JPH0465490U - - Google Patents
Info
- Publication number
- JPH0465490U JPH0465490U JP10832090U JP10832090U JPH0465490U JP H0465490 U JPH0465490 U JP H0465490U JP 10832090 U JP10832090 U JP 10832090U JP 10832090 U JP10832090 U JP 10832090U JP H0465490 U JPH0465490 U JP H0465490U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- heat sink
- wiring board
- groove
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１〜第３図は本考案の一実施例を示し、第１
図は全体斜視図、第２図は第１図−線断面図
、第３図は要部分解斜視図、第４図は第２図に対
応する従来例の断面図である。
Ｕ……電子制御ユニツト、ａ……部品設置面、
ｂ……底面、ｃ……電子部品取付面（側面）、ｅ
……半田付け面、ｓ……半田、２……プリント配
線基板、４……放熱板、６……発熱性電子部品、
９……装着溝、１０……取付けピン、１１……軸
部、１２……頭部、１５……プリント配線、１６
……接続端子。
1 to 3 show an embodiment of the present invention.
2 is a sectional view taken along the line of FIG. 1, FIG. 3 is an exploded perspective view of a main part, and FIG. 4 is a sectional view of a conventional example corresponding to FIG. 2. U...Electronic control unit, a...Component installation surface,
b...Bottom surface, c...Electronic component mounting surface (side surface), e
... Soldering surface, s ... Solder, 2 ... Printed wiring board, 4 ... Heat sink, 6 ... Heat-generating electronic component,
9... Mounting groove, 10... Mounting pin, 11... Shaft, 12... Head, 15... Printed wiring, 16
……Connecting terminal.
Claims (1)
２の部品設置面ａに固定された放熱板４と、その
放熱板４に取付けられると共に前記プリント配線
基板２を貫通する接続端子１６をそのプリント配
線基板２の半田付け面ｅに存するプリント配線１
５に半田付けした発熱性電子部品６とを備えた電
子制御ユニツトにおいて、前記放熱板４の、前記
部品設置面ａに重なる底面ｂに、少なくとも一端
がその放熱板４の側面ｃに開口する装着溝９を形
成すると共にその装着溝９の溝幅を溝口９ａ側で
狭く、また溝底９ｂ側で広くし、前記装着溝９に
頭部１２側を装着した取付ピン１０の軸部１１を
前記プリント配線基板２に貫通させて前記半田付
け面ｅに半田付けしたことを特徴とする電子制御
ユニツト。 A printed wiring board 2, a heat sink 4 fixed to the component mounting surface a of the printed wiring board 2, and a connecting terminal 16 attached to the heat sink 4 and passing through the printed wiring board 2 to the printed wiring board 2. Printed wiring 1 existing on the soldering surface e of
In the electronic control unit equipped with a heat-generating electronic component 6 soldered to a heat sink 5, at least one end thereof is mounted on a bottom surface b of the heat sink 4 that overlaps the component installation surface a, with at least one end opening in a side surface c of the heat sink 4. A groove 9 is formed, and the groove width of the mounting groove 9 is narrowed on the groove mouth 9a side and widened on the groove bottom 9b side, and the shaft portion 11 of the mounting pin 10 with the head 12 side mounted in the mounting groove 9 is An electronic control unit characterized in that it penetrates the printed wiring board 2 and is soldered to the soldering surface e.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10832090U JPH0465490U (en) | 1990-10-15 | 1990-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10832090U JPH0465490U (en) | 1990-10-15 | 1990-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465490U true JPH0465490U (en) | 1992-06-08 |
Family
ID=31855261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10832090U Pending JPH0465490U (en) | 1990-10-15 | 1990-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465490U (en) |
-
1990
- 1990-10-15 JP JP10832090U patent/JPH0465490U/ja active Pending
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