JPH0467347U - - Google Patents
Info
- Publication number
- JPH0467347U JPH0467347U JP11087190U JP11087190U JPH0467347U JP H0467347 U JPH0467347 U JP H0467347U JP 11087190 U JP11087190 U JP 11087190U JP 11087190 U JP11087190 U JP 11087190U JP H0467347 U JPH0467347 U JP H0467347U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- electronic component
- hole provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案の実施例を示す放熱板をプリン
ト配線基板上に取付けた状態の一部省略斜視図、
第２図は同第１図に示す放熱板とプリント配線基
板との間にスペーサーを挿入した状態の一部省略
断面図、第３図は同第２図に示すスペーサーの斜
視拡大図、第４図は従来例を示す放熱板をプリン
ト配線基板上に取付けた状態の一部省略断面図で
ある。
１……プリント配線基板、２……放熱板、３…
…半導体、４……同半導体のリード線、５……ね
じ、６……ワツシヤー、７……マイカ板、８……
導電箔、９……透孔、１０……半田付部、１１…
…スペーサー、１２……透孔、１３……取付溝、
１４……ねじ、１５……孔、２１……プリント配
線基板、２２……放熱板、２３……半導体、２４
……半導体のリード線、２５……ねじ、２６……
ワツシヤー、２７……マイカ板、２８……導電箔
、２９……透孔、３０……半田付部、３１……透
孔、３２……取付溝、３３……ねじ。
FIG. 1 is a partially omitted perspective view showing an embodiment of the present invention in which a heat sink is mounted on a printed wiring board;
2 is a partially omitted sectional view of the spacer inserted between the heat sink and the printed wiring board shown in FIG. 1, FIG. 3 is an enlarged perspective view of the spacer shown in FIG. 2, and FIG. The figure is a partially omitted cross-sectional view of a conventional heat sink mounted on a printed wiring board. 1... Printed wiring board, 2... Heat sink, 3...
...Semiconductor, 4... Lead wire of the semiconductor, 5... Screw, 6... Washer, 7... Mica plate, 8...
Conductive foil, 9... Through hole, 10... Soldering part, 11...
...Spacer, 12...Through hole, 13...Mounting groove,
14... Screw, 15... Hole, 21... Printed wiring board, 22... Heat sink, 23... Semiconductor, 24
...Semiconductor lead wire, 25...Screw, 26...
Washer, 27... Mica plate, 28... Conductive foil, 29... Through hole, 30... Soldering part, 31... Through hole, 32... Mounting groove, 33... Screw.
Claims (1)
載置した放熱板と、裏面に導電箔を形成したプリ
ント配線基板と、緩衝効果を有するスペーサーと
をそれぞれ設け、前記電子部品を載置した放熱板
を前記プリント配線基板上に設置し、前記電子部
品に備えたリード線の先端部は前記プリント配線
基板に設けた透孔に挿入し同プリント配線基板の
裏面に形成した導電箔に半田付し、ねじを設け、
同ねじを前記スペーサーに設けた孔に挿入したの
ち前記プリント配線基板に設けた透孔および前記
放熱板に形成した取付溝の底面側に順次挿入して
螺着せしめ前記放熱板を固着してなる放熱板の固
定構造。 In an electronic device using a heat sink, a heat sink on which an electronic component is mounted, a printed wiring board with a conductive foil formed on the back side, and a spacer having a buffering effect are provided, and the heat sink on which the electronic component is mounted is provided. The tip of the lead wire installed on the printed wiring board and provided on the electronic component is inserted into a through hole provided in the printed wiring board, soldered to a conductive foil formed on the back side of the printed wiring board, and then screwed. established,
The same screw is inserted into the hole provided in the spacer, and then sequentially inserted into the through hole provided in the printed wiring board and the bottom side of the mounting groove formed in the heat sink, and screwed to secure the heat sink. Fixed structure of heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11087190U JPH0467347U (en) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11087190U JPH0467347U (en) | 1990-10-23 | 1990-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467347U true JPH0467347U (en) | 1992-06-15 |
Family
ID=31858273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11087190U Pending JPH0467347U (en) | 1990-10-23 | 1990-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467347U (en) |
-
1990
- 1990-10-23 JP JP11087190U patent/JPH0467347U/ja active Pending
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