JPH046103B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a fixture for soldering to leads of integrated circuit components.

(Prior art) Conventionally, as shown in Japanese Patent Publication No. 58-57269, a large number of integrated circuit components (hereinafter referred to as IC in this conventional example)
A soldering fixture is known that aligns and supports a large number of ICs when soldering their leads.

This known fixture has a lower support wire member and an upper support wire member provided in the same frame, and a large number of ICs are successively slid between the support wire members through an insertion opening drilled in the frame. The fixture is inserted into the soldering line, and the gate body provided in the insertion opening is closed to attach the fixture to a conveyance holder of the soldering line.

This known fixture is suitable for an IC in which leads are provided on two sides of an IC package, such as a dual inline package type IC.
The leads on both sides of the wire slide on the lower support wire member so as to straddle the lower support wire member.

However, in recent years, ICs of the type in which leads are provided on four sides of the IC package, such as flat package type ICs, which have become widely used as surface-mounted ICs for printed wiring boards, etc. It cannot be attached to the fixture. This is because the leads located in the front-rear direction during the insertion interfere with the lower support wire member.

Therefore, as a fixture for soldering the leads of this type of four-sided lead type IC,
As described in the specification and drawings of Japanese Patent Application No. 60-289019 (pending),
The corner is received by the fitting groove of the lower support member, and
A soldering fixture has been developed that locks the top surface of an IC package with an upper locking member.

(Problems to be Solved by the Invention) The fixture in this application is effective when there are sufficient spaces at the four corners of the IC package to fit into the fitting grooves, but the If the four corners of the IC package are arranged so that they are completely filled, the four corners of the IC package cannot be fitted into the fitting grooves, so this type of IC does not need to be soldered in advance.
I had no choice but to use it as is.

SUMMARY OF THE INVENTION An object of the present invention is to provide a fixture that can effectively hold surface-mounted integrated circuit components that cannot be fitted and supported at the four corners of a package during soldering of their leads.

[Structure of the invention]

(Means for Solving the Problems) The present invention is a soldering fixture that holds a package P of an integrated circuit component W when soldering is performed on the surface of the lead L of the integrated circuit component W, and A receiving member 12 is installed inside the frame 11, and a convex portion 1 on the upper side of the receiving member 12 projects higher than the projecting length of the lead L projecting from the lower surface of the package P and supports the lower surface of the package P.
3 is integrally molded, and a presser member 14 is removably fitted inside the outer frame 11 from above, and a presser member 14 is fitted on all four sides of the package P placed on the convex portion 13. A recessed portion 17 is formed to be fitted from above.

(Function) In the present invention, the package P of the integrated circuit component W is held between the convex portion 13 of the receiving member 12 and the concave portion 17 of the presser member 14, and the leads L of the component W are placed on the lower side of the presser member 14. It is located around the convex portion 13, and is dipped in jet solder or the like of a soldering line to be soldered.

(Embodiment) Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 7, and other embodiments will be described with reference to FIGS. 8 and 9.

As shown in FIGS. 1 to 3, the outer frame 11
A receiving member 12 is installed inside the receiving member 12, and four pieces supporting the integrated circuit component W are mounted on the upper side of the receiving member 12.
A large number of sets of convex portions 13 are integrally molded. Further, a presser member 14 is removably fitted inside the outer frame 11 from above. This pressing member 14 is
A lattice-shaped portion 16 as shown in FIG. 2 is provided inside the inner frame 15, and this presser member 1
A recess 17 is provided on the lower surface of the lattice-like portion 16 of No. 4 to fit into the upper part of the integrated circuit component W placed on the convex portion 13.
is formed.

Further, as shown in FIGS. 1 to 3, a pair of positioning portions 21 for positioning the inner frame 15 of the presser member 14 inside the outer frame 11, and a pair of positioning portions 21 for preventing downward deflection of the receiving member 12 are provided. Two beams 2
2 and a locking portion 23 that locks the presser member 14 are provided, respectively. Furthermore, the outer frame 11
Attachment portions 24 for the transport holder 51 (FIG. 7) are bent and formed on the left and right sides of the transport holder 51 (FIG. 7), and a grip portion 25 is provided on the upper portion of the attachment portions 24.

Further, as shown in FIG. 2, the pressing member 1
The inner frame 15 of No. 4 is provided with a positioning recess 31 that fits into the pair of positioning parts 21, and a handle 33 of the presser member 14 is further provided with a support part 32 installed between the inner frames 15. There is.

As shown in FIG. 3, the bottom of the receiving member 12 is cut out at predetermined intervals, and cutouts 34 and connecting parts 35 are formed alternately. Further, fixing protrusions 36 are integrally provided at both left and right ends of the receiving member 12, and the protrusion 36 on the left end is fitted into the lower mounting hole of the outer frame 11, and the protrusion 36 on the right end is fitted into the lower mounting hole of the outer frame 11. It is fitted into a mounting hole of a mounting plate 37 fixed to 11.

As shown in FIG. 4, the lattice-shaped portion 16 is configured such that two vertical plates 16a and one horizontal plate 16b are fitted into each integrated circuit component W. The recesses 17a and 17b formed on the lower surfaces of the parts W are
Fits from the top on all sides.

As shown in FIG. 5, the vertical plate 16a and the horizontal plate 16b have grooves 41 formed therein,
42 are fitted together.

As shown in FIG. 6, the convex portion 13 of the receiving member 12 protrudes higher than the protruding length of the lead L protruding from the lower surface of the package P and supports the lower surface of the package P. The lower end of the lead L located in the front-rear direction is the receiving member 12
Never come into contact with.

Then, with the holding member 14 removed to the outside of the outer frame 11, a large number of integrated circuit components W are removed from each set by a large number of vacuum suction nozzles that suck and hold the package P. The package P is transferred onto the protrusions 13, and the lower surface of the package P is supported by each set of four protrusions 13. Next, the presser member 1
4 is fitted into the positioning part 21, fitted into the outer frame 11 with the guidance of this positioning part 21, and placed on the locking part 23, the receiving member 12 is fitted as shown in FIG. The convex portion 13 and the lattice-like portion 16
A package P of an integrated circuit component W is held between the concave portion 17 and the leads L of the component W are located below the grid portion 16 and around the convex portion 13 .

Once a large number of integrated circuit components W have been set in this fixture F in this way, this fixture F is fitted into the inside of the transport holder 51 of an automatic soldering machine as shown in FIG. The engaging portion 24 of the frame 11 is attached to the middle frame 52 of this holder 51.
Attach to. This conveyance holder 51 is movably supported on a pair of rails 54 via rolling wheels 53, and is provided protruding from a transfer drive chain 57 into an engagement hole 56 of a transfer force transmission plate 55 that is integrated with the holder 51. When the pin 58 is fitted and the chain 57 is transferred, the transfer force is applied to the pin 58 and the transmission plate 5.
5 to the holder 51, and the fixture F is conveyed along with the holder 51 along an automatic soldering line (consisting of a foam fluxer, preheater, jet soldering tank, cleaning tank, drying room, etc.) (not shown).

Then, the flux is applied to the leads L of the integrated circuit component W by the fluxer of the automatic soldering line, the leads L are preheated by the preheater, and the flux is applied from the nozzle of the jet soldering bath. The entire lead L is immersed in molten solder, the entire surface of the lead L is soldered, and the integrated circuit component W is further removed in a cleaning bath.
The remaining flux adhering to the fixtures F, etc. is washed off, and finally they are dried in a drying room.

In addition, since the holding member 14 is formed in a grid shape, the cleaning liquid in the cleaning tank can be drained easily, so that the cleaning liquid attached to the integrated circuit parts W etc. can be easily dried, and the processing is easy. It has many advantages such as being light and easy to handle. Since the notch 34 of the receiving member 12 is formed large, there is an advantage that water can be drained easily and drying is easy.

Next, FIGS. 8 and 9 show the presser member 14.
The presser member 61 is shown as a modification example, and has a long protrusion 63 and a square protrusion 6 on the lower surface of the presser plate main body 62.
4 is formed, and a recess 65 that fits into the upper part of the package P of the integrated circuit component W is formed in a portion surrounded by the projection 63 and the projection 64. A square hole 66 is formed above the recess 65, and a +-shaped hole 67 is formed between each square hole 66. These holes 66, 67 are for draining and drying the cleaning liquid. 68 is a positioning recess that fits into the positioning part 21 of the outer frame 11, and 69 is a handle.

In FIG. 9, the receiving member 12 is the same as that in the previous embodiment, so the same reference numerals are given and the explanation thereof will be omitted. Note that the number of convex portions 13 of this receiving member 12 is not limited to four as in the embodiment, but for example, two convex portions.
It is also possible to have individual convex portions in the shape of ||.

〔Effect of the invention〕

According to the present invention, a receiving member is installed inside the outer frame, and a convex portion is provided on the upper side of the receiving member to protrude higher than the projecting length of the lead projecting from the bottom surface of the package of the integrated circuit component and to support the bottom surface of the package. is integrally molded, and a presser member is removably fitted into the inside of the outer frame from above, and recesses are fitted into the presser member from above on all four sides of the package placed on the convex portion. Even if the package is a type of integrated circuit component that cannot fit and support the four corners of the package, the package can be fitted between the convex part of the receiving member and the concave part of the holding member. The integrated circuit component can be held in place, transported on a soldering line, and soldered to the leads of the integrated circuit component. was impossible. For example, a flat package type integrated circuit having leads in four directions can be held and the leads can be soldered.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing an embodiment of the soldering fixture of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a sectional view taken along the line - - in Fig. 2, and Fig. 4 is a lattice-shaped portion thereof. 5 is a perspective view of the lattice-like part seen from below, FIG. 6 is a cross-sectional view of the main part showing the fixture in use, and FIG. 7 is a diagram showing how the fixture is connected to the transport holder. FIG. 8 is a plan view showing a modified example of the presser member, and FIG. 9 is a sectional view showing the modified example in use. W...Integrated circuit component, P...Package, L...
...Lead, 11...Outer frame, 12...Receiving member, 1
3... Convex portion, 14... Pressing member, 17... Concave portion.

Claims (1)

[Scope of Claims] 1. In a soldering fixture that holds the package of an integrated circuit component when soldering is performed on the surface of the lead of the integrated circuit component, a receiving member is installed inside the outer frame, and the receiving member A convex portion is integrally molded on the upper side of the package to protrude higher than the protruding length of the lead protruding from the lower surface of the package and supports the lower surface of the package, and a presser member is removably fitted into the inside of the outer frame from above, A soldering fixture characterized in that the holding member is formed with recesses that fit from above in all four sides of the package placed on the protrusion. 2. The soldering fixture according to claim 1, wherein the holding member has a lattice-shaped portion provided inside the inner frame, and a recessed portion provided on the lower surface of the lattice-shaped portion.