JPH0464741U - - Google Patents

Info

Publication number
JPH0464741U
JPH0464741U JP10826890U JP10826890U JPH0464741U JP H0464741 U JPH0464741 U JP H0464741U JP 10826890 U JP10826890 U JP 10826890U JP 10826890 U JP10826890 U JP 10826890U JP H0464741 U JPH0464741 U JP H0464741U
Authority
JP
Japan
Prior art keywords
pressure sensor
groove
semiconductor pressure
unit
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10826890U
Other languages
English (en)
Other versions
JP2507648Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990108268U priority Critical patent/JP2507648Y2/ja
Publication of JPH0464741U publication Critical patent/JPH0464741U/ja
Application granted granted Critical
Publication of JP2507648Y2 publication Critical patent/JP2507648Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Pressure Sensors (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を示す半導体圧力
センサユニツトの断面図、第２図はその一部であ
るケーシング溝部の拡大断面図、第３図は従来の
半導体圧力センサユニツトを示す断面図である。 図中、１１はケーシング、１１ｃは溝部、１１
ｄは内側部縁、１２は半導体圧力センサ、１４は
基板、１６は接着剤である。なお、図中同一符号
は同一又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体圧力センサを実装する基板と、この基板
    を収納し、半導体圧力センサの信号を外部に出力
    するユニツトにおいて、ユニツトのケーシング外
    周部に接着剤を注入する溝部を設け、この溝部の
    ケーシング内側部の縁の上に上記基板を載設した
    ことを特徴とする半導体圧力センサユニツトの組
    立構造。
JP1990108268U 1990-10-15 1990-10-15 半導体圧力センサ装置 Expired - Lifetime JP2507648Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990108268U JP2507648Y2 (ja) 1990-10-15 1990-10-15 半導体圧力センサ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990108268U JP2507648Y2 (ja) 1990-10-15 1990-10-15 半導体圧力センサ装置

Publications (2)

Publication Number Publication Date
JPH0464741U true JPH0464741U (ja) 1992-06-03
JP2507648Y2 JP2507648Y2 (ja) 1996-08-14

Family

ID=31855174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990108268U Expired - Lifetime JP2507648Y2 (ja) 1990-10-15 1990-10-15 半導体圧力センサ装置

Country Status (1)

Country Link
JP (1) JP2507648Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63177733U (ja) * 1987-05-09 1988-11-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63177733U (ja) * 1987-05-09 1988-11-17

Also Published As

Publication number Publication date
JP2507648Y2 (ja) 1996-08-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term