JPH0464799B2 - - Google Patents
Info
- Publication number
- JPH0464799B2 JPH0464799B2 JP2417684A JP2417684A JPH0464799B2 JP H0464799 B2 JPH0464799 B2 JP H0464799B2 JP 2417684 A JP2417684 A JP 2417684A JP 2417684 A JP2417684 A JP 2417684A JP H0464799 B2 JPH0464799 B2 JP H0464799B2
- Authority
- JP
- Japan
- Prior art keywords
- acid amide
- amide
- hydroxystearamide
- cream solder
- alkyl group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2417684A JPS60170594A (ja) | 1984-02-10 | 1984-02-10 | クリ−ムはんだ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2417684A JPS60170594A (ja) | 1984-02-10 | 1984-02-10 | クリ−ムはんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60170594A JPS60170594A (ja) | 1985-09-04 |
| JPH0464799B2 true JPH0464799B2 (de) | 1992-10-16 |
Family
ID=12131039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2417684A Granted JPS60170594A (ja) | 1984-02-10 | 1984-02-10 | クリ−ムはんだ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60170594A (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2628205B2 (ja) * | 1988-12-19 | 1997-07-09 | ニホンハンダ株式会社 | クリームはんだ |
| JPH07144293A (ja) * | 1993-11-22 | 1995-06-06 | Fujitsu Ten Ltd | 窒素リフロー用低残渣クリームはんだ |
| JPH07164180A (ja) * | 1993-12-17 | 1995-06-27 | Nippon Genma:Kk | クリームはんだ |
| JPH07241695A (ja) * | 1994-03-07 | 1995-09-19 | Nippon Genma:Kk | クリームはんだ |
| JP2002263884A (ja) * | 2001-03-09 | 2002-09-17 | Showa Denko Kk | ハンダ付け用フラックスおよびハンダペースト |
| EP2183076A1 (de) * | 2007-07-23 | 2010-05-12 | Henkel Limited | Lötflussmittel |
| WO2014057846A1 (ja) * | 2012-10-11 | 2014-04-17 | 株式会社ダイセル | 電気デバイス製造用溶剤組成物 |
| JP6136851B2 (ja) * | 2013-10-24 | 2017-05-31 | 住友金属鉱山株式会社 | はんだ用フラックスおよびはんだペースト |
-
1984
- 1984-02-10 JP JP2417684A patent/JPS60170594A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60170594A (ja) | 1985-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |