JPH046056Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an LED display unit that constitutes an LED display that displays information using letters, numbers, etc. either singly or in a plurality of units arranged side by side.

<Conventional technology> This type of conventional LED display unit is as follows:
A configuration as shown in FIG. 8 or 9 is generally used. That is, in the case shown in FIG. 8, a predetermined number of row wiring patterns and column wiring patterns are formed on a rectangular substrate 1 made of ceramic or glass epoxy resin, and a large number of wiring patterns are formed at each intersection of these two wiring patterns. LED
A mounting part is formed, and two LED chips are attached to each mounting part.
are attached and arranged in a dot matrix, lead terminal pins 3 are connected to each LED drive terminal of both wiring patterns of the board 1, and a transparent window 4 is provided on the top surface to transmit the light emitted from each LED 2. A plastic case 5 equipped with a LED chip 2 is fixed to a substrate 1 and each LED chip 2 is encapsulated therein.

On the other hand, the LED display unit shown in FIG. 9 differs from the one shown in FIG. 8 only in that the plastic case 6 is provided with partition walls 7 for each LED chip 2, and the space between each partition wall 7 is filled with transparent epoxy resin 8. differ.

<Problems to be Solved by the Invention> Incidentally, this type of LED display unit generates a considerable amount of heat when it is turned on because a large number of LED chips 2 are arranged at a relatively high density. However, in any of the above-mentioned LED display units, since a ceramic substrate or a glass epoxy substrate with poor heat dissipation properties is used as the substrate 1 for mounting the LED, the light emitting characteristics of the LED chip 2 are inferior. In addition, since heat dissipation is poor, the mounting density of the LED chips 2 cannot be increased, resulting in poor display quality. In order to solve this problem, there are some devices in which a heat sink is attached to the back side of the substrate, but this not only complicates the structure and increases costs, but also imposes restrictions on assembly.

Further, the lead terminal pins 3 are attached by brazing when the substrate 1 is made of ceramic, and by soldering when the substrate 1 is made of glass epoxy. Therefore, each lead terminal pin 3
There is a limit to how small the interval between
Arranged at 2.54mm pitch or 2.0mm pitch. Due to the inability to reduce the distance between the lead terminal pins 3 and the use of the plastic cases 5 and 6 as exterior bodies, there are disadvantages in that miniaturization is not possible.

Furthermore, in the one in Figure 8, a certain LED chip 2
Light emitted from the transparent window 4 leaks from the adjacent transparent window 4, causing so-called light blurring, which significantly deteriorates display quality. In order to prevent this, in Figure 9 each
A plastic case 6 with partition walls 7 for the LEDs 2 is used, and transparent epoxy resin 8 is filled between the partition walls 7, but the configuration becomes complicated and the presence of the partition walls 7 between each LED 2 causes There is a problem that hinders high density.

The present invention was developed in view of these conventional problems. It improves heat dissipation, reduces the spacing between lead terminal pins, allows LEDs to be arranged in high density, and eliminates the need for an exterior case or partition wall. Light leakage while achieving miniaturization. The object of the present invention is to provide an LED display unit that can reliably prevent such problems and provide high-quality display.

<Means for Solving the Problems> In order to achieve the above object, the LED display unit of the present invention has row wiring patterns and column wiring patterns on both sides of a metal core substrate, which is formed by coating both sides of a metal plate with an insulating layer. A plurality of directional wiring patterns are each formed, and an LED chip is attached to each of the intersection points of both wiring patterns in an electrically connected state, and a hole-shaped terminal led out from each of the wiring patterns is attached. , the lead terminal pins are inserted and implanted in an electrically connected state, at least the mounting surface side of each LED chip on the metal core board is molded with a transparent resin to cover each LED chip, and each LED chip on the surface of the molded resin is molded with a transparent resin.
The present invention is characterized by a structure in which the portions excluding the display window portions facing the LED chips are formed of a pear-skinned material, and the pear-skinned portions on the surface of the molded resin are covered with a mask.

<Function> Since the LED chips are mounted on a metal core board with excellent heat dissipation properties, the LED chips can be mounted in a high-density arrangement, and the light emitting characteristics of each LED chip also have good heat dissipation properties of the metal core board. Improved by In addition, since each lead terminal pin is inserted into the hole-shaped terminal of the metal core board and implanted,
The spacing between each pin can be made as small as possible, and since each LED chip is covered with a transparent resin mold, there is no need for an external case, resulting in a much smaller size.

Moreover, each LED on the surface of the mold resin
Since the parts other than the display windows facing each other are made of pear-skinned material, the light emitted from a certain LED chip and incident on the resin surface at an angle greater than the critical angle will not look like a normal mirror surface. The light is scattered by the pear cloth without being totally reflected, and the leakage of light from the adjacent display window is greatly reduced. Therefore, the display quality can be significantly improved without using any special members such as partition walls, and the arrangement of LED chips can be made more dense.

<Embodiments> Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings.

1 to 5 show an embodiment of the present invention,
Figure 1 is a longitudinal sectional view, Figure 2 is a perspective view with the top mask removed, Figure 3 is a plan view with the mask and the transparent resin underneath removed, and Figure 4 is a partial view. FIG. 5 is a partially enlarged view of FIG. 1. A rectangular metal core substrate 10 is used as the base of this display unit, and as shown in FIG.
Conductive layers made of 0B and copper foil are laminated, and as shown in FIG. 3, the upper conductive layer is etched to form row wiring patterns 10C, and the lower conductive layer is etched to form column wiring patterns. pattern 10c
are formed in a predetermined number. The − electrode side of each LED chip 2 is die-bonded on the row direction wiring pattern 10C at each intersection point of both wiring patterns 10C, 10C.
The LED chips 2 are arranged in a dot matrix as shown in Figure 2, and each LED
The + side of the chip 2 is connected to a land having a through hole 10D by wire bonding 11, and is electrically connected to each corresponding column wiring pattern 10C.

Further, as shown in FIG. 3, each row direction wiring pattern 10C is connected to the metal core substrate 10 through an individually provided lead-out through hole 10E and a lead-out pattern arranged between each column direction wiring pattern 10C.
Consists of through holes arranged along one side of 0
The lead terminal pins 12 are respectively led out to the LED driving terminals, and as shown in FIG. 4, lead terminal pins 12 are inserted into the LED driving terminals and are implanted in an electrically connected state. On the other hand, one end of each column direction wiring pattern 10C is for each LED drive, which is formed by a through hole arranged along the side of the metal core substrate 10 facing each LED drive terminal for the above-mentioned row direction wiring pattern. A lead terminal pin 12 is inserted into each of the LED drive terminals and is electrically connected to the LED drive terminals.

Both sides of the metal core substrate 10 are molded with transparent epoxy resin 13.
The LED chip 2 is covered, and the lead terminal pins 12 are further firmly fixed to the metal core substrate 10. Then, on the mounting side surface of each LED chip 2 of the molded transparent epoxy resin 13, as shown in FIG.
The part excluding the display window facing the is made of pear cloth 13A.
Only the other parts, that is, the display window part, have a mirror finish. Each of this resin 13
A mask 14 is bonded to the mounting side surface of the LED chip 2, in which through holes 14A through which light from each LED 2 passes are arranged in a dot matrix pattern corresponding to each display window portion.

Next, the operation of the above embodiment will be explained. each
The metal core substrate 10 on which the LED chip 2 is mounted is
It has much better heat dissipation than the ceramic substrates and glass epoxy substrates used in conventional display units of this type, so even though each LED chip 2 is mounted in high density, each LED chip 2 can be individually mounted. It is possible to improve the light emitting characteristics of.

In addition, since each lead terminal pin 12 is implanted by fitting into the hole-shaped terminal of the metal core board 10, the required spacing is not required, unlike when using conventional means such as soldering or brazing. , the interval between each lead terminal pin 12 can be made as small as possible. Incidentally, actual measurement results show that the conventional means for attaching lead terminal pins requires a pitch of at least 2.0 mm, but according to the means for inserting the lead terminal pins into the metal core board 10 of the present invention, the lead terminal pins 12 can be attached at a pitch of 1.27 mm. can be placed.

Furthermore, since the surface of the molded transparent epoxy resin 13 excluding the surface window portion facing each LED chip 2 is made of pear cloth 13A, each LED
The light emission display by the chip 2 can be performed more clearly. If all surfaces are made mirror-like, a certain LED
Light emitted from the chip 2 and incident on the surface of the resin 13 at an angle greater than the critical angle is totally reflected and leaks from the adjacent through hole 14A. In order to prevent this, a satin fabric 13A is formed, and light incident at an angle equal to or greater than the critical angle is scattered by the satin fabric 13A, making it possible to significantly reduce leakage from the adjacent through holes 14A.

Furthermore, since a robust metal core substrate 10 is used as the substrate, a transparent epoxy resin 13 is molded onto this, and the surface on which the LED chip 2 is mounted is used as the display surface. This eliminates the need for such a plastic case, allows the aforementioned LED chips 2 to be mounted at high density, and allows the spacing between the lead terminal pins 12 to be reduced, allowing the shape and dimensions to be significantly reduced. Moreover, since there is no need for a plastic case, when a predetermined number of LED display units are arranged horizontally in parallel to form an LED display, there is no need for a plastic case between adjacent display units.
Adjust the spacing between LED chips 2 to that of each display unit itself.
The pitch can be made almost the same as that of the LED chips 2, and there is a great effect that it is possible to obtain an integrated LED display in which the display is not separated for each display unit.

6 and 7 respectively show other embodiments of the present invention. In FIG. 6, a portion of the surface of the molded transparent resin 15 facing the LED chip 2 is protruded to form a display portion 15A, and other portions are The projecting display portion 15A is formed at a height approximately equal to the thickness of the mask 14,
With this protruding display portion 15A and pear cloth 15B,
This prevents the light from the LED chip 2 from interfering with the adjacent through hole 14A and leaking, and also has the effect of providing clearer display.

On the other hand, in the display unit shown in FIG. 7, the portion of the surface of the molded transparent epoxy resin 16 that faces each LED chip 2 protrudes in the shape of a convex lens to form a display portion 16A, and the surface other than the display portion 16A is covered with a pear-shaped surface 16B. The structure is as follows, and the 6th
The same effect as the embodiment shown in the figure can be obtained.

It should be noted that the present invention is not limited only to the above-mentioned embodiments, and it goes without saying that various embodiments are possible without departing from the scope of the claims. For example,
In the embodiment described above, the dot matrix-shaped through holes 14
Although the case where the mask 14 having A is bonded has been described, the mask can also be formed by printing means.

<Effects of the Invention> As detailed above, according to the LED display unit of the present invention, LED chips are arranged in a dot matrix on a metal core substrate, and lead terminal pins are implanted in the metal core substrate by insertion means. , each metal core board is molded with transparent resin.
Since the LED chip is covered with a metal core board that has excellent heat dissipation,
LED chips can be mounted in high density, and each
It can improve the light emitting characteristics of LED chips,
Moreover, reliability can be improved.

Further, since the lead terminal pins are implanted into the metal substrate by the insertion means, the interval between the lead terminal pins can be reduced to about half that of the conventional method. Furthermore,
A sturdy metal core substrate is used as the base, and a transparent resin is molded onto this to cover each LED chip, so there is no need for an exterior body such as a plastic case, and the aforementioned LED chips can be mounted at high density. In addition to being able to reduce the distance between the lead terminal pins, there is an advantage that the size can be significantly reduced.

Moreover, each LED on the surface of the mold resin
Since the parts other than the surface windows facing each chip are formed with a pear-shaped material, the light emitted from each LED chip and incident on the resin surface at an angle greater than the critical angle is scattered by the pear-like material, Light leakage from the display window is significantly reduced. Therefore,
Display quality can be greatly improved without using any special parts such as partition walls, and LED
The chip arrangement can be made more dense.

[Brief explanation of the drawing]

Fig. 1 is a longitudinal sectional view of one embodiment of the present invention, Fig. 2 is a perspective view of the same with the above mask removed, Fig. 3 is a plan view of the same with the above mask and transparent resin removed, and Fig. 4 The figure is a longitudinal sectional view of a part of the same as above, FIG. 5 is an enlarged view of a part of FIG. 1, and FIGS. 6 and 7 are longitudinal sectional views of a part of other embodiments of the present invention. 8 and 9 are both longitudinal sectional views of a conventional LED display unit. 2...LED chip, 10...Metal core board,
10A...Metal plate, 10B...Insulating layer, 10C...
... Row direction and column direction wiring pattern, 12 ... Lead terminal pin, 13, 15, 16 ... Transparent resin,
13A, 15B, 16B...Nashijiji, 14...Mask.

Claims (1)

[Scope of utility model registration request] A plurality of row-direction wiring patterns and a plurality of column-direction wiring patterns are formed on both sides of a metal core board made of a metal plate whose both sides are covered with insulating layers, and an LED chip is installed at each intersection of both wiring patterns. A lead terminal pin is attached to the wiring pattern in an electrically connected state, and a lead terminal pin is inserted and implanted in an electrically connected state into a hole-shaped terminal led out from each wiring pattern, and at least each LED chip on the metal core board is The mounting surface side is molded with a transparent resin to cover each LED chip, and the surface of this molded resin except for the display window portions facing each LED chip is formed on a pear-like material. An LED display unit characterized by a pear-skinned part covered with a mask.