JPH0465524U - - Google Patents

Info

Publication number
JPH0465524U
JPH0465524U JP10723190U JP10723190U JPH0465524U JP H0465524 U JPH0465524 U JP H0465524U JP 10723190 U JP10723190 U JP 10723190U JP 10723190 U JP10723190 U JP 10723190U JP H0465524 U JPH0465524 U JP H0465524U
Authority
JP
Japan
Prior art keywords
integrated
cooling plate
heat
peltier
screws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10723190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10723190U priority Critical patent/JPH0465524U/ja
Publication of JPH0465524U publication Critical patent/JPH0465524U/ja
Pending legal-status Critical Current

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  • Thermotherapy And Cooling Therapy Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図から第3図は本考案の実施例を示すもの
で、第1図は実施例1の分解斜視図、第2図は実
施例1の側面図、第3図は実施例2の側面図、第
4図は従来例を示す斜視図である。 1はペルチエ素子、2及び12は放熱器、3及
び13は冷却板、4は熱伝導性マツト、5は直流
電源、6及び16はネジである。
Figures 1 to 3 show embodiments of the present invention; Figure 1 is an exploded perspective view of Embodiment 1, Figure 2 is a side view of Embodiment 1, and Figure 3 is a side view of Embodiment 2. 4 are perspective views showing a conventional example. 1 is a Peltier element, 2 and 12 are heat sinks, 3 and 13 are cooling plates, 4 is a thermally conductive mat, 5 is a DC power supply, and 6 and 16 are screws.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ペルチエ効果を利用した素子1(以下ペルチエ
素子という。)の放熱面1aに放熱器2を、吸熱
面1bに冷却板3をネジ6又は接着剤で一体化し
、冷却板3の上に熱伝導性マツト4を取り付けた
頭部の冷却装置。
A heat radiator 2 is integrated on the heat radiation surface 1a of an element 1 that utilizes the Peltier effect (hereinafter referred to as a Peltier element), and a cooling plate 3 is integrated on the heat absorption surface 1b with screws 6 or adhesive, and a thermally conductive material is placed on the cooling plate 3. Cooling device for the head with matt 4 attached.
JP10723190U 1990-10-11 1990-10-11 Pending JPH0465524U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10723190U JPH0465524U (en) 1990-10-11 1990-10-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10723190U JPH0465524U (en) 1990-10-11 1990-10-11

Publications (1)

Publication Number Publication Date
JPH0465524U true JPH0465524U (en) 1992-06-08

Family

ID=31853644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10723190U Pending JPH0465524U (en) 1990-10-11 1990-10-11

Country Status (1)

Country Link
JP (1) JPH0465524U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57156760A (en) * 1981-03-25 1982-09-28 Hitachi Ltd Electronic cooling pillow
JPS61143062A (en) * 1985-11-27 1986-06-30 株式会社日立製作所 Electronic cooling pillow power supply

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57156760A (en) * 1981-03-25 1982-09-28 Hitachi Ltd Electronic cooling pillow
JPS61143062A (en) * 1985-11-27 1986-06-30 株式会社日立製作所 Electronic cooling pillow power supply

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