JPH0465451U - - Google Patents

Info

Publication number
JPH0465451U
JPH0465451U JP10941890U JP10941890U JPH0465451U JP H0465451 U JPH0465451 U JP H0465451U JP 10941890 U JP10941890 U JP 10941890U JP 10941890 U JP10941890 U JP 10941890U JP H0465451 U JPH0465451 U JP H0465451U
Authority
JP
Japan
Prior art keywords
resin case
heat sink
semiconductor element
contact
contact surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10941890U
Other languages
Japanese (ja)
Other versions
JPH079381Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990109418U priority Critical patent/JPH079381Y2/en
Publication of JPH0465451U publication Critical patent/JPH0465451U/ja
Application granted granted Critical
Publication of JPH079381Y2 publication Critical patent/JPH079381Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による半導体装置の第１の実施
例の縦断面図、第２図は第１の実施例の使用する
樹脂ケースの底面図、第３図は第２の実施例に使
用する樹脂ケースの部分省略縦断面図、第４図は
同樹脂ケースの部分省略底面図、第５図は従来の
半導体装置の縦断面図である。 １１０……放熱板、１１２……半導体素子、１
１４，２１４……樹脂ケース、１１５，２１５…
…溝、１１６……接着剤。 FIG. 1 is a vertical sectional view of a first embodiment of a semiconductor device according to the present invention, FIG. 2 is a bottom view of a resin case used in the first embodiment, and FIG. 3 is a bottom view of a resin case used in the second embodiment. FIG. 4 is a partially omitted longitudinal cross-sectional view of the resin case, FIG. 4 is a partially omitted bottom view of the resin case, and FIG. 5 is a longitudinal cross-sectional view of a conventional semiconductor device. 110... Heat sink, 112... Semiconductor element, 1
14,214...Resin case, 115,215...
...Groove, 116...adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の面に半導体素子が取り付けられた放熱板
と、この放熱基板の上記一方の面に接触した状態
にかつ上記半導体素子を包囲した状態に設けられ
た樹脂ケースと、この樹脂ケースにおける上記放
熱板との接触面の全周に設けられた溝と、上記樹
脂ケースと上記放熱板とを接着するように上記接
触面に塗布された接着剤とを、具備する半導体装
置。 a heat sink having a semiconductor element attached to one surface; a resin case provided in contact with the one surface of the heat sink and surrounding the semiconductor element; and the heat sink in the resin case. A semiconductor device comprising: a groove provided around the entire circumference of a contact surface with the resin case; and an adhesive applied to the contact surface to bond the resin case and the heat sink.
JP1990109418U 1990-10-18 1990-10-18 Semiconductor device Expired - Fee Related JPH079381Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990109418U JPH079381Y2 (en) 1990-10-18 1990-10-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990109418U JPH079381Y2 (en) 1990-10-18 1990-10-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH0465451U true JPH0465451U (en) 1992-06-08
JPH079381Y2 JPH079381Y2 (en) 1995-03-06

Family

ID=31856619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990109418U Expired - Fee Related JPH079381Y2 (en) 1990-10-18 1990-10-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH079381Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310381A (en) * 2005-04-26 2006-11-09 Toyota Industries Corp Electronics
JP2012015349A (en) * 2010-07-01 2012-01-19 Fuji Electric Co Ltd Semiconductor device
JP2018190894A (en) * 2017-05-10 2018-11-29 株式会社豊田自動織機 Semiconductor module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55126649U (en) * 1979-03-01 1980-09-08
JPS58166045U (en) * 1982-04-28 1983-11-05 日本電気株式会社 semiconductor equipment
JPS62108545A (en) * 1985-11-06 1987-05-19 Shinko Electric Ind Co Ltd Printed substrate type package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55126649U (en) * 1979-03-01 1980-09-08
JPS58166045U (en) * 1982-04-28 1983-11-05 日本電気株式会社 semiconductor equipment
JPS62108545A (en) * 1985-11-06 1987-05-19 Shinko Electric Ind Co Ltd Printed substrate type package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310381A (en) * 2005-04-26 2006-11-09 Toyota Industries Corp Electronics
JP2012015349A (en) * 2010-07-01 2012-01-19 Fuji Electric Co Ltd Semiconductor device
JP2018190894A (en) * 2017-05-10 2018-11-29 株式会社豊田自動織機 Semiconductor module

Also Published As

Publication number Publication date
JPH079381Y2 (en) 1995-03-06

Similar Documents

Publication Publication Date Title
JPH01140850U (en)
JPS61149346U (en)
JPH02138453U (en)
JPH03124654U (en)
JPH0193722U (en)
JPS61153348U (en)
JPS6185175U (en)
JPS61102048U (en)
JPH01112053U (en)
JPH0442742U (en)
JPH0215736U (en)
JPH01100453U (en)
JPH029442U (en)
JPH0233453U (en)
JPH0474445U (en)
JPH0226260U (en)
JPS63128746U (en)
JPS63172139U (en)
JPS63134538U (en)
JPS6155041U (en)
JPS63152249U (en)
JPH01116606U (en)
JPS62180956U (en)
JPH02131355U (en)
JPH029430U (en)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees