JPH0465769B2 - - Google Patents
Info
- Publication number
- JPH0465769B2 JPH0465769B2 JP60071638A JP7163885A JPH0465769B2 JP H0465769 B2 JPH0465769 B2 JP H0465769B2 JP 60071638 A JP60071638 A JP 60071638A JP 7163885 A JP7163885 A JP 7163885A JP H0465769 B2 JPH0465769 B2 JP H0465769B2
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- metal
- adhesive
- bonding
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/02—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/12—Iron
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/14—Noble metals, e.g. silver, gold or platinum
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
発明の技術分野
本発明は、フツ素樹脂と金属との接着方法に関
し、さらに詳しくは、ポリテトラフルオロエチレ
ンなどのフツ素樹脂と、銅、アルミニウム、白金
などの金属とを接着剤を用いなくとも強固に接着
しうるようなフツ素樹脂と金属との接着方法に関
する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a method for bonding a fluororesin and a metal, and more particularly, to a method for bonding a fluororesin such as polytetrafluoroethylene and a metal such as copper, aluminum, or platinum. This invention relates to a method of bonding fluororesin and metal that can be firmly bonded without using an adhesive.
発明の技術的背景ならびにその問題点
ポリテトラフルオロエチレン(以下PTFEとい
うことがある)などのフツ素樹脂は、耐熱性、耐
候性、耐化学薬品性、離型性、滑り特性、機械的
強度に優れているとともに、誘電率および誘電正
接が小さいという優れた電気的特性をも有してい
るため、パツキン、ガスケツトなどのシール部品
あるいは軸受、摺動材などの機構部品に加えて、
プリント基板などの電子機器部品あるいは耐食性
を要求される配管部品あるいはタンクなどのライ
ニング材などとして広く用いられている。Technical background of the invention and its problems Fluororesins such as polytetrafluoroethylene (hereinafter sometimes referred to as PTFE) have excellent heat resistance, weather resistance, chemical resistance, mold releasability, slip properties, and mechanical strength. It also has excellent electrical properties such as low dielectric constant and low dielectric loss tangent, so it is used in seal parts such as gaskets and gaskets, and mechanical parts such as bearings and sliding materials.
It is widely used as electronic equipment parts such as printed circuit boards, piping parts that require corrosion resistance, and lining materials for tanks and the like.
ところがPTFEなどフツ素樹脂は、成形体に形
成した場合にその表面自由エネルギーは著しく低
いため、他の材質たとえば金属との接着が接着剤
を用いてもかなり困難であつた。このためPTFE
などのフツ素樹脂と金属との接着性を高めるため
の方法が数多く提案されている。その1つとして
は、フツ素樹脂表面を、液体アンモニアに金属ナ
トリウムを溶かした溶液で処理して、その表面を
化学的に活性化する方法が提案されている。とこ
ろがこの方法では、処理液自体が環境汚染を引起
す恐れがあるとともに、その取扱いに危険が伴な
うという問題点があつた。また、フツ素樹脂表面
にプラズマスパツタリングなどの物理的処理を施
したり、あるいはフツ素樹脂表面を機械的に粗面
化するなどの方法も提案されているが、この方法
では、処理に手間がかかつたりあるいはコスト上
昇を伴なうなどの問題点があつた。 However, when fluororesin such as PTFE is formed into a molded object, its surface free energy is extremely low, so it is quite difficult to bond it to other materials, such as metal, even if adhesives are used. For this reason, PTFE
Many methods have been proposed to improve the adhesion between fluororesin and metal. One proposed method is to chemically activate the surface of a fluororesin by treating it with a solution of metallic sodium dissolved in liquid ammonia. However, this method has problems in that the treatment liquid itself may cause environmental pollution and its handling is dangerous. In addition, methods have been proposed in which the surface of fluororesin is subjected to physical treatment such as plasma sputtering, or the surface of fluororesin is mechanically roughened. However, there were problems such as increased time and increased costs.
さらにまた、特開昭58−112710号公報には、フ
ツ素樹脂の接着面を加熱しながらその接着面に砥
粒を圧接することにより、砥粒を接着面の表面に
その一部が露出した状態で埋設し、この砥粒にア
ンカー機能をもたせて、フツ素樹脂の接着面と他
の被着体とを接着剤により接着することを特徴と
するフツ素樹脂と他の被着体との接着方法が開示
されている。ところがこの方法では、砥粒にアン
カー効果は期待できるもののエポキシ樹脂などの
接着剤を用いているため、得られる積層体の耐熱
性の低下が避けられず、砥粒あるいは接着剤によ
り高温高周波領域において接着強度や電気特性が
低下することがあり、特に接着物をプリント基板
として用いる場合には接着性処理層あるいは砥粒
の除去作業の難易性が重大な問題点となつてい
た。 Furthermore, Japanese Patent Application Laid-Open No. 112710/1983 discloses that a part of the abrasive grains is exposed on the surface of the adhesive surface by pressing the abrasive grains onto the adhesive surface of the fluororesin while heating the adhesive surface. The adhesive surface of the fluororesin and other adherends is bonded together using an adhesive, with the abrasive grains having an anchor function. A bonding method is disclosed. However, in this method, although an anchoring effect can be expected for the abrasive grains, since an adhesive such as epoxy resin is used, a decrease in the heat resistance of the resulting laminate is unavoidable. Adhesive strength and electrical properties may deteriorate, and particularly when the adhesive is used as a printed circuit board, the difficulty of removing the adhesive treatment layer or abrasive grains has been a serious problem.
発明の目的
本発明は、上記のような従来技術に伴なう問題
点を解決しようとするものであつて、PTFEなど
のフツ素樹脂と、銅、アルミニウムなど金属とを
有機接着剤を用いることなく強固に接着させるた
めの方法を提供することを目的としている。Purpose of the Invention The present invention is an attempt to solve the above-mentioned problems associated with the conventional technology. The purpose of the present invention is to provide a method for firmly adhering the product.
発明の概要
本発明に係るフツ素樹脂と金属との接着方法
は、フツ素樹脂と該フツ素樹脂に接着される金属
との間に金属粉末を介在させ、次いで該フツ素樹
脂の融点以上の温度に加熱しながらフツ素樹脂と
金属とを圧接することを特徴としている。Summary of the Invention The method of bonding a fluororesin and a metal according to the present invention involves interposing a metal powder between the fluororesin and the metal to be bonded to the fluororesin, and then The feature is that the fluororesin and metal are brought into pressure contact while being heated to a certain temperature.
発明の具体的説明 以下本発明を具体的に説明する。Specific description of the invention The present invention will be specifically explained below.
本発明で金属と接着せしめられるのはフツ素樹
脂であるが、このフツ素樹脂の形態としては、シ
ート状などのフツ素樹脂そのものであつてもよ
く、あるいは充填剤が含まれたフツ素樹脂であつ
てもよい。また、ガラス製クロスあるいは芳香族
ポリアミド繊維などの耐熱性樹脂製クロスなどに
フツ素樹脂を充分に含浸させてコーテイングした
ものなどが用いられる。要するに、本発明で金属
と接着せしめられるのはフツ素樹脂であつて、こ
のフツ素樹脂はフツ素樹脂そのものであつてもよ
く、また充填剤を含んでいてもよく、さらにシー
ト状、クロス状などのような状態であつてもよ
い。 In the present invention, the material that is bonded to the metal is a fluororesin, but the form of this fluororesin may be the fluororesin itself, such as a sheet, or the fluororesin containing a filler. It may be. Further, a cloth made of glass or a cloth made of heat-resistant resin such as aromatic polyamide fiber sufficiently impregnated with a fluororesin and coated thereon can be used. In short, in the present invention, it is the fluororesin that is bonded to the metal, and the fluororesin may be the fluororesin itself, or may contain a filler, and may also be in the form of a sheet or cloth. It may be in a state like this.
金属と接着せしめられるフツ素樹脂としては、
ポリテトラフルオロエチレン(PTFE)、テトラ
フルオロエチレンとパーフルオロアルキルビニル
エーテルとの共重合体であるPFA、テトラフル
オロエチレンとヘキサフルオロプロピレンとの共
重合体であるFEP、テトラフルオロエチレンと
ヘキサフルオロプロピレンとパーフルオロアルキ
ルビニルエーテルとの共重合体であるEPEなど
のほかその他のフツ素樹脂が用いられる。このう
ち、フツ素樹脂の耐熱性、耐薬品性、機械的強度
などを考慮すると、PTFEが特に好ましい。 As a fluororesin that can be bonded to metal,
Polytetrafluoroethylene (PTFE), PFA, a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, FEP, a copolymer of tetrafluoroethylene and hexafluoropropylene, tetrafluoroethylene, hexafluoropropylene and perfluoropropylene, In addition to EPE, which is a copolymer with fluoroalkyl vinyl ether, other fluororesins are used. Among these, PTFE is particularly preferred in consideration of the heat resistance, chemical resistance, mechanical strength, etc. of the fluororesin.
一方、本発明でフツ素樹脂と接着せしめられる
金属としては、銅、アルミニウム、亜鉛、白金、
鉄などが広く用いられる。このうち接着物を高周
波用プリント基板として用いる場合には、箔状の
銅が特に好ましい。 On the other hand, metals that can be bonded to the fluororesin in the present invention include copper, aluminum, zinc, platinum,
Steel etc. are widely used. Among these, when the adhesive is used as a high-frequency printed circuit board, copper foil is particularly preferable.
上記のようなフツ素樹脂と金属とを接着するに
際して、まずフツ素樹脂と金属との間に金属粉末
を介在させる。金属粉末としては、銅粉末、アル
ミニウム粉末、亜鉛粉末、白金粉末、鉄粉末など
が用いられる。このような金属粉末は、50〜400
メツシユ好ましくは100〜200メツシユであること
が望ましい。また、たとえばフツ素樹脂と銅とを
接着させる場合には、銅粉末以外の異種金属粉末
を介在させることもできるが、銅粉末を介在させ
ることが好ましい。同様なことは、フツ素樹脂と
他の金属とを接着させる場合にもあてはまる。す
なわち、たとえばフツ素樹脂とアルミニウムとを
接着させる場合には、両者の間にアルミニウム粉
末を介在させることが好ましい。 When bonding the fluororesin and metal as described above, metal powder is first interposed between the fluororesin and the metal. As the metal powder, copper powder, aluminum powder, zinc powder, platinum powder, iron powder, etc. are used. Such metal powders are 50-400
The number of meshes is preferably 100 to 200 meshes. Further, for example, when bonding a fluororesin and copper, a different metal powder other than copper powder may be interposed, but it is preferable to interpose a copper powder. The same thing applies to bonding fluororesin and other metals. That is, for example, when bonding a fluororesin and aluminum, it is preferable to interpose aluminum powder between the two.
このような金属粉末は、フツ素樹脂表面1cm2に
対して0.5〜10mg好ましくは1.0〜2.0mg程度の量で
介在されることが望ましい。 It is desirable that such metal powder be interposed in an amount of about 0.5 to 10 mg, preferably about 1.0 to 2.0 mg, per 1 cm 2 of the surface of the fluororesin.
次に上記のようにして、フツ素樹脂と金属との
間に金属粉末を介在させた後に、両者を該フツ素
樹脂の融点以上の温度に加熱しながら圧接する。
たとえば、フツ素樹脂がPTFEである場合には、
327℃以上の温度に加熱することが必要であり、
フツ素樹脂がPFAである場合には、250℃以上の
温度すなわちPFAの軟化点温度以上好ましくは
融点以上に加熱することが必要である。フツ素樹
脂と金属とを、上記のような温度に加熱しながら
圧接するが、この際に10Kg/cm2以上好ましくは50
Kg/cm2以上の圧力をかけることが望ましい。なお
フツ素樹脂が熱溶融性である場合に、該フツ素樹
脂の軟化点温度以上に加熱すればよい場合もある
が、好ましくは融点以上に加熱することが望まし
い。 Next, after interposing the metal powder between the fluororesin and the metal as described above, the two are pressed together while being heated to a temperature equal to or higher than the melting point of the fluororesin.
For example, if the fluororesin is PTFE,
It is necessary to heat it to a temperature of 327℃ or higher,
When the fluororesin is PFA, it is necessary to heat it to a temperature of 250°C or higher, that is, higher than the softening point of PFA, preferably higher than the melting point. The fluororesin and the metal are pressed together while being heated to the above temperature, and at this time, the pressure is 10 kg/cm 2 or more, preferably 50 kg/cm 2 or more.
It is desirable to apply a pressure of Kg/cm2 or more . Note that when the fluororesin is heat-melting, it may be sufficient to heat the fluororesin to a temperature higher than the softening point of the fluororesin, but it is preferable to heat the fluororesin to a temperature higher than the melting point.
このようにしてフツ素樹脂と金属とを接着させ
ると、接着剤を全く用いないにもかかわらず、両
者の間に接着剤を用いた場合とほぼ同等の接着力
が得られる。たとえばPTFE樹脂基板と銅箔との
間に銅粉末を介在させて、327℃以上の温度に加
熱しながら圧接して両者を接着させると、2Kg
f/cm程度の接着力が得られる。この値は接着剤
を用いて接着させた場合の接着力とほぼ同等であ
る。 By bonding the fluororesin and the metal in this manner, almost the same adhesive strength as when an adhesive is used between the two can be obtained, even though no adhesive is used at all. For example, if copper powder is interposed between a PTFE resin board and copper foil, and the two are bonded by pressure while heating to a temperature of 327°C or higher, the weight of 2 kg
Adhesive force of approximately f/cm can be obtained. This value is almost equivalent to the adhesive force when bonding using an adhesive.
このように本発明では、接着剤を用いずに金属
粉末を用いるため、得られるフツ素樹脂と金属と
の積層体は、耐熱性、耐候性に優れているととも
に、フツ素樹脂が本来有する優れた誘電特性はほ
とんど低下しないという優れた電気的特性をも有
している。したがつて、本発明に係るフツ素樹脂
と金属との接着方法は、特にプリント基板を製造
する際に有用である。 In this way, in the present invention, metal powder is used without using an adhesive, so the resulting laminate of fluororesin and metal has excellent heat resistance and weather resistance, and also has superior properties inherent to fluororesin. It also has excellent electrical properties with almost no deterioration in dielectric properties. Therefore, the method of bonding fluororesin and metal according to the present invention is particularly useful in manufacturing printed circuit boards.
また、本発明により形成されたフツ素樹脂と金
属との接着物は、フツ素樹脂と金属とが強固に接
着されており、しかもフツ素樹脂が優れた摺動特
性を有しているため、スライデイングパツトなど
の摺動部材として用いることもできる。 In addition, the fluororesin and metal adhesive formed according to the present invention has a strong bond between the fluororesin and the metal, and the fluororesin has excellent sliding properties. It can also be used as a sliding member such as a sliding pad.
さらに、本発明に係るフツ素樹脂と金属との接
着方法は、フツ素樹脂と金属との強固な接着を可
能とするため、金属部材を腐蝕性薬品から守るた
めのライニングの形成に際しても使用できる。 Furthermore, since the method for bonding fluororesin and metal according to the present invention enables strong bonding between fluororesin and metal, it can also be used for forming linings to protect metal members from corrosive chemicals. .
また、本発明に係るフツ素樹脂と金属との接着
方法では、フツ素樹脂表面に化学的活性化処理、
物理的処理あるいは機械的処理を施す必要がない
ため、工程の省略化が可能となり、コスト低減お
よび生産性の向上を図ることができる。 In addition, in the method of bonding a fluororesin and a metal according to the present invention, the surface of the fluororesin is subjected to chemical activation treatment.
Since there is no need to perform physical treatment or mechanical treatment, steps can be omitted, and costs can be reduced and productivity improved.
以下に本発明を実施例により説明するが、本発
明はこれら実施例に限定されるものではない。 EXAMPLES The present invention will be explained below using Examples, but the present invention is not limited to these Examples.
実施例
厚さ0.8mmのPTFEフイルム1枚と、厚さ35μの
銅箔2枚とを用意し、それぞれをアセトンで洗浄
して脱脂した。Example One 0.8 mm thick PTFE film and two 35 μ thick copper foils were prepared, and each was cleaned and degreased with acetone.
次にPTFEフイルムの両面に、200メツシユの
銅粉末(関東化学製)を1cm2当り1.2mg程度均一
に散布して付着させた後に、該PTFEフイルム両
面に前記銅箔を重ね合わせ、得られた積層体を
370℃の温度に加熱しながら、30分間100Kgf/cm2
の圧力をかけて、PTFEフイルムと銅箔とを接着
させた。この圧接時には、PTFEフイルムは充分
にゲル化した状態となつていた。 Next, 200 meshes of copper powder (manufactured by Kanto Chemical Co., Ltd.) was uniformly spread and adhered to both sides of the PTFE film at a rate of 1.2 mg per 1 cm 2 , and then the copper foil was superimposed on both sides of the PTFE film, resulting in the following. laminate
100Kgf/cm 2 for 30 minutes while heating to a temperature of 370℃
The PTFE film and the copper foil were bonded together by applying pressure of . At this time of pressure contact, the PTFE film was in a sufficiently gelled state.
次に、得られた積層体をコールドプレスに移し
て、焼く100Kgf/cm2の荷重をかけたまま冷却し
たところ、そりが全く発生していないCu−箔−
PTFEフイルム−Cu箔からなる積層体が得られ
た。 Next, the obtained laminate was transferred to a cold press and cooled under a load of 100 Kgf/cm 2 , and no warpage was observed.
A laminate consisting of PTFE film-Cu foil was obtained.
この積層体の接着力を90°ピールテスト(常態)
により調べたところ、2Kgf/cmの接着強度を有
していることがわかつた。 90° peel test to check the adhesive strength of this laminate (normal state)
When examined, it was found that the adhesive strength was 2 kgf/cm.
この接着強度は、接着剤を使用した場合に得ら
れる積層体の接着強度と比較して、何ら遜色のな
いものであつた。 This adhesive strength was comparable in no way to the adhesive strength of the laminate obtained when an adhesive was used.
また上記のようにして得られた積層体の誘電特
性(tanδ)を調べたところ0.0002以下という値が
得られた。一方有機接着剤(エポキシ樹脂系接着
剤)を用いて得られた積層体の誘電特性を調べた
ところ、tanδは0.001以上であつて、大きく低下
していたことがわかつた。このことより、本発明
に従つて形成されたフツ素樹脂と金属との積層体
は、優れた誘電特性を有していることがわかつ
た。 Further, when the dielectric properties (tan δ) of the laminate obtained as described above were examined, a value of 0.0002 or less was obtained. On the other hand, when the dielectric properties of the laminate obtained using an organic adhesive (epoxy resin adhesive) were investigated, it was found that the tan δ was 0.001 or more, which was significantly reduced. From this, it was found that the laminate of fluororesin and metal formed according to the present invention has excellent dielectric properties.
発明の効果
本発明では、フツ素樹脂と該フツ素樹脂に接着
される金属との間に金属粉末を介在させ、次いで
該フツ素樹脂の融点以上の温度に加熱しながら、
フツ素樹脂と金属とを圧接して、フツ素樹脂と金
属との接着を図つているため、以下のような効果
が認められる。Effects of the Invention In the present invention, a metal powder is interposed between a fluororesin and a metal bonded to the fluororesin, and then, while heating to a temperature equal to or higher than the melting point of the fluororesin,
Since the fluororesin and the metal are pressed together to achieve adhesion between the fluororesin and the metal, the following effects can be observed.
(a) 接着剤を用いなくとも、フツ素樹脂と金属と
の間に強固な接着力が得られる。したがつて、
得られる積層体は、耐熱性に優れているととも
に、誘電特性などの電気特性が低下することが
ない。(a) Strong adhesive strength can be obtained between fluororesin and metal without using adhesive. Therefore,
The resulting laminate has excellent heat resistance and does not suffer from deterioration in electrical properties such as dielectric properties.
(b) フツ素樹脂と金属とを接着するに際して、フ
ツ素樹脂表面に化学的処理、物理的処理あるい
は機械的処理を施す必要がないため、工程の省
略化が可能となり、コストの低減および生産性
の向上を図ることができる。(b) When bonding fluororesin and metal, there is no need to perform chemical, physical, or mechanical treatment on the fluororesin surface, making it possible to simplify processes, reduce costs, and improve production. It is possible to improve sexual performance.
Claims (1)
との間に金属粉末を介在させ、次いで該フツ素樹
脂の融点以上の温度に加熱しながら、フツ素樹脂
と金属とを圧接することを特徴とするフツ素樹脂
と金属との接着方法。1. Metal powder is interposed between the fluororesin and the metal to be adhered to the fluororesin, and then the fluororesin and the metal are pressure-welded while being heated to a temperature equal to or higher than the melting point of the fluororesin. A method of bonding fluorocarbon resin and metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60071638A JPS61229531A (en) | 1985-04-04 | 1985-04-04 | Bonding of fluorine resin and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60071638A JPS61229531A (en) | 1985-04-04 | 1985-04-04 | Bonding of fluorine resin and metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61229531A JPS61229531A (en) | 1986-10-13 |
| JPH0465769B2 true JPH0465769B2 (en) | 1992-10-21 |
Family
ID=13466386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60071638A Granted JPS61229531A (en) | 1985-04-04 | 1985-04-04 | Bonding of fluorine resin and metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61229531A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102789764B1 (en) * | 2021-12-22 | 2025-04-03 | 롯데에너지머티리얼즈 주식회사 | Surface-treated copper foil with heat resistance, copper clad laminate comprising the same, and printed wiring board comprising the same |
-
1985
- 1985-04-04 JP JP60071638A patent/JPS61229531A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61229531A (en) | 1986-10-13 |
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