JPH0459626U - - Google Patents
Info
- Publication number
- JPH0459626U JPH0459626U JP10325390U JP10325390U JPH0459626U JP H0459626 U JPH0459626 U JP H0459626U JP 10325390 U JP10325390 U JP 10325390U JP 10325390 U JP10325390 U JP 10325390U JP H0459626 U JPH0459626 U JP H0459626U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- airtight container
- electrode part
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図ａ，ｂおよび第３図は本考案による実施
例を説明するためのもので、第１図ａは実施例１
の気密容器を示す断面図、第１図ｂは側面図、第
２図は実施例１の気密容器をプリント基板上に半
田付けした時の断面図であり、第３図は実施例２
の気密容器を示す断面図である。第４図は一般的
な圧電素子用気密容器の断面図であり、第５図は
第４図の気密容器を用いて、絶縁板６を付加し、
リード曲げ加工を施し表面実装型部品へ加工した
気密容器の断面図であり、第６図はセラミツクケ
ース７を用いた表面実装型部品の斜視図であり、
第７図は第５図の表面実装型部品をプリント基板
上に半田付した時の断面図であり、第８図は第６
図の表面実装型部品をプリント基板上に半田付け
した時の斜視図である。
１２……半田、１３……プリント基板、１３ａ
……導電パターン、２１……金属外環、２２……
フランジ、２３……リード平板部、２４……ガラ
ス、２５……気密封止用板、２６……リード。
Figures 1a, b and 3 are for explaining embodiments of the present invention, and Figure 1a is embodiment 1.
1b is a side view, FIG. 2 is a sectional view of the airtight container of Example 1 soldered onto a printed circuit board, and FIG. 3 is a side view of the airtight container of Example 2.
FIG. 2 is a sectional view showing an airtight container. FIG. 4 is a cross-sectional view of a general airtight container for piezoelectric elements, and FIG. 5 is a cross-sectional view of a general airtight container for piezoelectric elements, and FIG.
FIG. 6 is a cross-sectional view of an airtight container processed into a surface mount type component by bending the leads, and FIG. 6 is a perspective view of a surface mount type component using a ceramic case 7.
Figure 7 is a cross-sectional view of the surface mount type component shown in Figure 5 soldered onto a printed circuit board, and Figure 8 is a cross-sectional view of the surface mount type component shown in Figure 5 soldered onto a printed circuit board.
FIG. 3 is a perspective view of the surface-mounted component shown in the figure soldered onto a printed circuit board. 12...Solder, 13...Printed circuit board, 13a
...Conductive pattern, 21...Metal outer ring, 22...
Flange, 23...Lead flat plate portion, 24...Glass, 25...Airtight sealing plate, 26...Lead.
Claims (1)
可能とするフランジ部を持つ金属外環と、この金
属外環にガラスを介して付着された電極部とを有
し、表面実装にてプリント基板に対して横に載置
した際に前記電極部がプリント基板に対して垂直
又はそれより大きな角度で接するように、ガラス
および電極部を成形したことを特徴とする圧電素
子用気密容器。 An airtight container for a piezoelectric element has a metal outer ring with a flange part that enables electrical resistance welding, and an electrode part attached to the metal outer ring through glass, and can be mounted on a printed circuit board by surface mounting. 1. An airtight container for a piezoelectric element, characterized in that the glass and the electrode part are formed so that the electrode part contacts a printed circuit board perpendicularly or at a larger angle when placed horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10325390U JPH0459626U (en) | 1990-09-28 | 1990-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10325390U JPH0459626U (en) | 1990-09-28 | 1990-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459626U true JPH0459626U (en) | 1992-05-21 |
Family
ID=31848058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10325390U Pending JPH0459626U (en) | 1990-09-28 | 1990-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459626U (en) |
-
1990
- 1990-09-28 JP JP10325390U patent/JPH0459626U/ja active Pending