JPH0465163A - Manufacture of solid state image sensor - Google Patents
Manufacture of solid state image sensorInfo
- Publication number
- JPH0465163A JPH0465163A JP2180110A JP18011090A JPH0465163A JP H0465163 A JPH0465163 A JP H0465163A JP 2180110 A JP2180110 A JP 2180110A JP 18011090 A JP18011090 A JP 18011090A JP H0465163 A JPH0465163 A JP H0465163A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- image sensor
- state image
- light
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は固体撮像素子に関し、特に受光面に入射光量に
応して光透過率の変化するフィルタ層を設けた固体撮像
素子の製造方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a solid-state image sensor, and more particularly to a method for manufacturing a solid-state image sensor in which a filter layer whose light transmittance changes depending on the amount of incident light is provided on a light-receiving surface. It is something.
固体撮像素子において、受光面の一部の画素に強い光か
入り、そこで発生する信号電荷量か、例えばフォトダイ
オードの電荷蓄積能力以上になると、その過剰な電荷は
周りのフォトダイオードに流れ込む。この結果、周囲の
画素には光かあたらないにもかかわらず電荷か溜り、そ
れぞれの画素か選択されるタイミングで偽信号を発生す
る。この現象をブルーミングと呼び、固体撮像素子の大
きな問題となっている。このブルーミング現象を除去す
るための工夫は数多く提案されているか、それらの内の
1つに、固体撮像素子の受光面に入射光量に応して光透
過率の変化するフィルタ層を設ける方法かある。このフ
ィルタ層に用いる材料としては一般にフォトクロミック
ガラスと呼ばれる銀ハライド微結晶を含むガラスや、色
中心となる元素を含むガラスか用いられている。In a solid-state image sensor, when strong light enters some pixels on the light-receiving surface and the amount of signal charge generated there exceeds the charge storage capacity of the photodiode, for example, the excess charge flows into the surrounding photodiodes. As a result, charges accumulate in surrounding pixels even though they are not illuminated by light, and a false signal is generated at the timing when each pixel is selected. This phenomenon is called blooming, and is a major problem with solid-state image sensors. Many methods have been proposed to eliminate this blooming phenomenon, and one of them is to provide a filter layer on the light-receiving surface of the solid-state image sensor whose light transmittance changes depending on the amount of incident light. . The material used for this filter layer is generally a glass containing silver halide microcrystals called photochromic glass, or a glass containing an element serving as a color center.
次に動作について説明する。例えは特開昭537391
6にあるように、フォトクロミックガラスとは照射され
た光の強度に比例して透過率の低下するガラスのことを
言う。このようなガラスを固体撮像素子の受光面にとり
つけた場合、受光面の一部に強烈な光か入射したときハ
ックの光情報を乱すことなく部分的、可逆的に入射光量
を抑えることかてき、これによりブルーミング現象を除
去することかできる。Next, the operation will be explained. For example, Japanese Patent Publication No. 537391
6, photochromic glass refers to glass whose transmittance decreases in proportion to the intensity of irradiated light. When such glass is attached to the light-receiving surface of a solid-state image sensor, when intense light is incident on a part of the light-receiving surface, it is possible to partially and reversibly suppress the amount of incident light without disturbing the hack's optical information. , This makes it possible to eliminate the blooming phenomenon.
これらのフォトクロミックガラスは一般(二よく知られ
ているガラスと同しくケイ酸(SiO2)を主成分とす
るものであり、その製造には原料酸化物を混合し、高温
(千成前後)で融解、反応させる必要かある。このため
、フィルタ層の形成方法としては合成されたガラスの平
板を素子の受光面に張り合わせる方法か簡便であるか、
接着剤の吸収による全体的な感度の低下や、接着剤の塗
布むらによる感度むらを引き起こすことか考えられてい
た。また、直接ウェハ上で合成することも考えられるか
、ウェハをこのような高温にさらすことは半導体製造プ
ロセス上から考えると、素子そのものの性能を著しく悪
化させることか十分に考えられるし、フィルタ層の膜厚
を制御することか困難となる。一方つエバをダイシング
するさいにガラスか割れることかあることも考え合わせ
ると、その製造はダイシング後に1チツプずつ張り合わ
せる必要かあるため、複雑な工程をともなうとともに、
コストの増加か避けられない。Like other well-known glasses, these photochromic glasses have silicic acid (SiO2) as their main component, and their production involves mixing raw material oxides and melting them at high temperatures (around 1000 yen). Therefore, as a method for forming the filter layer, it is difficult to decide whether it is easier or easier to attach a flat plate of synthesized glass to the light-receiving surface of the element.
It was thought that this could lead to a decrease in overall sensitivity due to absorption of the adhesive, or uneven sensitivity due to uneven adhesive application. Also, is it possible to synthesize it directly on the wafer? Considering the semiconductor manufacturing process, exposing the wafer to such high temperatures may seriously deteriorate the performance of the device itself. It becomes difficult to control the film thickness. On the other hand, considering that the glass may break when dicing the chips, the manufacturing process involves a complicated process as it is necessary to bond each chip together after dicing.
An increase in costs is unavoidable.
この発明は、上記のような問題点を解消するためになさ
れたもので、前記フィルタ層の形成をより単純かつ容易
に行える固体撮像素子の製造方法を提供すること目的と
している。The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method for manufacturing a solid-state image sensor in which the filter layer can be formed more simply and easily.
この発明は、半導体基板に光電変換素子と、この光電変
換素子に入射された光に対してフォトクロミズムを示す
層が設けられた固体撮像素子の製造方法において、上記
のフォトクロミズムを示す層を塗布する工程を含むもの
である。This invention relates to a method for manufacturing a solid-state imaging device in which a semiconductor substrate is provided with a photoelectric conversion element and a layer exhibiting photochromism with respect to light incident on the photoelectric conversion element, and a step of applying the layer exhibiting photochromism as described above. This includes:
本発明の方法に依れば、固体撮像素子の受光面に入射光
量に応して透過率の変化するフィルタ層を形成する場合
に、通常の半導体プロセスでよく用いられているスピン
コード法等か流用できるため、目的とするフィルタ層の
膜厚も制御しやすく半導体基盤に悪影響を及はすような
高温も必要としない。また、枚葉処理か可能となるので
従来の方法よりも容易にかつ大量に早く製造することか
可能である。According to the method of the present invention, when forming a filter layer whose transmittance changes depending on the amount of incident light on the light-receiving surface of a solid-state image sensor, a spin code method, etc., which is often used in normal semiconductor processes, can be used. Since it can be reused, it is easy to control the thickness of the desired filter layer, and there is no need for high temperatures that would adversely affect the semiconductor substrate. In addition, since single wafer processing is possible, it is possible to manufacture in large quantities more easily and quickly than with conventional methods.
以下、この発明の実施例を示す第1図について説明する
。第1図は色分解機能のあるカラー用固体撮像素子に本
発明を適用した一例であり、光電変換部(2)の形成さ
れた半導体基板(1)の上面にカラーフィルタ層(6)
を有する。このフィルタ層(6)は、赤色光透過層(3
)と、緑色光透過層(4)と、青色光透過層(5)と、
透明樹脂保護層(7)とからなり、写真製版の手法を用
いて各充電変換部2ごとに一色ずつ対応させて形成され
ている。また、各透過層(3)。Hereinafter, FIG. 1 showing an embodiment of the present invention will be explained. FIG. 1 shows an example in which the present invention is applied to a color solid-state image sensor with a color separation function, in which a color filter layer (6) is formed on the upper surface of a semiconductor substrate (1) on which a photoelectric conversion section (2) is formed.
has. This filter layer (6) includes a red light transmitting layer (3).
), a green light transmitting layer (4), a blue light transmitting layer (5),
It consists of a transparent resin protective layer (7), and is formed using a photolithography technique to correspond to each charging conversion section 2 in one color. Also, each transparent layer (3).
f4)、 (5)は、形成するごとに透明樹脂保護層(
7)で被覆している。こうして形成したカラーフィルタ
層(6)の上に、フォトクロミズム特性を示すような材
料(8)を塗布している。この材料(8)は、具体的に
は一例として透明で可視光の透過率の高い高分子材料に
フォトクロミズムを示すような有機化合物を分散させた
物である。例えば、高分子材料としてはアクリル系、エ
ステル系等の高分子化合物の他に、ポリエチレンやポリ
スチレンなと透明で可視光の透過率の高い高分子材料な
ら有機・無機を問わず何でもよい。また、分散させる有
機物としては緑から赤色にかけての吸収帯をもつスピロ
ピラン系や、近紫外から青色にかけての吸収帯を持つチ
オインジゴ系やフルギド系の化合物を適当な割合で混合
した物を用いるとよい。このときの混合比としては、光
の各波長域において等しく均一に透過率を低下させるこ
とを考慮して決定する方法もあるか、固体撮像素子の各
波長域における感度に合わせて透過率を調節することを
考慮して決定することもてきる。また、特殊な用途を想
定して、可視光の内の一部の波長帯域たけ調光する事も
可能である。一方、スピンコード法を用いる場合には、
塗布後の膜厚や均一性に関して塗布する材料の粘度か問
題となるが、溶媒としては例えば一般のフすトレジスト
と同しエチルセロソルブアセテート等を用いることかで
きるので粘度の調整が容易であり、また、必要とする膜
厚を得ることや膜厚の均一性を得るために、粘度に応し
て塗布回転数や回転時間を変えることも可能である。例
えば、具体的な製造条件の一例としては、2μm−3μ
mの膜厚を得る場合、25°C−30°C程度の温度て
、粘度100cp−200cpの材料を200Orpm
−250Orpm程度の回転数で塗布すればよい。f4), (5) is a transparent resin protective layer (
7). A material (8) exhibiting photochromic properties is applied onto the color filter layer (6) thus formed. Specifically, this material (8) is, for example, a material in which an organic compound exhibiting photochromism is dispersed in a transparent polymeric material with high visible light transmittance. For example, the polymer material may be any organic or inorganic polymer material that is transparent and has high visible light transmittance, such as polyethylene or polystyrene, in addition to acrylic or ester polymer compounds. Further, as the organic substance to be dispersed, it is preferable to use a mixture of spiropyran compounds, which have absorption bands from green to red, and thioindigo and fulgide compounds, which have absorption bands from near ultraviolet to blue, in appropriate proportions. As for the mixing ratio at this time, there is a method of determining the transmittance in consideration of reducing the transmittance equally in each wavelength range of light, or adjusting the transmittance according to the sensitivity of the solid-state image sensor in each wavelength range. You can also make a decision by taking into consideration what you will do. In addition, it is also possible to dim only a part of the wavelength band of visible light for special purposes. On the other hand, when using the spin code method,
The viscosity of the material to be coated is a problem in terms of film thickness and uniformity after coating, but the viscosity can be easily adjusted because the solvent can be, for example, ethyl cellosolve acetate, which is the same as that used in general film resists. Further, in order to obtain the required film thickness and uniformity of the film thickness, it is also possible to change the coating rotation speed and rotation time depending on the viscosity. For example, as an example of specific manufacturing conditions, 2μm-3μm
In order to obtain a film thickness of
The coating may be applied at a rotation speed of about -250 rpm.
以上、本発明を例示したか、上述の例はその技術的思想
に基づいてさらに変形か可能である。例えば、(3)、
(4)、 (5)にはシアン、マセンダ、グリーンの
3色で構成される補色系カラーフィルタを用いることも
てきるし、色分解能か必要でなければ、カラーフィルタ
層(6)は無くてよい。Although the present invention has been illustrated above, the above-mentioned example can be further modified based on the technical idea. For example, (3),
For (4) and (5), a complementary color filter consisting of the three colors cyan, macenda, and green can be used, and if color resolution is not required, the color filter layer (6) can be omitted. good.
また、照射した光か強くなるに従い光透過率の低下する
特性を有する有機・無機材料のうちで適当な条件を満た
すものてあれば、(8)にはとのようなものでも用いる
ことはできるし、例えば、側鎖に前述のようなフォトク
ロミズムを示す化合物を導入したような高分子を合成し
て用いるようなこともてきる。そのうえ、必ずしもスピ
ンコード法による必要はなく、浸せき法なと他の塗布方
法や薄膜形成法なとの適用か可能であることは言うまて
もない。In addition, if there is an organic or inorganic material that has the characteristic of decreasing its light transmittance as the intensity of the irradiated light increases, and it satisfies the appropriate conditions, it is also possible to use materials such as (8). However, for example, it is also possible to synthesize and use a polymer in which a compound exhibiting photochromism as described above is introduced into the side chain. Moreover, it is needless to say that it is not always necessary to use the spin code method, and that a dipping method, other coating methods, or thin film forming method can be applied.
本発明によれは、上述のようにフォトクロミズムを示す
材料を塗布することにより、特殊な装置や工程を増やす
ことな〈従来の手段よりもはるかに単純、簡便にブルー
ミング防止法をとることかできる。また、従来よりも容
易にかつ大量に早く製造できるのて、低コスト化と工期
の短縮、品質の向上・安定化、それに伴う歩留まりの向
上か期待てきる。According to the present invention, by applying a material exhibiting photochromism as described above, it is possible to prevent blooming much more simply and conveniently than conventional means without increasing the number of special devices or processes. In addition, since it can be manufactured more easily and quickly in large quantities than conventional methods, it is expected to reduce costs, shorten production time, improve and stabilize quality, and improve yields as a result.
第1図は、本発明の一実施例を示す固体撮像素子の断面
図、第2図は従来例の固体撮像素子の断面図である。
図において、(1)・・・半導体基板、(2)・・光電
変換部、(3)、 (4)、 (5)・・・赤色、緑色
、青色フィルタ層、(6)・・・オン・チップ方式カラ
ーフィルタ層、(7)・透明樹脂保護層、(8)・・・
高分子系フォトクロミンク材料、(9)・フォトクロミ
ックガラス、α0)・・接着剤。
なお、各図中同一符号は同一部分、または相当部分を示
す。FIG. 1 is a cross-sectional view of a solid-state image sensor showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a conventional solid-state image sensor. In the figure, (1)...semiconductor substrate, (2)...photoelectric conversion section, (3), (4), (5)...red, green, blue filter layers, (6)...on・Chip type color filter layer, (7) ・Transparent resin protective layer, (8)...
Polymer photochromic material, (9)・Photochromic glass, α0)・Adhesive. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
射された光に対してフォトクロミズムを示す層が設けら
れた固体撮像素子の製造方法において、上記のフォトク
ロミズムを示す層を塗布する工程を含むことを特徴とす
る固体撮像素子の製造方法。A method for manufacturing a solid-state imaging device in which a semiconductor substrate is provided with a photoelectric conversion element and a layer exhibiting photochromism with respect to light incident on the photoelectric conversion element, including the step of applying the layer exhibiting photochromism as described above. A method for manufacturing a solid-state image sensor, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2180110A JPH0465163A (en) | 1990-07-05 | 1990-07-05 | Manufacture of solid state image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2180110A JPH0465163A (en) | 1990-07-05 | 1990-07-05 | Manufacture of solid state image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465163A true JPH0465163A (en) | 1992-03-02 |
Family
ID=16077598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2180110A Pending JPH0465163A (en) | 1990-07-05 | 1990-07-05 | Manufacture of solid state image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465163A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156511A (en) * | 2004-11-26 | 2006-06-15 | Sony Corp | Photoelectric conversion element and photoelectric conversion device |
| KR100880529B1 (en) * | 2002-07-05 | 2009-01-28 | 매그나칩 반도체 유한회사 | Color filter of CMOS image sensor and its manufacturing method |
| EP2389001A2 (en) | 2010-05-20 | 2011-11-23 | Sony Corporation | Solid-State Imaging Device and Electronic Equipment |
| EP2372768A3 (en) * | 2010-03-31 | 2013-06-12 | Sony Corporation | Solid-state image capturing device and electronic device |
| JP2013137337A (en) * | 2011-12-27 | 2013-07-11 | Fujifilm Corp | Method of manufacturing infrared cut filter, infrared absorption liquid composition used for the same, infrared cut filter, and camera module and method of manufacturing the same |
-
1990
- 1990-07-05 JP JP2180110A patent/JPH0465163A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100880529B1 (en) * | 2002-07-05 | 2009-01-28 | 매그나칩 반도체 유한회사 | Color filter of CMOS image sensor and its manufacturing method |
| JP2006156511A (en) * | 2004-11-26 | 2006-06-15 | Sony Corp | Photoelectric conversion element and photoelectric conversion device |
| EP2372768A3 (en) * | 2010-03-31 | 2013-06-12 | Sony Corporation | Solid-state image capturing device and electronic device |
| US8605175B2 (en) | 2010-03-31 | 2013-12-10 | Sony Corporation | Solid-state image capturing device including a photochromic film having a variable light transmittance, and electronic device including the solid-state image capturing device |
| US9219090B2 (en) | 2010-03-31 | 2015-12-22 | Sony Corporation | Solid-state image capturing device and electronic device |
| EP2389001A2 (en) | 2010-05-20 | 2011-11-23 | Sony Corporation | Solid-State Imaging Device and Electronic Equipment |
| US8754968B2 (en) | 2010-05-20 | 2014-06-17 | Sony Corporation | Solid-state imaging device and electronic equipment |
| JP2013137337A (en) * | 2011-12-27 | 2013-07-11 | Fujifilm Corp | Method of manufacturing infrared cut filter, infrared absorption liquid composition used for the same, infrared cut filter, and camera module and method of manufacturing the same |
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