JPH0460366U - - Google Patents
Info
- Publication number
- JPH0460366U JPH0460366U JP10130690U JP10130690U JPH0460366U JP H0460366 U JPH0460366 U JP H0460366U JP 10130690 U JP10130690 U JP 10130690U JP 10130690 U JP10130690 U JP 10130690U JP H0460366 U JPH0460366 U JP H0460366U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- float
- liquid level
- thermocouple
- detection mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims 4
- 238000001514 detection method Methods 0.000 claims 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
Description
第１図は本考案の実施例を示す側断面図、第２
図は本考案の他の実施例を示す要部側断面図、第
３図は従来の半田付装置の一例を示す側断面図で
ある。
９……半田槽、１０……溶融半田、１１……フ
ロート、１３，１６……熱電対、１４……フロー
ト、１４ａ……支点溝、１５……支点柱。
Fig. 1 is a side sectional view showing an embodiment of the present invention;
The figure is a side sectional view of a main part showing another embodiment of the present invention, and FIG. 3 is a side sectional view showing an example of a conventional soldering device. 9... Solder tank, 10... Molten solder, 11... Float, 13, 16... Thermocouple, 14... Float, 14a... Fulcrum groove, 15... Fulcrum column.
Claims (1)
を浮かべそのフロート上に熱電対を配置したこと
を特徴とする半田液位検知機構。 (2) 回転軸を中心として回転し、一端部分が溶
融半田の液位によつて上下動するフロートと、フ
ロートの一端部上方に配置された熱電対とを有す
ることを特徴とする実用新案登録請求の範囲第１
項記載の半田液位検知機構。 (3) 熱電対が検知する温度変化により溶融半田
の液位を検知することを特徴とする実用新案登録
請求の範囲第１項記載の半田液位検知機構。[Scope of Claim for Utility Model Registration] (1) A solder liquid level detection mechanism characterized by having a float floating above molten solder stored in a solder tank and a thermocouple disposed on the float. (2) Registration of a utility model characterized by having a float that rotates around a rotating shaft and has one end that moves up and down depending on the liquid level of molten solder, and a thermocouple that is placed above one end of the float. Claim 1
Solder liquid level detection mechanism described in Section 2. (3) The solder level detection mechanism according to claim 1, which is characterized in that the liquid level of molten solder is detected by a temperature change detected by a thermocouple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10130690U JPH0460366U (en) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10130690U JPH0460366U (en) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0460366U true JPH0460366U (en) | 1992-05-25 |
Family
ID=31844648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10130690U Pending JPH0460366U (en) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0460366U (en) |
-
1990
- 1990-09-27 JP JP10130690U patent/JPH0460366U/ja active Pending
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