比率で空気と混合して発熱型ガス発
生装置で分解し、脱水しただけのCO2を多量に含
有するガス(DXガス)を用いてもRXガスやNX
ガスを用いた場合と比較して得られる銅材の特性
が低下しないことを発見した。 本発明は、かかる知見に基づいてなされたもの
で、ルツボに溶融銅を供給し、芯線を前記ルツボ
に収容した溶融銅に通して銅を付着させて銅被覆
芯線を製造するにあたり、前記溶融銅および銅被
覆芯線の表面を、発熱型ガス発生装置で生成され
たガスを脱水して成るCO28〜19容量%、CO6〜
8容量%、H22〜4容量%、N2残部の組成を有
する雰囲気ガスで覆うことを特徴とする溶融銅浸
漬被覆方を提供しようとするものである。 本発明に使用するDXガスは、都市ガス、プロ
パンガス、ケロシン等の原料ガスを一定比率で空
気と混合して発熱型ガス発生装置で不完全燃焼さ
せ、これを常法により脱水するだけで得ることが
き、弱還元性を有している。 上記DXガス中のH2が2容量%未満では溶融銅
の還元が十分に行われず、逆に4容量%を越える
と溶融銅中にH2が吸蔵されてボイド発生等の得
られる銅材の特性に好ましいからない影響を与え
るようになる。 なお、CO2およびCOはDXガス中に副成する成
分ガスであつて、前者はCOによるSiC加熱素子
の侵食を抑制し、後者は溶融銅の還元に寄与す
る。 上記DXガスは、溶融銅の雰囲気ガスの他キヤ
ステイングクルーシブル、ロールミルあるいは予
熱炉等の雰囲気ガスとしても用いられる。 本発明に用いるDXガスの製造工程において
は、熱分解コストの低い発熱型ガス発生装置を用
い、かつモレキユラーシーブや大容量の真空ポン
プを使用する精製工程を必要としないから、従来
のRXガスやNXガスと比較して製造コストが安
く、かつ精製操作も容易であつて、銅材製造のコ
ストダウンを図ることができる。 次に実施例について記載する。 実施例 プロパンガスをガス燃焼炉に送り、不完全燃焼
させる程度の量の空気と混合して不完全燃焼さ
せ、次いで、この燃焼ガスを50〜60℃にまで冷却
して生じた水をサイクロンで除去し、さらに、小
型熱交換器に送つて5〜10℃にまで冷却して生じ
た燃焼ガス中の水分を分離除去して、第1表に示
す組成のDXガスを得た。 このDXガスをカバーガスとして、公知の溶融
銅浸漬被覆方法により、9.6mmφの種線に溶融銅
を2.7倍(断面積比)の付着率で付着させて銅被
覆線を製造した。 比較のために、上記DXガスをさらにモレキユ
ラーシーブを収容した脱CO2装置に送り、大容量
の真空ポンプで真空引きしながらDXガス中の
CO2を除去して、第1表の比較例1および2に示
す組成のNXガスを得、これらのNXガスをカバ
ーガスとして、上記実施例と同一材料、同一条件
で種線に溶融銅を付着させて銅被覆線を製造し
た。 得られた銅被覆線の特性を調べたところ、第1
表下欄に示す通りで、特性に差はなかつた。 【表】
[Detailed Description of the Invention] The present invention relates to a molten copper immersion coating method, and in particular uses a gas containing a high concentration of CO 2 as an atmospheric gas, which is obtained by dehydrating gas generated by an exothermic gas generator. This invention relates to a molten copper dip coating method (dip forming process). It is known that a molten copper dip coating method, in which a core wire is passed through a crucible containing molten copper to produce a molten copper-coated core wire, can yield a high-quality copper material. In the molten copper dip coating method, the quality of the copper material obtained is greatly affected by the gas dissolved in the molten copper, and therefore the control of atmospheric gas has become an important issue. Conventionally, the atmospheric gas in the molten copper dip coating method was as described in Japanese Patent Publication No. 49-39740.
H 2 1-10% by volume, CO + CO 2 1-10% by volume (however
A gas having a composition of CO2 /CO=2/1 to 1/20) with the remainder being N2 has been widely used. In the above composition, H 2 penetrates into the molten copper and acts as a reducing agent, and CO acts as a reducing agent on the surface of the molten copper.
Used to limit the amount of H 2 and CO 2
This is used to prevent corrosion of the SiC heating element by. The gas having the above composition is a strongly reducing gas (RX
After mixing the raw material gas with air at a fixed ratio and decomposing it with a heat-generating gas generator, dehydrating the generated gas, and then converting it to CO 2 using a molecular sieve.
A gas (NX gas) from which the However, with regard to such atmospheric gases, the former method uses an endothermic gas generator that heats and decomposes the raw material gas from the outside, so the cost of thermal decomposition is high, while the latter method uses an exothermic gas generator. Although the cost of pyrolysis is much lower than the former method due to the use of equipment, it is possible to emit CO 2 while suctioning it with a large-capacity vacuum pump using an expensive molecular sieve.
Since a purification step is added to remove , the cost required for this is high, and furthermore, the purification operation is complicated. The inventors of the present invention were conducting intensive research to resolve these conventional difficulties, and surprisingly, they found that they could simply mix the raw material gas with air at a certain ratio, decompose it using a heat-generating gas generator, and dehydrate it. Even if gas containing a large amount of CO 2 (DX gas) is used, RX gas or NX
It was discovered that the properties of the copper material obtained did not deteriorate compared to when using gas. The present invention has been made based on this knowledge, and when producing a copper-coated core wire by supplying molten copper to a crucible and passing the core wire through the molten copper accommodated in the crucible to adhere copper, the molten copper The surface of the copper-coated core wire is coated with 8 to 19% by volume of CO2, 8 to 19% by volume of CO2 , and CO6 to
It is an object of the present invention to provide a method of immersion coating molten copper, which is characterized in that it is covered with an atmospheric gas having a composition of 8% by volume, 2 to 4% by volume of H2 , and the balance of N2. The DX gas used in the present invention can be obtained simply by mixing raw material gases such as city gas, propane gas, kerosene, etc. with air at a certain ratio, causing incomplete combustion in a heat-generating gas generator, and then dehydrating the mixture using a conventional method. It has weak reducing properties. If the H 2 content in the DX gas is less than 2% by volume, the molten copper will not be reduced sufficiently, and if it exceeds 4% by volume, H 2 will be occluded in the molten copper, resulting in voids etc. It begins to have a favorable to unfavorable influence on the characteristics. Note that CO 2 and CO are component gases formed as by-products in the DX gas, and the former suppresses corrosion of the SiC heating element by CO, and the latter contributes to the reduction of molten copper. The above-mentioned DX gas is used not only as an atmospheric gas for molten copper but also as an atmospheric gas for casting crucibles, roll mills, preheating furnaces, etc. In the production process of the DX gas used in the present invention, an exothermic gas generator with low pyrolysis cost is used, and there is no need for a purification process using a molecular sieve or a large-capacity vacuum pump. Compared to gas and NX gas, the production cost is lower and the refining operation is easier, making it possible to reduce the cost of producing copper materials. Next, examples will be described. Example Propane gas is sent to a gas combustion furnace, mixed with enough air to cause incomplete combustion, and then the combustion gas is cooled to 50 to 60 degrees Celsius, and the resulting water is collected in a cyclone. The resulting combustion gas was then sent to a small heat exchanger and cooled to 5 to 10° C., and moisture in the resulting combustion gas was separated and removed to obtain DX gas having the composition shown in Table 1. Using this DX gas as a cover gas, molten copper was deposited on a 9.6 mmφ seed wire at a deposition rate of 2.7 times (cross-sectional area ratio) by a known molten copper dip coating method to produce a copper-coated wire. For comparison, the above DX gas was further sent to a CO 2 removal device containing a molecular sieve, and the DX gas was evacuated using a large-capacity vacuum pump.
CO 2 was removed to obtain NX gases with the compositions shown in Comparative Examples 1 and 2 in Table 1, and using these NX gases as cover gas, molten copper was added to the seed wire using the same materials and under the same conditions as in the above example. A copper coated wire was manufactured by depositing the copper coated wire. When we investigated the characteristics of the copper-coated wire obtained, we found that the first
As shown in the bottom column of the table, there was no difference in characteristics. 【table】

Claims (1)

【特許請求の範囲】[Claims] 1 ルツボに溶融銅を供給し、芯線を前記ルツボ
に収容した溶融銅に通して銅を付着させて銅被覆
芯線を製造するにあたり、前記溶融銅および銅被
覆芯線の表面を、発熱型ガス発生装置で生成され
たガスを脱水して成るCO28〜19容量%、CO6〜
8容量%、H22〜4容量%、N2残部の組成を有
する雰囲気ガスで覆うことを特徴とする溶融銅浸
漬被覆方法。
1. When manufacturing a copper-coated core wire by supplying molten copper to a crucible and passing a core wire through the molten copper stored in the crucible to deposit copper, the surface of the molten copper and copper-coated core wire is heated using a heat-generating gas generator. CO2 8~19% by volume, CO6~
A molten copper dip coating method characterized by covering with an atmospheric gas having a composition of 8% by volume, 2 to 4% by volume of H2 , and the balance N2 .
JP56192421A 1981-11-30 1981-11-30 Coating method with molten copper by dipping Granted JPS5893863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56192421A JPS5893863A (en) 1981-11-30 1981-11-30 Coating method with molten copper by dipping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56192421A JPS5893863A (en) 1981-11-30 1981-11-30 Coating method with molten copper by dipping

Publications (2)

Publication Number Publication Date
JPS5893863A JPS5893863A (en) 1983-06-03
JPH0459385B2 true JPH0459385B2 (en) 1992-09-22

Family

ID=16291032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56192421A Granted JPS5893863A (en) 1981-11-30 1981-11-30 Coating method with molten copper by dipping

Country Status (1)

Country Link
JP (1) JPS5893863A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103230774B (en) * 2013-03-22 2014-09-24 南京工业大学 Preparation method of copper-containing mesoporous adsorbent, prepared adsorbent and application thereof

Also Published As

Publication number Publication date
JPS5893863A (en) 1983-06-03

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